Imashini isya wafer ya DISCO DFG8830

DISCO DFG8830 ni imashini ikora ku buryo bwikora kandi isukura ibikoresho bikomeye kandi bitoroshye, yatangijwe na DISCO Corporation yo mu Buyapani. Intego yayo nyamukuru ni ukugabanya ibikoresho bikomeye kandi bitoroshye byo mu bwoko bwa semiconductor/optical nk'ibikomoka kuri SiC na safiro mu buryo bwiza kandi butangiza imikorere nka SiC na safiro. Ifite imiterere y'ibice 4, ifite imiterere 5, ihuza imikorere myiza n'ubuhanga buhanitse, bigatuma iba imashini ikoreshwa mu kugabanya ibikoresho bikomeye kandi bitoroshye byo mu bwoko bwa santimetero 15-18.

I. Imiterere y'ibanze n'ishyirwa mu bikorwa ry'ibintu

1. Aho inkingi y'ibanze iherereye

Imashini ikora isuku kandi igatunganya ibikoresho byikora ku buryo bwikora, yagenewe ibikoresho bikomeye kandi bitoroshye (SiC, safiro, ceramic, ikirahure, nibindi), ikemura ibibazo by’imikorere mibi, kwangirika cyane, no gutanga umusaruro muke w’ibikoresho gakondo.

2. Porogaramu zisanzwe

Semiconductors: Kugabanya amashanyarazi ya SiC/GaN (santimetero 6-8), kugabanya ibyuma bya safiro (LED chips).

Optique: Kugabanya ikirahuri cy'urumuri, substrates za ceramic, n'ibikoresho bya infrared.

Gupfunyika mu buryo bugezweho: Gugabanya uduce tw’ibumba dukoresheje ikirahure/icyuma gishyigikira (ubugari bwose ≤ 3.5mm).

3. Ingano zihuye

Wafers zatunganyijwe: Φ4/5/6 santimetero (ntarengwa Φ150mm).

Ibikoresho bishyigikira: santimetero Φ5/6/8 (bijyanye n'ibikoresho bya santimetero 8 bishyigikira ibigega bya santimetero 6).

II. Imiterere Rusange n'Imiterere y'Ishingiro

1. Imiterere rusange y'ubwubatsi

Imiterere: Imashini 4 zo gukurura + ameza 5 yo gukurura + ameza 1 azunguruka, ahuza inzira yose yo gupakira, gusya, gusukura, kumisha no gupakurura, itwara 3.5㎡ gusa, nto kandi ikora neza.

Ingano (Ubugari × Ubwiza × Ubwiza): 1400 × 2500 × 2000mm; Uburemere: Hafi 6000kg.

2. Ibice by'ingenzi

(1) Sisitemu y'izunguruka (imigozi 4, Z1-Z4)

Ingufu: Z1-Z3 ifite 6.3kW (uburinzi bwinshi, imbaraga nyinshi, ikwiriye imitwaro iremereye ku bikoresho bikomeye kandi byoroshye); Z4 ni umurongo urangira. Umuvuduko wo kuzenguruka: 1000-4000 min⁻¹ (ingufu zihoraho, ikwiriye gusya neza).

Uruziga rwo gusya: Uruziga rusanzwe rwa Φ300mm rwa diyama rusya (umurambararo munini, rushobora gukurwaho cyane, rukwiriye ibikoresho bikomeye kandi byoroshye kwangirika).

(2) Sisitemu yo gukora ku meza

Ameza 5 yo gukoresha mu gusukura ibikoresho byo mu bwoko bwa vacuum stick na ameza 1 azunguruka atuma habaho gutunganya ibintu icyarimwe no gukomeza gukora, hamwe na UPH (ubushobozi bwo hejuru ku isaha) inshuro eshatu z'ibikoresho bifite umurongo umwe (nka DFG8340).

Uburyo bwo gushyiramo umwuka mu cyuma gisukuye + uburyo bwo gushyiramo neza ±2μm butuma TTV (ubugari bwose) ya wafer nyuma yo kuyigabanya iba ≤2μm.

(3) Sisitemu yo kugenzura

Uburyo bwo gukora: Inzira ya touch GUI ya santimetero 15, ikoreshwa rishingiye ku gishushanyo, ishyigikira igenzura ry’igihe nyacyo, kubika ibipimo, n’intabaza zidasanzwe.

