GW Nanosecond ayaa garaacday dayactirka laser-ka adag

GW YLPN-1.8-2 500-200-F waa saxan sare nanosecond-gaaban laser-pulse laser (DPSS, diode-pumped adag-state laser) soo saaray GWU-Lasertechnik (hadda qayb ka mid ah Kooxda Qaybaha Laser) ee Germany. Waxaa si weyn loogu isticmaalaa:

Micromachining warshadaha ( qodista PCB, goynta dhalooyinka)

Tijaabooyin cilmi-baaris saynis ah (falanqaynta spectral, laser-induced breakdown spectroscopy LIBS)

Quruxda caafimaadka (ka-saarida midabka midabka, qalliinka ugu yar ee qallafsan).

Halbeegyada asaasiga ah:

Dhererka hirarka: 532nm (iftiin cagaaran) ama 355nm (ultraviolet)

Ballaca garaaca: 1.8 ~ 2ns

Soo noqnoqoshada soo noqnoqda: 500Hz ~ 200kHz la hagaajin karo

Awoodda ugu sarreysa: cufnaanta tamarta sare, oo ku habboon mashiinka saxda ah.

2. Hababka dayactirka maalinlaha ah

(1) Dayactirka nidaamka indhaha

Kormeerka toddobaadlaha ah ee maalinlaha ah:

Isticmaal hawo ciriiri ah oo aan boodh lahayn si aad u nadiifiso daaqada wax soo saarka laysarka iyo muraayadaha.

Hubi isku toosinta dariiqa indhaha (si aad uga fogaato leexleexinta uu keeno gariirka farsamada).

Dayactirka qoto-dheer ee saddex-biloodlaha ah:

Isticmaal nadiifiyaha indhaha ee gaarka ah + suufka aan boodhka lahayn si aad u tirtirto muraayada (ha isticmaalin aalkolo si aad uga fogaato dhaawaca daboolka).

Soo ogow gudbinta kristanta leysarka (sida Nd:YVO₄) oo beddel haddii loo baahdo.

(2) Maareynta nidaamka qaboojinta

Dayactirka qaboojinta:

Adeegso biyaha deionized + wakiilka daxalka, beddel 6dii biloodba mar.

Hubi xidhitaanka wadajirka tuubada biyaha si aad uga hortagto inay daadsanto.

Nadiifinta shucaaca:

Ku nadiifi boodhka weelka kulaylka hawo qaboojiyey 3dii biloodba mar (si loo hubiyo waxtarnimada kulaylka).

(3) Kormeerka korantada iyo farsamada

Degganaanshaha sahayda korontada:

La soco isbedbeddelka korantada wax gelinta (baahida <± 5%), waxaa lagu talinayaa in lagu qalabeeyo xasiliyaha tamarta UPS.

Hubi in bamka diode (LD) wadista hadda uu yahay mid caadi ah.

Xakamaynta deegaanka:

Heerkulka shaqada 15 ~ 25 ° C, qoyaan <60%, iska ilaali uumiga.

3. Cilladaha guud iyo ogaanshaha

(1) Awoodda wax-soo-saarka laser-ka ayaa hoos u dhacda

Sababaha suurtagalka ah:

Wasakhda muraayadda indhaha ama dhaawaca dahaadhka

Karistaanka Laser (Nd:YVO₄/YAG) gabow ama saamaynta lenska kulaylka

Waxtarka bamka (LD) ayaa hoos u dhacaya.

Tallaabooyinka ogaanshaha:

Isticmaal mitirka korontada si aad u ogaato tamarta wax soo saarka.

Hubi dariiqa indhaha ee qaybaha (go'doo godka resonant oo tijaabi waxqabadka hal cutub).

(2) Xasilooni la'aanta garaaca wadnaha ama maqan

Sababaha suurtagalka ah:

Beddelka Q (sida modulator-ka acousto-optic AOM) waduhu guuldarraystay

Koontaroolka wareegga wareegga (sida FPGA-ga wakhtiga) calaamad aan caadi ahayn

Qalabka korantada ee moduleka korontadu kuma filna.

Tallaabooyinka ogaanshaha:

Isticmaal oscilloscope-ka si aad u ogaato calaamadda waditaanka beddelka Q.

Hubi in habka soo noqnoqda ee soo noqnoqda uu ka badan yahay xadka.

(3) alaarmiga habka qaboojinta

Sababaha suurtagalka ah:

Qulqulka qaboojiyaha oo aan ku filneyn (Biyaha oo xumaada ama tuubooyinka oo xirma)

TEC ( qaboojiye kuleyl ah) oo fashilantay

Dareemaha heerkulka oo qulqulaya.

Tallaabooyinka ogaanshaha:

Hubi heerka haanta biyaha oo shaandhayso.

Cabbir in danabka guud ee TEC uu yahay mid caadi ah.

(4) Qalabku ma bilaabi karo

Sababaha suurtagalka ah:

Korontada ugu weyni waa dhaawacday (fiyuuska waa la afuufay)

Isku xidhka badbaadada ayaa kiciyay (sida chassis-ku ma xidhna)

Xakamee khaladka isgaarsiinta software

Tallaabooyinka ogaanshaha:

Hubi gelinta tamarta iyo fiyuuska.

Dib u bilaw software-ka oo dib u rakib darawalka.

4. Hagaajinta fikradaha iyo hababka

(1) Cilad-sheegid qaabaysan

Qaybta indhaha:

Nadiifi ama beddel muraayadda wasakhaysan → Dib u habeyn ku samee dariiqa indhaha.

Qaybta kontoroolka elegtarooniga ah:

Beddel boodhka darawalka ee Q ee dhaawacan → Kala beddel wakhtiga garaaca wadnaha.

Qaybta qaboojinta:

Ka fur dhuumaha xiran → Beddel bamka biyaha ee khaldan/TEC.

(2) Qalabaynta iyo tijaabinta

Ogaanshaha garaaca wadnaha: Isticmaal sawir-qaade xawaare sare leh + oscilloscope si loo xaqiijiyo ballaca garaaca wadnaha iyo xasilloonida.

Falanqaynta tayada alwaax: Isticmaal mitirka M² si aad u hubiso in xagasha kala duwanaanta alwaaxdu ay buuxiso heerka.

(3) Talooyinka xulashada agabka hadhaaga

Qaybaha kaydka ee asalka ah (sida modules LD iyo furayaasha Q ay bixiso GWU/ Qaybaha Laser) ayaa la door bidaa.

Beddelka: Qaybaha dheeriga ah ee dhinac saddexaad oo aad ula jaan qaadaya (la-daba-qaadka cabbirka ayaa loo baahan yahay in la xaqiijiyo).

5. Qorshaha dayactirka ka hortagga

Bishiiba: diiwan geli awoodda wax soo saarka iyo isbeddellada cabbirka garaaca.

Lixdii biloodba mar: hagaajinta godka indhaha ee injineerada xirfadlayaasha ah.

Sannadle: kormeer dhamaystiran ee nidaamka qaboojinta iyo gabowga moduleka awoodda.

Gabagabo

Iyada oo loo marayo dayactirka maalinlaha ah ee caadiga ah + fikradaha dayactirka modular, nolosha lasers-ka YLPN si weyn ayaa loo kordhin karaa waxaana la dhimi karaa wakhtiga dhimista. Haddii aad u baahan tahay taageero qoto dheer, fadlan xor u noqo inaad la xiriirto kooxdayada farsamada