DISCO Multifunctional Laser ORIGAMI XP

I-DISCO ORIGAMI XP ayikho i-laser enye, kodwa i-laser ephezulu yokuphela kwenkqubo yokuchaneka kwe-laser edibanisa umthombo we-laser, ukulawula ukunyakaza, indawo ebonakalayo kunye nesofthiwe ehlakaniphile, kwaye yenzelwe ngokukodwa iimfuno ze-micro-processing ze-semiconductor, i-electronics kunye namanye amashishini. Oku kulandelayo luhlalutyo lwelizwi lweempawu zalo eziphambili:

1. I-Essence: I-multifunctional laser processing platform

Ayisiyo i-laser ezimeleyo, kodwa iseti epheleleyo yezixhobo zokusebenza, kubandakanya:

Umthombo weLaser: inketho eqhelekileyo (UV) nanosecond laser (355nm) okanye infrared (IR) picosecond laser (1064nm).

Iqonga lentshukumo yokusebenza: i-nanometer-level positioning (±1μm).

Inkqubo yokubonwa kwe-AI: ukuchongwa okuzenzekelayo kunye nokuhlelwa kweendawo zokucwangcisa.

Isoftware ekhethekileyo: ixhasa inkqubo entsonkothileyo yendlela kunye nokubeka iliso ngexesha lokwenyani.

2. Imisebenzi engundoqo

(1) Ukulungiswa kokuchaneka okuphezulu

Ukulungiswa kokuchaneka: ± 1μm (ilingana ne-1/50 yeenwele).

Ubuncinci besayizi yesici: ukuya kuthi ga kwi-5μm (njenge-microholes kwi-chips).

Izinto ezisebenzayo: i-silicon, iglasi, iiseramics, iPCB, iisekethe eziguquguqukayo, njl.

(2) Ukuhambelana kweenkqubo ezininzi

Ukusika: ukusika i-wafer kwangoko (akukho kutshiphu), ukusika kweglasi epheleleyo.

Okuncinci: imingxuma encinci (<20μm), imingxuma eyimfama (njenge-TSV silicon ngokusebenzisa imingxuma).

Unyango lomphezulu: ukucocwa kwe-laser, ukulungiswa kwe-microstructure (njengamacandelo optical).

(3)Ulawulo oluzenzekelayo

I-AI yokuma okubonakalayo: ukuchongwa ngokuzenzekelayo kweendawo zokumakisha, ukulungiswa kokuphambuka kwendawo yezinto eziphathekayo.

Ukucutshungulwa kwe-Adaptive: ukulungelelaniswa kwexesha langempela leeparamitha ze-laser ngokobuninzi bezinto eziphathekayo / ukubonakalisa.

3. Amagqabantshintshi obugcisa

Iimpawu eziluncedo ORIGAMI XP Ukuthelekiswa nezixhobo zemveli

Ukukhetha i-Laser UV + IR ngokuzikhethela, ukuziqhelanisa nezixhobo ezahlukeneyo ngokuqhelekileyo ixhasa kuphela ubude obunye

Ulawulo lwempembelelo yeThermal Picosecond laser (phantse akukho monakalo wobushushu) Ilaser yeNanosecond ithanda ukukhupha izinto

Ukulayishwa ngokuzenzekelayo kunye nokukhulula + ulawulo oluvaliweyo lufuna ukungenelela ngesandla, ukusebenza okuphantsi

Isiqinisekiso sesivuno Ukufunyaniswa kwexesha lokwenyani + imbuyekezo ezenzekelayo Kuxhomekeke kwisampulu esenziwa ngesandla

4. Iimeko zesicelo esiqhelekileyo

I-Semiconductor: ukusika i-wafer (SiC / GaN), i-chip packaging (i-RDL wiring).

I-Electronics: I-PCB micro-hole array, i-flexible circuit (FPC) ukusika.

Iphaneli yokubonisa: ukusika okukhethekileyo kwesigubungelo seglasi yefowuni ephathwayo.

Unyango: ukuqhutyelwa ngokuchanekileyo kwe-stents ye-cardiovascular.

5. Kutheni ukhethe ORIGAMI XP?

Isisombululo esihlanganisiweyo: inkqubo eyongezelelweyo yokubeka/yokubona kufuneka ithengwe.

Isivuno esiphezulu: I-AI inciphisa abasebenzi njengezixhobo zokusebenza kwaye ifanele imveliso yobuninzi.

Ukuhambelana kwexesha elizayo: kunokuxhotyiswa ngeenkqubo ezintsha ngokuphucula umthombo welaser.

Isishwankathelo

I-DISCO ORIGAMI XP yinkqubo yokuzonwabisa ye-laser yokuzonwabisa kwimveliso ephezulu. Ixabiso layo eliphambili liku:

Ukuchaneka kuzityumza izixhobo zemveli (umphakamo).

Iqondo eliphezulu lokuzenzekelayo (ukusuka kwindawo yokumisa ukuya kwimisebenzi yokucubungula).

Ukuhambelana kwezinto ezibanzi (izixhobo ezinqabileyo + iintsimbi + iipolymers).