Imbere y'ubuyobozi: Servo ifite ubuziranenge bwo hejuru + umugozi ufunganye, ubunini bwo kugenzura ubuziranenge ± 0.1μm, ishyigikira kugabanya uburemere bwa micron (kugeza kuri 50μm). 3. Amasomo y'ingenzi

Uburyo bwo gusya: igabanywa ry'imirimo mu buryo bune (Z1 rough slag → Z2 medium slag → Z3 fine slag → Z4 polishing/finishing), kurangiza ibikorwa byinshi mu buryo bumwe, bigabanya kwangirika kw'uburyo bwo kuyikoresha.

Isuku n'Isukura: Gutera amazi meza + gukamisha umwuka nyuma yo gusya, nta bisigazwa cyangwa ibimenyetso by'amazi bisiga, byujuje ibisabwa mu isuku ya semiconductor.

Gupakira no gupakurura mu buryo bwikora: Udusanduku tw’ibikoresho bibiri (wafer 25 kuri buri gasanduku), kumenya wafer/substrate mu buryo bwikora, bigagabanya uburyo bwo gukoresha intoki.

III. Ihame ry'imikorere n'imigendekere y'ibikorwa

1. Ihame ryo gusya

Ikoresha uburyo bwo gusya wafer + uburyo bwo gusya mu buryo busanzwe: Wafer izenguruka ku muvuduko mwinshi hamwe n'ameza yo gukoreraho, kandi uruziga rwo gusya rwa diyama rugakwirakwira mu buryo bw'uruhande, rukuraho ibikoresho binyuze mu gukata cyane + gucikamo uduce duto. Ku bikoresho bikomeye kandi bicika, gukuraho fritter ni bwo buryo bw'ibanze, bwunganirwa no gukuraho pulasitiki, kugenzura ubujyakuzimu bw'imivuniko ≤5μm.

2. Inzira Isanzwe y'Inzira

Gupakira: Ukuboko kwa roboti gukura wafer mu gasanduku k'ibikoresho → kuyishyira mu mwanya wayo → kuyishyira mu cyuma gisukuye ku meza yo gukoreraho.

Gusya cyane (Z1): Igipimo cyo gukuraho kinini (50-100μm/min), bigabanya vuba kugeza ku bunini bwagenwe + 20μm.

Gusya Hagati (Z2): Igipimo cyo gukuraho hagati (20-50μm/min), bigabanya urwego rwangiritse kugeza ku bunini bwarwo + 5μm.

Gusya neza (Z3): Igipimo cyo gukuraho gito (5-10μm/min), TTV ≤ 2μm, urwego rwangiritse ≤ 2μm.

Gutunganya/Gutunganya ubuso (Z4): Indorerwamo irangi, ubukana bw'ubuso Ra ≤ 0.1μm.

Gusukura no Kumisha: Gusuka amazi meza → Gukamya umwuka wa ion → Gushyira mu gasanduku k'ibikoresho.

3. Gushyigikira inzira yo gutunganya substrate: Ihuza n'udupira tw'ibirahure/ceramic (ubugari bwose ≤ 3.5mm), kwinjizwa kwa substrate mu cyuma gisukuye birinda uruhande rw'imbere rwa wafer, bigasya uruhande rw'inyuma gusa, bigakemura ibibazo byo kugorama no kwangirika kwa wafers zoroshye cyane.

IV. Ibyiza by'ingenzi mu ikoranabuhanga

1. Guhuza neza n'ibikoresho bikomeye kandi bitoroshye

Ipine ifite imbaraga nyinshi (6.3kW) + umurambararo munini w'uruziga rwa diyama, yongera ubushobozi bwo gutunganya SiC/safire inshuro 3 kandi yongerera igihe cyo kumara amapine ku kigero cya 50%.

Uburyo bwo gusya bwangiritse gake: Urusobe rw'ibyangiritse ≤2μm, umusaruro ≥99%, rurenze cyane uburyo busanzwe bwo gusya.

2. Ubushobozi bwo gukora neza cyane (imigozi 4, ameza 5 yo gukoreramo)

Gutunganya ibintu icyarimwe: imishumi 4 ikora icyarimwe, ameza 5 yo gukoreraho ahora azenguruka, UPH≥ wafers 30 (santimetero 6 za SiC), inshuro 3 z'ibikoresho bifite umurongo umwe.

