Chopukusira cha DISCO DFG8830

DISCO DFG8830 ndi makina opangidwa okha ochepetsera ndi kupukuta zinthu zolimba komanso zosweka, omwe adayambitsidwa ndi DISCO Corporation of Japan. Cholinga chake chachikulu ndi kuchepetsa zinthu zolimba komanso zosweka zomwe zimapezeka m'mibadwo itatu monga SiC ndi safiro pogwiritsa ntchito njira yothandiza komanso yothandiza. Ili ndi kapangidwe ka 4-axis, 5-stage, ndipo imagwira ntchito bwino kwambiri komanso molondola kwambiri, zomwe zimapangitsa kuti ikhale makina odziwika bwino ochepetsera ma wafer olimba komanso osweka a mainchesi 6-8.

I. Zochitika Zoyang'anira ndi Kugwiritsa Ntchito Pakati

1. Kuyika Pakati Pachimake

Makina opukutira ndi kupukuta okha opangidwa okha kuti agwiritsidwe ntchito pazinthu zolimba komanso zofooka kwambiri (SiC, safiro, ziwiya zadothi, galasi, ndi zina zotero), kuthetsa mavuto omwe amabwera chifukwa cha kusagwira bwino ntchito, kuwonongeka kwakukulu, komanso kusakhala ndi phindu lalikulu pa zipangizo zachikhalidwe.

2. Mapulogalamu Odziwika

Ma semiconductor: Kuchepetsa ma wafer amphamvu a SiC/GaN (mainchesi 6-8), kuchepetsa ma substrates a safiro (ma LED chips).

Optics: Kuchepetsa magalasi owonera, zinthu za ceramic, ndi zinthu za infrared.

Kupaka Patsogolo: Kuchepetsa ma wafer ophatikizika ndi magalasi/ceramic othandizira (kukhuthala konse ≤ 3.5mm).

3. Makulidwe Ogwirizana

Ma Wafer Okonzedwa: Φ4/5/6 mainchesi (kutalika Φ150mm).

Ma Substrate Othandizira: Φ5/6/8 mainchesi (ogwirizana ndi ma substrate a mainchesi 8 othandizira ma wafer a mainchesi 6).

II. Kapangidwe Konse ndi Kapangidwe ka Pakati

1. Kapangidwe Konse

Kapangidwe: Ma spindles 4 + matebulo 5 a chuck + tebulo limodzi lozungulira, kuphatikiza njira yonse yokwezera, kupera, kuyeretsa, kuumitsa, ndi kutsitsa, kutenga 3.5㎡ yokha, yaying'ono komanso yothandiza.

Miyeso (W×D×H): 1400×2500×2000mm; Kulemera: Pafupifupi 6000kg.

2. Zigawo Zapakati

(1) Dongosolo la Spindle (ma axes anayi, Z1-Z4)

Mphamvu: Z1-Z3 ndi 6.3kW (kulimba kwambiri, mphamvu yayikulu, yoyenera katundu wolemera pazinthu zolimba komanso zofooka); Z4 ndiye mzere womaliza. Liwiro lozungulira: 1000-4000 min⁻¹ (mphamvu yotuluka nthawi zonse, yoyenera kupukutidwa mopanda mphamvu).

Gudumu lopera: Gudumu lopera la diamondi la Φ300mm (lalikulu m'mimba mwake, lotha kuchotsa mwachangu, loyenera zipangizo zolimba komanso zosweka).

(2) Dongosolo la tebulo logwirira ntchito

Matebulo 5 ogwiritsira ntchito kapu yopopera vacuum ndi tebulo limodzi lozungulira zimathandiza kuti ntchito yogwirira ntchito ichitike mofanana komanso mosalekeza, ndi UPH (mphamvu yapamwamba pa ola limodzi) katatu kuposa zida za single-axis (monga DFG8340).

Kulowetsedwa kwa vacuum + kulondola kwa malo ±2μm kumatsimikizira kuti TTV (kusiyana konse kwa makulidwe) kwa wafer pambuyo pochepa ndi ≤2μm.

(3) Dongosolo lolamulira

Mawonekedwe Ogwirira Ntchito: 15-inch touch GUI, ntchito yochokera ku zizindikiro, imathandizira kuyang'anira nthawi yeniyeni, kusungira magawo, ndi ma alarm osazolowereka.

