DISCO Laser ekola emirimu mingi ORIGAMI XP

DISCO ORIGAMI XP si layisi emu, wabula nkola ya layisi ey’omutindo ogwa waggulu ey’okukola obulungi ekwataganya ensibuko ya layisi, okufuga entambula, okuteeka mu kifo ekirabika ne pulogulaamu ez’amagezi, era nga ekoleddwa mu ngeri ey’enjawulo olw’obwetaavu bw’okukola micro-processing obw’amakolero ga semiconductor, ebyuma n’amakolero amalala. Wammanga kwe kwekenneenya eddoboozi ku bikulu ebigikwatako:

1. Essence: Enkola y’okukola layisi ekola emirimu mingi

Si layisi eyeetongodde, wabula ebyuma ebijjuvu ebikola, omuli:

Ensibuko ya layisi: layisi eya bulijjo (UV) eya nanosecond (355nm) oba infrared (IR) picosecond laser (1064nm) ey’okwesalirawo.

Operation motion platform: okuteekebwa ku ddaala lya nanometer (±1μm).

Enkola y’okulaba eya AI: okuzuula n’okutegeka ebifo eby’okukola mu ngeri ey’otoma.

Sofutiweya ow’enjawulo: awagira pulogulaamu y’amakubo enzibu n’okulondoola mu kiseera ekituufu.

2. Emirimu emikulu

(1) Okukola obulungi ennyo (Ultra-high precision processing).

Obutuufu bw’okukola: ±1μm (ekyenkana 1/50 y’enviiri).

Enkula y’ekintu ekitono ennyo: okutuuka ku 5μm (nga microholes ku chips).

Ebintu ebikozesebwa: silikoni, endabirwamu, seramiki, PCB, circuit ezikyukakyuka, n’ebirala.

(2) Okukwatagana kw’enkola eziwera

Okusala: okusala wafer mu bwangu (tewali kusalako), okusala endabirwamu enzijuvu.

Ebitono: ebituli ebitonotono (<20μm), ebituli ebizibe (nga TSV silicon through-holes).

Okujjanjaba kungulu: okuyonja layisi, okulongoosa microstructure (nga ebitundu by’amaaso).

(3)Okufuga mu ngeri ey’obwengula

AI visual positioning: okuzuula otomatika ebifo ebiteekebwako obubonero, okutereeza okukyama kw’ekifo ky’ebintu.

Adaptive processing: okutereeza mu kiseera ekituufu kwa laser parameters okusinziira ku material thickness/reflectivity.

3. Ebikulu mu by’ekikugu

Ebirimu Ebirungi bya ORIGAMI XP Okugeraageranya n’ebyuma eby’ekinnansi

Laser selection UV+IR optional, okutuukagana n’ebintu eby’enjawulo ebiseera ebisinga ewagira wavelength emu yokka

Okufuga okukuba kw’ebbugumu Layisi ya picosecond (kumpi tewali kwonooneka kwa bbugumu) Layisi ya nanosecond etera okuggyibwako ebintu

Okutikka n’okutikkula mu ngeri ey’obwengula + okufuga okuggaddwa (closed-loop control) kyetaagisa okuyingira mu nsonga mu ngalo, okukola obulungi okutono

Omusingo gw’amakungula Okuzuula mu kiseera ekituufu + okuliyirira mu ngeri ey’otoma Kisinziira ku kutwala sampuli mu ngalo

4. Ensonga eza bulijjo ez’okukozesa

Semiconductor: okusala wafer (SiC/GaN), okupakinga chip (RDL wiring).

Ebyuma: PCB micro-hole array, okusala kwa circuit ekyukakyuka (FPC).

Display panel: okusala mu ngeri ey’enjawulo ey’ekibikka ku ndabirwamu y’essimu.

Obusawo: okukola obulungi ku stents z’emisuwa n’emisuwa.

5. Lwaki olonze ORIGAMI XP?

Ekigonjoola ekigatta: enkola ey’okuteeka mu kifo/okulaba ey’enjawulo yeetaaga okugulibwa.

Amakungula amangi: AI ekendeeza ku bakozi ng’ebintu ebikolebwa era esaanira okukolebwa mu bungi.

Okukwatagana mu biseera eby’omu maaso: kuyinza okuteekebwamu enkola empya nga olongoosa ensibuko ya layisi.

Okubumbako

DISCO ORIGAMI XP nkola ya layisi ey’okuwummulirako ekola ebintu eby’omulembe. Omugaso gwayo omukulu guli mu:

Obutuufu bumenya ebyuma eby’ennono (μm level).

High degree of automation (okuva ku positioning okutuuka ku processing operations).

Okukwatagana kw’ebintu ebigazi (ebintu ebikutuka + ebyuma + polimeeri).