Imashini isya wafer ya DISCO DFG8560

Mu rwego rwo kuvugurura DFG800, DISCO DFG8560 ni imashini ikoresha uburyo bwose bwo gukata wafer. Yagenewe by'umwihariko guhangana n'ibibazo byo gukata wafer ya santimetero 12. Ihame ryayo ry'ingenzi rishingiye ku miterere y'udupira tubiri n'udupira dutatu, ikarangiza ibyiciro bya "rough grinding" na "fine grinding" by'uburyo bwo gukata wafer mu gikorwa kimwe cyo gukata wafer. Iyi miterere irushaho kunoza imikorere myiza no kugenzura neza.

**Ihame ry'imikorere**

DFG8560 igabanya umuvuduko wa wafer binyuze mu kugenda neza cyane:

**Imiterere Ikomeye:** Imashini ikoresha umugozi ufata umwuka uhamye cyane, bigatuma habaho ituze ryiza mu gihe cyose cyo gusya.

**Inzira yo Gusya mu Ntambwe Ebyiri:**

**Gusya mu buryo bukabije:** Umugozi wa mbere ukoresha ipine rinini cyane (urugero, ipine rya diyama riboheshejwe na resin). Guhinduranya umuvuduko mwinshi bikuraho vuba ibikoresho byinshi inyuma y'umugozi, bigatuma imikorere irushaho kuba myiza.

**Gusya neza:** Ipine ya kabiri ikoresha ipine yoroheje (urugero, ipine ya diyama ifatanye na ceramic) mu gusya neza ipine. Iyi nzira ituma ubuso burushaho kuba bwiza kandi burambuye kandi igakuraho urwego rwangiritse rwakozwe mu gihe cyo gusya cyane.

Mu gihe cyo gukora, wafer ifatwa ku gacupa kazunguruka hakoreshejwe uburyo bwo gukurura umwuka. Agacupa kazunguruka mu cyerekezo gitandukanye n'uruziga rusya rwihuta cyane; uruziga rumanuka ruhagaze, rukata ubuso bwa wafer.

**Ibiranga by'ingenzi**

Inshingano y'ingenzi ya DFG8560 ni ugucukura wafer. Muri urwo rwego, ihuza urukurikirane rw'imirimo y'ingenzi:

**Imikorere Yikora:** Ibi bikoresho bikora mu buryo bwikora kuva ku gupakira, guhuza, gusya, gusukura kugeza ku gupakurura, bigabanya cyane uburyo bwo gukoresha intoki no kunoza imikorere myiza.

**Kugenzura Ubunini Bwuzuye:** Binyuze mu gushyiramo sisitemu yo gupima ubunini buri hejuru (0.1 μm) kuri interineti, ibikoresho bigenzura uburyo bwo gusya, bikerekana ko ubunini bwa wafer bumeze neza.

**Gutunganya Wafer Iciriritse Cyane:** Mu kunoza uburyo bwo gusya no gutunganya, DFG8560 ishobora gutunganya wafer iciriritse cyane ifite ubugari bwa μm 100 cyangwa munsi yayo, mu gihe bigabanya ibyago byo kuvunika kwa wafer.

**Gutahura neza inenge:** Ubu buryo bushobora kumenya inenge ku buso bwa wafer, bugatanga inkunga y'amakuru akenewe mu bikorwa byo gusana cyangwa gutanga ibitekerezo ku buryo bukurikira.

**Interface Yoroshye Gukoresha:** Ifite LCD yo mu bwoko bwa ecran na interface y'umukoresha (GUI), sisitemu yerekana uburyo ibikoresho bitunganywa n'uko bihagaze mu gihe nyacyo, bigatuma imikorere n'imicungire byoroha kandi byoroshye kubikoresha.

**Guhuza no Kwagura kuri interineti:** DFG8560 ishobora gushyirwa mu buryo butagorana mu mikorere ikora mu buryo bwikora, nka:

**Sisitemu ya DBG (Post-Die Grinding):** Ihuza uburyo bwo gukata no gukata, bigatuma iba nziza cyane mu gukora uduce duto cyane.

**Imashini itunganya impumuro yumye (urugero, DFP8160):** Ikora uburyo buhuriweho bukora impumuro yumye nyuma yo gusya, ikagabanya ubukana bw'ubuso bw'imashini (agaciro ka Ry) kandi ikavanaho ibyangiritse biterwa no gusya.

**Wafer Laminator/Stripper:** Yahujwe kugira ngo ishyireho cyangwa ikureho firime zo gusiga zirinda, bigatuma habaho imikorere yuzuye yikora.

