Umatshini wokubumba weTowa CPM1180

Indawo ephambili yeTowa CPM1180 icacile: yinkqubo yokubumba yoxinzelelo eyenzelwe ngokukodwa ukuveliswa ngobuninzi kweePakethe zePaneli ezinkulu (i-PLP). Injongo yayo ephambili yoyilo kukusombulula umngeni obalulekileyo kushishino kwicandelo lokupakisha eliphambili: "indlela yokupakisha ii-substrates ezinkulu ngokufanelekileyo nangendlela engabizi kakhulu."

**CPM1180: Imigaqo yoBugcisa kunye noLwakhiwo**

Isiseko seCPM1180 kukho ubuchwepheshe beCompression Molding—inkqubo eyahlukileyo ngokupheleleyo kwinkqubo ye-Injection Molding esetyenziswe kuthotho lwe-Y oluxoxwe ngalo ngaphambili:

**Ukubumba ngoxinzelelo:** Kule nkqubo, i-resin elulwelo okanye e-granular ifakwa kuqala kwindawo yokubumba; iitships okanye i-substrate emva koko zifakwa kwi-resin, zicinezelwe, kwaye zinyangwe. Le nkqubo ibonisa iingenelo ezicacileyo njengoko ubukhulu bepakethe bukhula, ikhusela ngokufanelekileyo iingcingo zegolide ezithambileyo kwaye iqinisekisa ukugqunywa okungenamsebenzi.

**Uyilo oluPhambili lweSakhiwo:** Le nkqubo isebenzisa isakhiwo esinelungelo lobunikazi esithi "Cavity Down". Ngamafutshane, olu yilo lubeka umngxuma wesikhunta (umphezulu wokubumba) ujonge ezantsi ngexesha lenkqubo yokugquma. Olu lwakhiwo lusebenzisa ngokufanelekileyo amandla adonsela phantsi ukuze luncede ukuhamba kweresin ukusuka phezulu ukuya ezantsi, ngaloo ndlela luqinisekisa ukufana okugqwesileyo kokusasazwa kweresin kuzo zonke ii-substrates ezinkulu—ubuchule obuphambili betekhnoloji obubalulekileyo ekufezekiseni iziphumo zokubumba ezikumgangatho ophezulu.

**CPM1180: Izinto ezibalulekileyo ezisebenzayo**

Ixabiso le-CPM1180 libonakaliswa ngcono ngeempawu eziphambili ezininzi, ingakumbi amandla ayo aphambili malunga nobukhulu bephaneli kunye nomphumo wokucubungula.

**Ubuchule bokuPakisha obuKhulu kakhulu (Inzuzo ePhambili):** Oku kuyinxalenye ephambili yeCPM1180. Le nkqubo ixhasa ukucutshungulwa kwe-substrate ngokuzenzekelayo ukuya kuthi ga kubukhulu obuphezulu be-625mm x 620mm. Olu buchule aludluli nje kuphela kwiinkcukacha ze-320mm x 320mm ze-CPM1080 yangaphambili, kodwa lukwavumela ukubumba ii-wafers eziyi-18-intshi (450mm). Ngaphezu koko, kwiindlela ezenziwe ngesandla okanye ezizenzekelayo, le nkqubo inokwamkela ii-substrates ezinkulu nangakumbi, ifikelela kubukhulu obufikelela kwi-660mm x 620mm. Ngokufaka indawo enkulu ye-substrate kumjikelo omnye—ngaloo ndlela kwandisa inani lee-chips eziveliswayo ngeyunithi yexesha—le nkqubo ifikelela ekunciphiseni okukhulu kwixabiso nge-chip nganye.

**Ukupakisha Okuchanekileyo Nokusemgangathweni:** Ngokudibanisa okusebenzisanayo kwesakhiwo se-"Cavity Down" kunye nendlela efanayo yokukhupha i-resin ene-granular, inkqubo ifumana uphuculo olukhulu kumgangatho wokubumba kunye nokuzinza kwenkqubo.

**Uyilo lweModular:** Le nkqubo inoyilo lweModular oluvumela uhlengahlengiso lomthamo oluguquguqukayo ngokongeza okanye ukususa iimodyuli, ngaloo ndlela inika ukuguquguquka okuphuculweyo kokumiselwa ukuhlangabezana neemfuno ezahlukeneyo zemveliso. Ukulahleka okuphantsi kwezinto kunye neMveliso ecocekileyo: Izixhobo zisebenzisa iifilimu zokwahlulahlula ezisikiweyo kwangaphambili; xa kuthelekiswa neemveliso zangaphambili, olu yilo lugcina malunga ne-25% kwizinto ezisetyenziswayo kumjikelo ngamnye wokubumba kwaye luvumela ukuveliswa kwenkunkuma ephantse ingabikho ngexesha lenkqubo yokubumba, nto leyo eyenza ukuba ibe nobuhlobo kakhulu nokusingqongileyo.

