IRON Die Bonding Machine Datacon 8800

High-Precision, High-Efficiency Die Bonding Solution

IIdatha ye-IRON 8800ngumatshini osebenza kakuhle kakhulu wokufa olungiselelwe ngokukodwa ukupakishwa kwe-semiconductor, ukupakishwa kwe-LED, kunye nokuveliswa kombane ochanekileyo. Ngobuchwepheshe bayo obuphezulu, i-Datacon 8800 ihambisa iinkqubo ezikhawulezayo nezichanekileyo zokuncamathela kwiintlobo ezahlukeneyo ze-chip kunye ne-substrate, iyenza ilungele ukusetyenziswa kwimveliso yombane.

Die Bonding Machine Iimpawu eziphambili:

• INkqubo yoLungelelwaniso loMbono oluchanekileyo: Ulungelelwaniso oluzenzekelayo luqinisekisa ukuba yonke inkqubo yokudibanisa ukufa ichanekile kwaye ayinazimpazamo.

• Uyilo lweModyuli: Iinketho zoqwalaselo eziguquguqukayo, ezivumela ukwenziwa ngokusekwe kwiimfuno zemveliso.

• Ubuchule bokuvelisa: Ukusebenza ngokukhawuleza kunye nokuzinza, ukulungele ukuveliswa kwevolumu ephezulu.

• Ulawulo Lwenkqubo Oluzenzekelayo: Iinkqubo zokulawula i-Smart zinciphisa ukungenelela kwabantu kunye nokuphucula ukuzinza kwemveliso.

Usetyenziso:

I-Datacon 8800 isetyenziswa ngokubanzi kwiukupakishwa kwe-semiconductor, ukupakishwa kwe-LED, kunye nokuveliswa kwecandelo lombane, ngakumbi kwiindawo ezifuna ukuchaneka okuphezulu kwe-die bonding.

Die Bonding Machine Ifanelekile:

• Ukupakishwa kweChip encinci kunye nenkulu: Kungakhathaliseki ukuba ujongene neetshiphusi ezincinci okanye i-substrates enkulu, i-Datacon 8800 ibonelela ngezisombululo ezithembekileyo zokufa.

• Amacandelo ahlukeneyo e-Electronic: Ilungele ukudityaniswa okuchanekileyo kwamacandelo e-elektroniki afana neemodyuli zamandla, ii-LED, izinzwa, kunye nokunye.

I-Datacon 8800, kunye nokusebenza kwayo okuphezulu, ukuchaneka, kunye nokuguquguquka, yinxalenye ebalulekileyo yemigca yemveliso ye-elektroniki yanamhlanje, inceda abathengi ukuba baphucule ukusebenza kakuhle kwemveliso kunye nokuqinisekisa umgangatho wemveliso.

I-Besi Datacon 8800 ngumatshini ophuculweyo we-chip bonding, osetyenziswa kakhulu kwi-2.5D kunye ne-3D yobugcisa bokupakisha, ngakumbi i-TSV (Nge-Silicon Via) izicelo.

Iimpawu zobugcisa kunye neendawo zokusetyenziswa

I-Besi Datacon 8800 umatshini wokudibanisa itshiphu wamkela itekhnoloji ye-thermocompression bonding, eyona iteknoloji ephambili kwi-2.5D/3D iteknoloji yokupakisha. Iinzuzo zayo eziphambili ziquka:

Itekhnoloji yokudibanisa i-Thermocompression: ilungele ukupakishwa kwe-2.5D kunye ne-3D, ngakumbi izicelo ze-TSV.

Intloko engundoqo ye-7-axis: intloko engundoqo kunye ne-axs ye-7, inika ukuchaneka okuphezulu kunye nokuguquguquka.

Uzinzo lwemveliso: inozinzo olubalaseleyo lwemveliso kunye nemveliso ephezulu.

Iiparamitha zokusebenza kunye neqonga lokusebenza

I-Besi Datacon 8800 umatshini wokudibanisa itshiphu unezi pharamitha zilandelayo kunye neqonga lokusebenza:

Intloko engundoqo ye-7-axis: iqulethe i-axes yokubeka i-3 (X, Y, Theta) kunye ne-4 i-axes yokudibanisa (Z, W), inika indawo echanekileyo kunye nokulawula ukudibanisa.

I-Architecture ye-Hardware ePhezulu: Intloko engundoqo ye-7-axis kunye ne-architecture ephezulu ye-hardware iqinisekisa i-ultra-fine pitch.

I-Platform Control: I-platform yokulawula isizukulwana esitsha kunye nokulawula ukunyakaza okuphezulu kunye ne-latency ephantsi, ukuphuculwa kokulawulwa kwendlela kunye nenkqubo yokulandelela ukuguquguquka kwamandla.

Isicelo soShishino kunye nokuma kweMarike

I-Besi Datacon 8800 umatshini wokudibanisa i-chip ineendlela ezininzi zezicelo kwi-2.5D kunye ne-3D yokupakisha, ngokukodwa kuphando kunye nophuhliso lwememori ye-bandwidth ephezulu (i-HBM) kunye ne-AI chips, iteknoloji yokudibanisa i-hybrid iye yaba yindlela ebalulekileyo yokufezekisa isizukulwana esilandelayo se-HBM (njenge-HBM4). Ngenxa yokuchaneka kwayo okuphezulu kunye nokuzinza okuphezulu, izixhobo zenza kakuhle kwizicelo ze-TSV kwaye ziye zaba sisixhobo sokubhekisela kwizicelo ze-TSV zangoku.