**Itumanaho rya SECS/GEM:** Iki gikoresho gishyigikira protocole y'itumanaho rya SECS/GEM, gifasha guhuza Sisitemu yo Gutunganya Uruganda (MES) kugira ngo ikurikiranwe kure kandi ibone amakuru akorwa mu buryo bwikora.

**Imikorere n'Ikoreshwa:**

Inshingano y'ibanze ya DFG8560 ni uguha wafers ubugari bumwe n'ubwiza bw'ubuso bwiza mu bikorwa bikurikira nko gukata no gupfunyika; imikoranire yayo mu bikoresho byagutse inatuma ikoreshwa mu buryo butandukanye.

**Gugabanya ubunini bwa wafer:** Kugabanya ubunini bwa wafer uhereye ku bunini bwayo bwa mbere ukagera ku bunini bukenewe—ni ikintu cy'ingenzi gisabwa hafi ya byose.

**Gukuraho Uduce twangiritse:** Gukuraho uduce twangiritse bitewe n'imihangayiko twaturutse mu nzira zo hejuru (nk'imashini isya inyuma)—intambwe y'ingenzi mu kwemeza imbaraga za mashini.

**Gutunganya Ubuso:** Gutanga substrate irambuye cyane kugira ngo habeho imikorere ijyanye n'ubuhanga (nk'ifotolithography no guhuza)—ni ngombwa kugira ngo habeho ikoranabuhanga rigezweho.

**Gupakira mu buryo bwa 3D no Gushyiramo TSV:** Gutanga uduce duto dukenewe kugira ngo ikoranabuhanga rya Through-Silicon Vias (TSV) rigerweho neza no gushyira ahagaragara neza imiterere ya TSV—igice cy'ingenzi cy'udupfunyika duhanitse.

Gukora Ibikoresho by'Ingufu na RF: Bikoreshwa mu kugabanya SiC, GaN, n'izindi wafer za semiconductor zivanze kugira ngo bigabanye ubushobozi bwo kwirinda no kunoza uburyo ubushyuhe bushira.

Gukora Ibikoresho by'Ikoranabuhanga n'Ifiriti: Bikoreshwa mu kugabanya no gushyira mu byiciro ibikoresho bikomeye kandi byoroshye nka safiro (LED substrate) na lithium tantalate/lithium niobate (RF filter).

Ibisobanuro birambuye

Ibisobanuro Ibisobanuro

Ingano y'ibikoresho bikoreshwa: Φ300 mm (inchi 12). Agace k'ibikoresho bikoreshwa mu gupfunyika gafite ubushobozi bwo gupfunyika bwa Φ200 mm/Φ300 mm.

Uburyo bwo gusya: Gusya mu buryo bworoshye mu gihe cyo gusya.

Imiterere y'umugozi: Imigozi ibiri (imigozi 2). Umugozi wubatswemo ukoresha moteri ukoresha umwuka uhoraho.

Imiterere ya Chuck Table: Ameza atatu ya chuck, hakoreshejwe sisitemu ya table izunguruka. Umuvuduko wa Chuck: 0-300 rpm.

Ingufu z'umugozi: Umusaruro utangwa ni 4.8 kW.

Umuvuduko w'umugozi: 1,000 - 4,000 min⁻¹ (rpm).

Urugendo rwa Z-axis: mm 120 (harimo n'aho rukomoka).

Igipimo cyo gusya icyuma gifata umugozi wa Z: 0.0001 - 0.08 mm/s (0.1 - 80 μm/s).

Ingendo ntoya ya Z-axis: 0.1 μm.

Ingano yo gupima ubunini: 0 - 1.800 μm.

Ubunini bw'igipimo: 0.1 μm.

Uburyo bwo gupima ubunini busubiramo: ± 0.5 μm.

Ibipimo by'uruziga rwo gusya: Uruziga rwo gusya rwa Φ300 mm rwa diyama.

Ubugari bw'umugozi (TTV): Munsi ya 3.0 μm (ukoresheje imbonerahamwe yihariye yo gukoreraho, wafer ya φ300 mm).

Ubugari bw'umurambararo hagati y'umurambararo: Munsi ya ± 3.0 μm.

Ubuso bumeze nabi nyuma yo kurangiza: Ry hafi 0.13 μm (ukoresheje urusinga #2000); Ry hafi 0.15 μm (ukoresheje urusinga #1400).

Ingano z'ibikoresho (Ubugari × Ubwiza × Ubugari): Hafi 1.400 × 3.190 × 1.800 mm.

Uburemere bw'ibikoresho: Hafi ibiro 4.000.