Iinkcukacha ezingundoqo zeeModeli zeCPM1180 Series

Njengeqonga lemveliso elivuthiweyo, i-CPM1180 inikezela ngeendlela ezahlukeneyo zokumisela ezilungiselelwe ukuhlangabezana neemfuno ezahlukeneyo—ukusuka kwi-R&D kunye ne-prototyping ukuya kwimveliso enkulu. Ndiqokelele izakhono eziphambili zemodeli nganye kwitheyibhile elandelayo ukuze kube lula ukuthelekisa ngokukhawuleza:

Imodeli yeZixhobo | Imo yokusebenza | Iimpawu eziphambili | Ubungakanani obukhulu beSubstrate | Imeko eqhelekileyo yokusetyenziswa

CPM1180

(Ngokuzenzekelayo Ngokupheleleyo) | Ngokuzenzekelayo Ngokupheleleyo | Ukubumba okuzenzakalelayoyo kwezinto ezinkulu kakhulu, isakhiwo "seCavity Down", unikezelo lwe-resin oluzenzekelayo | 625mm x 620mm | Imveliso enkulu yobunzima bokuPakisha iPhaneli (PLP)

CPM1180

(Okuzenzekelayo Okuncinci) | Okuzenzekelayo Okuncinci | Ukubumba ii-substrates ezinkulu kakhulu, ukunciphisa iindleko eziguqukayo, ukubonelela nge-resin ezenzekelayo, ukulayisha i-substrate ngesandla | 660mm x 620mm | Ukuveliswa kweepaneli ezinkulu, ukulinganisela ukusebenza kakuhle kweendleko kunye nokuguquguquka kokusebenza

CPM1180

(Isandla) | Isandla | Amandla emisebenzi emibini (i-wafer/iphaneli enkulu), ukusebenza kakuhle kweendleko, imveliso yokuxuba okuphezulu/umthamo ophantsi, ukulayisha ngesandla zombini ii-substrates kunye nee-wafer | 625mm x 620mm (Iphaneli) /

φ450mm (Iwafer) | Ukubumba iiwafers eziyi-18-intshi, i-R&D prototyping, imveliso yeqela elincinci

Qaphela: "Ubungakanani be-Substrate obukhulu" obudweliswe kwitheyibhile bumele iinkcukacha ezisemthethweni. Umahluko wedatha unokubakho phakathi kweemodeli ezithile ngenxa yokwahluka kwiinkqubo ezithile okanye imigangatho yokulinganisa; ke ngoko, iinkcukacha zokugqibela kufuneka ziqinisekiswe ngokubonisana ngqo.

Imeko zesicelo kunye neenzuzo ezizodwa

I-CPM1180 yenzelwe ngokukodwa ukujongana neengxaki ezibalulekileyo zoshishino, kwaye ixabiso layo libonakaliswa ngokucacileyo kwiimeko ezithile zesicelo:

Ukujolisa kwiPakethe yeSizukulwana Esilandelayo: Esi sixhobo senzelwe ukusetyenziswa ngabavelisi bepaneli ze-substrate, kwaye inzuzo yaso ephambili ikukunceda ishishini "liqhubele phambili itekhnoloji yokupakisha ngelixa ngaxeshanye linciphisa iindleko."

Ukujongana ngqo nemingeni yeWarpage: Ngexesha leenkqubo zokupakisha kwindawo enkulu, ii-substrates—ezifana neenkampani ezinkulu ze-FOWLP (Fan-Out Wafer-Level Packaging) okanye i-PLP—zinokuchaphazeleka lula. Ukulayisha ngesandla ngumsebenzi onzima; nangona kunjalo, imodeli ye-CPM1180 ezenzekelayo ngokupheleleyo ifezekisa ukuphathwa kwezinto okuzinzileyo, okuzenzakalelayo ngenkqubo yerobhothi ekhawulezayo, enobunkunkqele obuphezulu—ubuchule obusebenza njengesitshixo sokusombulula iingxaki ezibalulekileyo kwimveliso enkulu.

Isivuno sisisiseko: njengoko indawo yokupakisha isanda, ubunzima bolawulo lwesivuno buyanda ngokukhawuleza. Ulwakhiwo lwe-"Cavity Down" luqinisekisa ukuzaliswa kwe-resin efanayo kwiindawo ezinkulu, ngaloo ndlela kuthintela iziphene ezibulalayo ezifana nee-voids; okwangoku, uyilo lwemodyuli luqinisekisa ukuthembeka kwezixhobo ngexesha elide lokusebenza ngamandla aphezulu.

Indawo ejonge phambili: Ukusuka kwi-CPM1080 ukuya kwi-CPM1180

Ngokwembono yoluhlu lweemveliso, i-CPM1180 inokujongwa "njengohlobo olukhulu" lwe-CPM1080, ithwala umsebenzi obalulekileyo wokuvumela ukuveliswa ngobuninzi kweePanel-Level Packages (PLP) kwiklasi ye-625mm x 620mm. Ukongeza koku, uthotho lwe-CPM lukwabonisa i-"CPM1080-HP" kwizinga eliphezulu—imodeli eyenzelwe ngokukodwa ukujongana neemfuno zobuchwepheshe bokupakisha obuhlukeneyo obuphambili, njenge-HBM, 2.5D, 3D, kunye neChiplets.

Ngenxa yoko, kwiTowa, indawo ebekwe kuyo i-CPM1180 yahlukile kakhulu kweye-CPM1080-HP: le yokugqibela izinikele ekoyiseni imiqobo yobugcisa enxulumene ngokuchanekileyo enxulumene neetekhnoloji zemida ezifana neeChiplets, ngelixa i-CPM1180 igxile ngokukodwa ekwenzeni imveliso enkulu nengabizi kakhulu ngaphakathi kwe-PLP domain.

Isishwankathelo

Ukuqukumbela, iTowa CPM1180 yinkqubo yokubumba yoxinzelelo eyenzelwe ngokukodwa ukuveliswa kobunzima obulinganiselweyo beePakethe zePaneli ezinkulu (i-PLP). Ngeentsika ezintathu zobuchwepheshe eziphambili—ubuchule bokupakisha i-substrate enkulu kakhulu, isakhiwo seCavity Down, kunye nokusabalalisa i-resin efanayo—isombulula ngempumelelo imingeni yokusebenza kakuhle, umgangatho, kunye nokuvelisa imveliso ekwi-big-format packaging.