Двоголовна компонентна камера ASM siemens machine 03016339

The No. 33 IC head component camera (03016339) of the ASM placement machine is a key visual component designed for high-precision IC component (such as QFP, BGA, CSP, etc.) placement. It is suitable for the IC dedicated placement head of the ASM SIPLACE series placement machine. The following is a comprehensive analysis of specifications, functions, features, applications, troubleshooting, maintenance and repair ideas.

1. Технічні характеристики

Детальні параметри елемента

Model 03016339 (No. 33 IC head camera)

Applicable equipment ASM SIPLACE series (such as X4, TX, D series)

Camera type High-resolution industrial digital camera (CCD/CMOS)

Resolution 2MP~5MP (support 0.3mm fine pitch IC pin detection)

Frame rate 30~60fps (high-speed shooting, suitable for high-precision placement)

Light source Multi-color LED ring light source (red/blue/white light, programmable control)

Інтерфейс зв'язку GigE Vision / Camera Link

Protection level IP50 (dustproof, suitable for SMT workshop environment)

Installation method Fixed on the IC placement head, used with No. 33 nozzle

2. Функції та ефекти

(1) Основна функція

High-precision identification of IC components

Detection of IC position (X/Y), rotation angle (θ), pin coplanarity, and polarity mark.

Support 0.3mm fine pitch QFP and BGA solder ball detection.

Mounting correction

Using IC head to achieve ±15μm ultra-high precision mounting (such as mobile phone CPU, memory chip).

Automatically compensate for nozzle picking offset to ensure perfect alignment between BGA solder balls and PCB pads.

Defect detection

Identify IC pin deformation, missing balls, reverse polarity, package damage and other undesirable conditions.

(2) Сценарії застосування

High-density PCB assembly (such as smartphone motherboards, servers, and automotive ECUs).

Precision IC mounting (BGA, QFN, CSP, POP packaging).

3. Core Features

Опис функції

Ultra-high resolution imaging 5MP sensor, supports sub-pixel analysis, ensures 0.3mm fine pitch pin detection

Multi-spectral lighting Red/blue/white light adjustable, enhances the contrast of ICs of different materials (such as plastic package and metal pins)

Fast autofocus Dynamically adjust the focal length to adapt to ICs of different thicknesses (such as thin CSP and thick QFP)

Anti-interference design Electromagnetic shielding (EMI), anti-vibration, adapt to high-speed mounting environment

Modular maintenance Lens and light source can be replaced separately to reduce maintenance costs

4. Common faults and handling methods

Несправність Можлива причина Рішення

IC recognition failure Abnormal light source/lens contamination/calibration offset 1. Check LED brightness

2. Очистіть об'єктив

3. Recalibrate

Blurred image (pins are not clear) Focus offset/lens contamination 1. Recalibrate the focus

2. Clean with a dust-free cloth

Переривання зв'язку (немає зображення) Нещільне з'єднання кабелю/окислення інтерфейсу 1. Перепідключіть кабель GigE

2. Замініть пошкоджений кабель

Large error in BGA solder ball detection Uneven light source/wrong algorithm parameters 1. Adjust the light source angle

2. Update the visual software

The camera automatically shuts down due to overheating Poor heat dissipation/continuous overload operation 1. Check the cooling fan

2. Restart after pausing cooling

5. Методи обслуговування

(1) Щоденне технічне обслуговування

Daily: Gently wipe the lens and light source window with a dust-free cloth + isopropyl alcohol.

Weekly: Check the cable connection to ensure that there is no looseness or wear.

(2) Регулярне калібрування

Щомісяця:

Use a standard calibration plate (such as ASM 03016000) for optical calibration.

Check the uniformity of the light source to avoid local overbrightness/darkness.

Quarterly: Back up the camera parameters to prevent data loss.

(3) In-depth maintenance

Yearly: Contact ASM official or authorized service providers to:

Optical system inspection (lens, sensor).

Cooling system cleaning (fan, vents).

6. Ідеї для ремонту

(1) Основні методи усунення несправностей

Зверніть увагу на індикатор стану (зелене світло в нормальному стані, червоне світло/миготіння в разі несправності).

Check the ASM SIPLACE system error log (such as "Vision Error 3301").

(2) Ремонт обладнання

Заміна деталей:

Lens is seriously contaminated → Replace the optical lens assembly (ASM P/N: 03016340).

LED light source is damaged → Replace the ring light module (ASM P/N: 03016341).

Оновлення прошивки:

Update the camera driver and vision algorithm through the ASM Service Hub.

(3) Професійна підтримка

If the fault cannot be solved, contact ASM technical support or an authorized repair center to avoid damage to the IC head due to misoperation.