Inkqubo yokubumba iFico FML

Umsebenzi we-FML womatshini wokubumba we-BESI usetyenziswa ikakhulu kulawulo oluchanekileyo kunye nolawulo ngexesha lokupakishwa kunye nenkqubo ye-electroplating.

I-FML (i-Function Module Layer) yomatshini wokubumba we-BESI yinxalenye ephambili kumatshini, kwaye imisebenzi yayo ephambili kunye neendima ziquka:

Ulawulo lwenkqubo yokupakisha: I-FML inoxanduva lokulawula iiparitha ezahlukeneyo kwinkqubo yokupakisha ukuze kuqinisekiswe ukuphunyezwa okuchanekileyo kwamanyathelo afana ne-chip mounting, ukupakishwa kunye ne-electroplating. Nge-FML, ulawulo oluchanekileyo lwezixhobo zokupakisha lunokufezekiswa ukuze kuqinisekiswe umgangatho wemveliso kunye nokuhambelana.

Ulawulo lwenkqubo ye-electroplated: Ngexesha lenkqubo ye-electroplating, i-FML inoxanduva lokubeka iliso kunye nokulawula iiparitha eziphambili ezifana nokugxininiswa, ubushushu, kunye noxinano lwangoku lwesisombululo se-plating ukuqinisekisa ukufana kunye nomgangatho we-electroplating layer. Ngolawulo oluchanekileyo, iziphene kwinkqubo ye-electroplating inokuphetshwa kwaye ukuthembeka kunye nobomi bemveliso kunokuphuculwa.

Ukurekhodwa kwedatha kunye nokuhlalutya: I-FML nayo inemisebenzi yokurekhoda kunye nokuhlalutya idatha, enokurekhoda iiparitha ezahlukeneyo kunye neziphumo kwiinkqubo zokupakisha kunye ne-electroplating ukunceda iinjineli zokwandisa inkqubo kunye nokulandelela umgangatho. Ngokuhlalutya idatha, iingxaki ezinokuthi zifunyanwe kwaye amanyathelo okuphucula ahambelanayo anokuthathwa ukuphucula ukusebenza kakuhle kwemveliso kunye nomgangatho wemveliso.

Ukudityaniswa kwezixhobo kunye nolawulo: I-FML idityaniswe ngokuqinileyo kunye nezinye iimodyuli zoomatshini bokubumba be-BESI kwaye ziqhutywe kwaye zilawulwe nge-interface edibeneyo. Oku kwenza yonke inkqubo yokuvelisa isebenze ngakumbi kwaye isebenzisane, inciphisa iimpazamo zabantu, kwaye iphucula inqanaba lokuzenzekelayo lomgca wemveliso.