Ikoranabuhanga ryikora ku buryo bwikora: Gupakira, gupakurura, gusya, gusukura no kumisha; gukora amasaha 24 nta muntu ubyitayeho.

3. Ubuhanga bwo hejuru n'ubudahangarwa bwo hejuru

Ubunini: ± 0.1μm, TTV≤2μm, byujuje ibisabwa na wafer ya SiC yo mu rwego rw'imodoka.

Imiterere ikomeye: Ibyuma bikozwe mu cyuma + imiterere yo kudakoresha uburyo bwo guhindagura, guhindagura ≤0.5μm, nta guhindagura neza mu gihe cy'ikoreshwa ry'igihe kirekire. 4. Guhindura imiterere y'ibikoresho mu buryo bworoshye n'ikiguzi gito cyo gukora

Guhuza ibintu byinshi: Bijyanye n'udupira twa santimetero 6 n'udupira twa santimetero 8, bigatuma dukoreshwa mu buryo butandukanye kandi bikagabanya ishoramari mu bikoresho.

Gutunganya Isuku: Ikoresha amazi meza gusa, ikagabanya umwanda wo gusya; amazi mabi ashobora gusohoka mu buryo butaziguye, bigabanura ikiguzi cyo gukoresha ku kigero cya 30%.

V. Imbonerahamwe y'ibipimo by'ingenzi bya tekiniki

Agaciro k'ibipimo by'imbonerahamwe

Ingano ya Wafer yo gutunganya Φ4/5/6 santimetero (ntarengwa Φ150mm)

Ingano y'igice cyo hasi gishyigikiwe Φ5/6/8 santimetero

Umubare w'imigozi / Ingufu 4 axes, Z1-Z3: 6.3kW

Umuvuduko w'urushundura 1000-4000min⁻¹

Ibisobanuro by'uruziga rwo gusya Φ300mm diyama yo gusya

Ubuziranenge bwo kugenzura ubunini ± 0.1μm

TTV (Ubunini bwose bwo kunyuramo) ≤2μm

Ubukana bw'ubuso Ra≤0.1μm

Ubushobozi (santimetero 6 za SiC) UPH≥ wafers 30

Ingano rusange z'imashini (Ubugari × Ubwiza × Ubwiza) 1400 × 2500 × 2000mm

Uburemere: Hafi 6000kg

Ubuso bw'igorofa 3.5㎡

VI. Kugereranya n'ibikoresho bisa (DFG8830 vs DFG8340)

Igereranya ry'Imbonerahamwe Ikintu DFG8830 (imigozi 4, imbonerahamwe 5 z'akazi) DFG8340 (umurongo 1, icyiciro 2)

Imiterere y'umugozi: 4×6.3kW, igabanywa rya roughing/finishing/polishing: 1×4.2kW, process imwe

Ubushobozi: UPH≥wafers 30 (SiC ya santimetero 6), UPH≤wafers 10 (SiC ya santimetero 6)

Uburyo bwo gutunganya: TTV≤2μm, urwego rw'ibyangiritse≤2μm, TTV≤5μm, urwego rw'ibyangiritse≤5μm

Ibikoresho bikwiriye: SiC, safiro, wafers zivanze (zifite substrate), wafers za silikoni, ceramics zidakomera cyane

Umurage: 3.5㎡, 2㎡

Ingero zikoreshwa: Gukora ibikoresho byinshi, gukomera cyane no kwangirika; Ibikoresho bito, silicon wafers/ibikoresho bidakomera cyane

VII. Incamake n'agaciro k'inganda

DISCO DFG8830, ifite imiterere yayo ya 4-axis, 5-stage, spindle ifite imbaraga nyinshi, hamwe n'uburyo bwo kwangirika guke, yabaye igikoresho cy'ingenzi cyo kugabanya ibyuma bya semiconductor byo mu gisekuru cya gatatu (SiC/GaN) na safiro optique, ikemura ibibazo by'inganda birimo imikorere mike, kwangirika gukomeye, no gutanga umusaruro muke mu gutunganya ibikoresho bikomeye kandi byoroshye. Mu nzego nk'imodoka nshya zikoresha ingufu, itumanaho rya 5G, n'amatara ya LED, DFG8830 ifasha ibikoresho by'amashanyarazi bya SiC na chips za safiro za LED kugera ku musaruro mwinshi, igatuma inganda za semiconductor zigera ku cyuho kinini, imiterere mito, no gukora neza.