Umatshini wokubumba weTowa CPM1080

I-Towa CPM1080 yinkqubo yokubumba yoxinzelelo yokupakisha i-semiconductor ephucukileyo, idunyiswa njengesisombululo esitsha "sokuchaneka okuphezulu kunye nemveliso ephezulu kwiinkqubo zokubumba ze-WLP/PLP."

Itekhnoloji yayo ephambili, "ukubumba ngokucinezela," yahluke kakhulu kwi-"transfer molding" yendabuko: Ukubumba ngokucinezela kubandakanya ukubeka i-resin elulwelo okanye i-granular kwi-mold, emva koko untywilisele i-chip okanye i-substrate kwi-resin uze uyicinezele kwaye uyilungise.

Iingenelo: Ikhusela ngokufanelekileyo iingcingo zegolide, igcwalisa ezantsi, iphephe izithuba, kwaye yonga iindleko.

I-CPM1080 liqonga eliquka amanqanaba ahlukeneyo okwenziwa ngokuzenzekelayo ukuze kuhambelane neemfuno zabathengi abahlukeneyo kunye nezigaba zemveliso. Iimodeli eziphambili zithelekiswa ngezantsi: Iinkcazo zeCPM1080 Series Equipment Core kunye neempawu

**Imodeli yezixhobo**

**Iimpawu Eziphambili**

**Izakhono zeNkqubo**

**Izicelo ezifanelekileyo**

**Ukwenziwa kwezinto ngokuzenzekelayo kunye nobungakanani**

**CPM1080-HP (Ubuchule obuphezulu)**

**Imodeli echanekileyo kakhulu ifanelekile kwiipakethe eziphambili ezifana ne-HBM/2.5D/3D/Chiplet.**

**Iphatha ukubumba iimveliso ezibhityileyo kakhulu/ezityebileyo kakhulu kunye nokuzaliswa kwe-MUF ezantsi.**

**I-HBM, i-2.5D/3D IC, iChiplet, kunye nezinye iindlela zokupakisha ezihlanganisiweyo ezisemgangathweni ophezulu.**

**I-mold flatness engaqhelekanga kunye ne-vacuum ephezulu kakhulu.**

**Uyilo lweModular luvumela ukongezwa okanye ukususwa kweemodyuli eziguquguqukayo ukuze zilungele utshintsho lomthamo.**

I-CPM1080 Ngokuzenzekelayo Ngokupheleleyo**

**Iqonga lemveliso elizenzekelayo ngokupheleleyo elifanelekileyo kwiinkqubo zokubumba ze-PLP/WLP ezikumgangatho ophezulu nezingabizi kakhulu.**

**Izixhobo zokuqala ze-Industry ziyahambelana nee-particle kunye nee-liquid resins.**

**Iimeko ezinkulu zemveliso ezifana ne-FOWLP (Fan-out Wafer-Level Packaging) kunye ne-PLP (Panel-Level Packaging).**

**Ixhotyiswe ngerobhothi yokuphatha eyenzelwe yona ekwaziyo ukuphatha izinto zokusebenza ezigobileyo okanye ezinzima.**

**Ixhotyiswe ngemisebenzi yokulinganisa i-resin ngokuzenzekelayo kunye nokugcwalisa kwakhona.**

I-CPM1080 Izenzekelayo Ngokupheleleyo** Inkqubo ye-CPM1080 ezenzekelayo inika ukuguquguquka kwi-R&D okanye kwimveliso yeqela elincinci. Ngumatshini wokuqala kushishino ohambelana nee-resin ze-granular kunye nezolwelo. Ixhasa i-12-intshi (φ300mm) FOWLP/FIWLP kunye ne-320mm x 320mm FOPLP/FIPLP. I-substrate ifuna ukuseta umqhubi ngesandla, kodwa i-resin inikezelwa ngokuzenzekelayo.

Iiteknoloji eziphambili kunye neenzuzo

Nokuba yeyiphi na imodeli ekhethiweyo, i-CPM1080 yabelana ngezi nzuzo zilandelayo zobuchwepheshe:

Itekhnoloji yokubumba ngoxinzelelo ephucukileyo: Isusa ngokupheleleyo ukutshayelwa kwentambo kunye namaqamza angaphakathi, abalulekileyo kwiintambo ezicolekileyo nezixineneyo. Xa kuthelekiswa nokubumba ngokudlulisa okuqhelekileyo, ifikelela ekusetyenzisweni kweresin phantse nge-100%, nto leyo evumela imveliso "engachithiyo".

Ukuhambelana kweresin okuphambili: Ngumatshini wokuqala kushishino osebenza ngaxeshanye ukucubungula ii-granular (eziyimpuphu) kunye nee-liquid resins kwiyunithi enye. Abavelisi banokukhetha ngokukhululekileyo izixhobo ezingabizi kakhulu okanye ezisebenza kakuhle ngokusekelwe kwiimpawu zemveliso, nto leyo ebonelela ngokuguquguquka okukhulu kwenkqubo.

Ukuphathwa kwezinto ezilawulwa ngokuchanekileyo: Zixhotyiswe ngerobhothi yokuphatha eyiyo yeTOWA, izixhobo zinokuphatha ngokuthembekileyo ii-substrates/iiphaneli ezinokugoba okukhulu ngenxa yokuncipha okanye ubunzima obukhulu, zijongana ngempumelelo nemingeni yenkqubo yokupakisha okukhulu.

Iindleko eziLungileyo kunye nokusetyenziswa kweFilimu: Inkqubo yayo yokusika ifilimu enelungelo lobunikazi igcina malunga ne-25% ekusetyenzisweni kwefilimu ekhutshwayo ngomjikelo ngamnye wokubumba, nto leyo enciphisa kakhulu iindleko zokusebenza kwimveliso yexesha elide.

IiParameters zeNkqubo eziPhambili: Iyakwazi ukuphatha ii-wafers ezifikelela kwi-300mm (ii-intshi ezili-12) ububanzi kunye neepaneli ezifikelela kwi-320×320mm ngobukhulu. Ixhasa ukupakishwa kwesixhobo ngobude bentambo yokubopha ukuya kuthi ga kwi-110mm.

Isishwankathelo kunye nezicelo: Ngamafutshane, iTowa CPM1080 liqonga eliyilelwe ukupakisha okuphucukileyo okuchanekileyo nokungabizi kakhulu. Imodeli yayo "ye-HP" isebenza njengebhulorho kwiiteknoloji zokupakisha zesizukulwana esilandelayo, ngelixa imodeli "Ezenzekelayo Ngokupheleleyo" imele ukhetho olungabizi kakhulu kwimveliso enkulu yexesha elizayo. Esi sixhobo sinokupakisha kungekuphela nje izixhobo eziqhelekileyo ezifana nee-IC, ii-microprocessors, kunye nee-sensors, kodwa kunye nee-power semiconductors (ezifana nee-MOSFET kunye nee-IGBTs) kunye nezixhobo ze-optoelectronic (ezifana nee-LEDs).