Chigawo chowongolera: Servo yolondola kwambiri + kuzungulira kotsekedwa, makulidwe olondola owongolera ± 0.1μm, imathandizira kuchepetsedwa kwa micron (mpaka 50μm). 3. Ma Key Modules

Gawo Lopera: Kugawa ntchito mozungulira 4-axis (Z1 rough grinding → Z2 medium grinding → Z3 fine grinding → Z4 polishing/finishing), kumaliza njira zingapo mu clamping imodzi, kuchepetsa kuwonongeka kwa ntchito.

Gawo Loyeretsera ndi Kuumitsa: Kupopera madzi oyera + kuumitsa mpweya wa ma ion mukamaliza kupukutira, osasiya zotsalira kapena zizindikiro za madzi, kukwaniritsa zofunikira za ukhondo wa semiconductor.

Kuyika ndi Kutsitsa Zokha: Mabokosi awiri a zinthu (ma wafer 25 pa bokosi lililonse), kuzindikira ma wafer/substrate okha, kuchepetsa kugwiritsa ntchito ndi manja.

III. Mfundo Yogwirira Ntchito ndi Kayendedwe ka Njira

1. Mfundo Yopera

Imagwiritsa ntchito njira yozungulira wafer + njira yopukutira mkati mwa chakudya: Wafer imazungulira mofulumira kwambiri ndi tebulo logwirira ntchito, ndipo gudumu lopukutira la diamondi limadya mozungulira, kuchotsa zinthu kudzera mu kudula kowawa + kusweka pang'ono. Pazinthu zolimba komanso zosweka, kuchotsa zosweka ndiyo njira yoyamba, yowonjezerapo kuchotsa pulasitiki, kuwongolera kuya kwa ming'alu ≤5μm.

2. Kuyenda Kwabwino kwa Njira

Kutsegula: Dzanja la roboti limatenga wafer kuchokera m'bokosi la zinthu → limayiyika → vacuum imaiyika patebulo logwirira ntchito.

Kupera Kolimba (Z1): Kuchotsa mwachangu (50-100μm/min), kumachepetsa msanga mpaka makulidwe oyenera + 20μm.

Kupera Kwapakati (Z2): Kuchotsa kwapakati (20-50μm/min), kuchepetsa kuonongeka kwa wosanjikiza kufika pa makulidwe a cholinga + 5μm.

Kupera Kosalala (Z3): Kuchotsa kotsika (5-10μm/min), TTV ≤ 2μm, wosanjikiza wowonongeka ≤ 2μm.

Kupukuta/Kumaliza Pamwamba (Z4): Kumaliza pagalasi, kukhwima kwa pamwamba Ra ≤ 0.1μm.

Kuyeretsa ndi Kuumitsa: Kuthira madzi oyera → kuumitsa mpweya wa ayoni → kutsitsa zinthu m'bokosi la zinthu.

3. Thandizani Kuyenda kwa Substrate Processing: Imasintha kukhala ma wafers a galasi/ceramic substrate (makulidwe onse ≤ 3.5mm), kulowetsedwa kwa vacuum kwa substrate kumateteza mbali yakutsogolo ya wafer, kupukusa mbali yakumbuyo yokha, kuthetsa mavuto opindika ndi kusweka kwa ma wafers owonda kwambiri.

IV. Ubwino Waukulu wa Ukadaulo

1. Kusinthasintha Kwambiri ku Zipangizo Zolimba ndi Zosalimba

Spindle yamphamvu kwambiri (6.3kW) + gudumu lopukusira la diamondi lalikulu, zomwe zimawonjezera mphamvu yokonza SiC/safiro ndi katatu ndikuwonjezera moyo wa gudumu ndi 50%.

Njira yopera yosawonongeka kwambiri: Gawo lowonongeka ≤2μm, phindu ≥99%, kuposa njira zachikhalidwe zolumikizirana.

2. Mphamvu yopangira zinthu moyenera (nkhwangwa 4, matebulo 5 ogwirira ntchito)

Kukonza zinthu motsatizana: ma axes 4 akugwira ntchito nthawi imodzi, matebulo 5 ogwirira ntchito akuzungulira mosalekeza, ma wafers a UPH≥30 (6-inch SiC), kuwirikiza katatu kuposa zida za single-axis.

Yokha yokha: Kuyika zinthu, kutsitsa, kupukuta, kuyeretsa, ndi kuumitsa pamodzi; kugwira ntchito mosalekeza kwa maola 24 popanda kuyang'aniridwa.