Ingufu zikenewe: Ingufu eshatu 200/220/380/400 V, 50/60 Hz, ingufu ntarengwa zikoreshwa hafi 22 kVA.

Umwanya ukenewe wo guhumeka: Hejuru ya 0.5 MPa, nta mavuta meza kandi nta ruhu, ikigero cy'urume kiri munsi ya -15℃, umuvuduko w'amazi uri hafi 1.000 NL/min.

Ibisabwa mu gutanga amazi: Amazi ya DI (amazi yakuwemo ioni), ubushyuhe 23±1℃, umuvuduko w'amazi ni 6-10 L/umunota.

Ibyiza by'ingenzi

DFG8560 ikomeje gukomeza ku isoko ryayo nk'igikoresho cyo kugabanya imashini zikoresha wafer gifite akamaro kanini, gifite ibyiza bikurikira:

Ubuhanga bwo gusya cyane: Binyuze mu miterere myiza, ubwiza bwo gusya burarushaho kunozwa, bigatuma habaho ubunini bwiza bwa intra-wafer (TTV) n'ubugari bwa intra-wafer, bigatuma habaho imikorere isaba imbaraga nyinshi nko gupakira mu buryo bugezweho.

Ubwiza bwo Gusya Buhamye: Ibipimo byo gusya no gukoresha neza bituma gusya wafer ihamye cyane, bikagenzura neza umuvuduko wo kwangirika, ibi bikaba ari ingenzi cyane ku ma-wafer manini afite agaciro kanini.

Uburyo bwo gupima ibintu mu buryo buhanitse: Itanga uburyo bwinshi bwo guhuza ibintu mu buryo buhuriweho (nk'imashini ya DBG na polishing yumye), ihindura uburyo bworoshye kugira ngo ivugurure umurongo w'umusaruro kandi irinde byimazeyo ishoramari ry'abakoresha.

Guhuza neza: Ishobora gukoresha ibikoresho bitandukanye (nka silicon, SiC, GaN, safiro, LT/LN), itanga uburyo bworoshye bwo gukora ibikoresho bitandukanye bya semiconductor na optoelectronic.

Yoroshye kuyikoresha kandi yoroshye kuyikoresha: GUI na ecran yoroshye kuyikoresha bigabanya cyane urugero rw'imikorere. Hagati aho, ibice by'ingenzi bishobora guhindurwa na serivise ya 800, bigabanya ikiguzi cyo kubika ibikoresho by'inyongera ndetse n'ingaruka zo kudakora.

Igishushanyo cyoroheje: Habayeho kugabanya uburemere bwa toni 1.0 (hafi 20%) mu gihe habungabungwa uburyo bwo gukora neza no gukoresha neza ibikoresho. Ibikoresho byoroheje byoroshya uburyo bwo gushyiraho no kugabanya ibisabwa mu gutwara imizigo ku ruganda.

Incamake y'Ibiranga Tekiniki: Igikombe cy'imitsi itatu gikozwe mu buryo bwa Dual-Axis: Gitandukanya gusya neza no gusya neza, kikabikora mu buryo bumwe bwo gufunga, kikanoza imikorere neza ariko kikanagenzura ko ari byiza.

Imashini ikoresha umwuka ugororotse: Ikoresheje imashini ikoresha umwuka ugororotse, iyi miterere ikuraho gukorana kwa mashini, bigatuma idasaza neza kandi igakomeza gukora neza mu gihe kirekire. Ni igice cy'ingenzi cyo kugera ku buhanga buhanitse cyane mu gukora imashini.

Ikoranabuhanga ryo guhuza ingingo ebyiri zo gusya: Iri koranabuhanga rituma impande ebyiri zisangira umwanya umwe wo gusya, rikuraho amakosa ya gahunda aterwa no kutagera ku murongo mwiza w’ingingo zo gutunganya. Ibi binongerera icyarimwe uburinganire bw’ubugari (TTV) muri wafer imwe n’ubugari hagati ya wafer, bigatuma iba ikoranabuhanga ry’ingenzi ryo kugera ku gusya guhamye cyane.

Incamake: Muri make, DISCO DFG8560 ni igisubizo cyuzuye cya santimetero 12 cya wafer cyagenewe gukorwa ku bwinshi. Ibiranga byayo by'ingenzi birimo imiterere yihariye y'udupira tubiri hamwe no kudahungabana kw'imikorere, bigatuma habaho imiterere ihanitse kandi ifite ubuziranenge mu gihe cyo gutunganya wafer nini kandi nto cyane, hamwe n'ubushobozi bukomeye bwo guhuza imikorere y'ibikoresho.