3. Kulondola kwambiri komanso kukhazikika kwambiri

Kuwongolera makulidwe: ± 0.1μm, TTV≤2μm, kukwaniritsa zofunikira za SiC wafer yamagalimoto.

Kapangidwe kolimba: Thupi lachitsulo lopangidwa ndi chitsulo + kapangidwe ka kugwedezeka kwa kugwedezeka, kugwedezeka ≤0.5μm, palibe kugwedezeka kolondola panthawi yogwira ntchito kwa nthawi yayitali. 4. Kusinthasintha Kosinthika ndi Ndalama Zotsika Zogwirira Ntchito

Kugwirizana kwa Makulidwe Ambiri: Kugwirizana ndi ma wafer a mainchesi 6 ndi ma substrates a mainchesi 8, zomwe zimathandiza kugwiritsa ntchito zinthu zosiyanasiyana komanso kuchepetsa ndalama zomwe zimagwiritsidwa ntchito pazida.

Kukonza Kobiriwira: Kumagwiritsa ntchito madzi oyera okha, kuchotsa kuipitsa kwa matope oyeretsera; madzi otayira amatha kutulutsidwa mwachindunji, zomwe zimachepetsa ndalama zogwirira ntchito ndi 30%.

V. Tebulo la Ma Parameters Ofunikira a Ukadaulo

Mtengo wa Ma Parameter a Tebulo

Kukula kwa Wafer Φ4/5/6 mainchesi (pazipita Φ150mm)

Thandizani Substrate Kukula Φ5/6/8 mainchesi

Chiwerengero cha Ma Spindles / Mphamvu 4 axes, Z1-Z3: 6.3kW

Liwiro la Spindle 1000-4000min⁻¹

Kufotokozera kwa Wheel Yopukutira Φ300mm Diamondi Yopukutira

Kulondola kwa Kuwongolera Makulidwe ± 0.1μm

TTV (Kupatuka Konse kwa Makulidwe) ≤2μm

Kukhwima kwa pamwamba Ra≤0.1μm

Kutha (6-inch SiC) UPH≥30 ma wafer

Miyeso Yonse ya Makina (W×D×H) 1400×2500×2000mm

Kulemera pafupifupi 6000kg

Malo Okhala Pansi 3.5㎡

VI. Kuyerekeza ndi Zida Zofanana (DFG8830 vs DFG8340)

Kuyerekeza kwa Tebulo Chinthu DFG8830 (ma axes 4, matebulo 5 ogwirira ntchito) DFG8340 (1-axis, 2-stage)

Kapangidwe ka spindle: 4 × 6.3kW, kugawa kozungulira/kumaliza/kupukuta: 1 × 4.2kW, njira imodzi

Kutha: Ma wafer a UPH≥30 (6-inch SiC), UPH≤10 ma wafer (6-inch SiC)

Kulondola kwa kukonza: TTV≤2μm, gawo lowonongeka≤2μm, TTV≤5μm, gawo lowonongeka≤5μm

Zipangizo zoyenera: SiC, safiro, ma wafer ophatikizika (okhala ndi substrate), ma wafer a silicon, zoumba zouma pang'ono

Cholowa: 3.5㎡, 2㎡

Zochitika zothandiza: Kupanga zinthu zambiri, kuuma kwambiri komanso kusweka; Zidutswa zazing'ono, ma wafer a silicon/zipangizo zouma pang'ono

VII. Chidule ndi Mtengo wa Makampani

DISCO DFG8830, yokhala ndi mapangidwe ake a 4-axis, 5-stage, high-power spindle, komanso njira yochepetsera kuwonongeka, yakhala chida choyesera kuchepetsa ma semiconductors a m'badwo wachitatu (SiC/GaN) ndi ma substrates a safiro, kuthetsa mavuto amakampani omwe ndi osagwira ntchito bwino, kuwonongeka kwakukulu, komanso kukolola kochepa pokonza zinthu zolimba komanso zofooka. M'magawo monga magalimoto atsopano amphamvu, kulumikizana kwa 5G, ndi kuwala kwa LED, DFG8830 imathandiza zida zamagetsi za SiC ndi ma chips a safiro a LED kuti apange zinthu zambiri, zomwe zimapangitsa makampani opanga ma semiconductor kukhala ndi bandgap yayikulu, ma profiles owonda, komanso magwiridwe antchito apamwamba.