Ibikoresho Bikoreshwa Semiconductor Sisitemu yo Gutera Electroplating Raider® Edge ECD

Sisitemu ya Raider® Edge ECD y’ibikoresho bya Applied Materials ihagaze nk'ikimenyetso mu bijyanye no gushyiramo amashanyarazi mu nganda za semiconductor. Bitewe no guhuza ikoranabuhanga nyuma yo kugura Semitool, sisitemu ikoreshwa cyane mu buryo buhanitse bwo gupakira no guhuza ibikoresho, ikaba irangwa no koroha cyane, umusaruro wayo mwinshi, no kugenzura ibikorwa byayo mu buryo budasanzwe.

**Gushyira Sisitemu mu mwanya wayo**

**Isosiyete:** Applied Materials, Inc.

**Icyitegererezo cy'ibicuruzwa:** Raider® Edge ECD

**Ubwoko bw'Ibikoresho:** Sisitemu yo Gushyiramo Ibikoresho by'amashanyarazi mu byumba byinshi byikora

**Akamaro k'amateka:** "Ikimenyetso cy'inganda" kizwi cyane mu bijyanye n'ikoranabuhanga ryo gushyiramo imashini imwe. Kigaragaza ibikoresho bya ECD bya ECD bya ECD imwe; icyayibanjirije, sisitemu ya Raider GT, yari igamije gushyigikira iterambere ry'ikoranabuhanga rya chips ry'ibisekuru bitatu.

**Amahame y'ingenzi**

Gushyiramo amashanyarazi hakoreshejwe amashanyarazi bikubiyemo gukoresha amashanyarazi kugira ngo bigabanye iyoni z'icyuma ku buso bwa wafer, bityo bikarema firime ntoya. Sisitemu ya Raider Edge ECD irenze gupakira ibintu byoroshye; binyuze muri sisitemu igezweho yo kugenzura, ituma iyi nzira igera ku rwego rwa atome. Byongeye kandi, sisitemu ishyigikira intambwe zitandukanye zo gutunganya amazi, nko gukata no gusukura wafer.

**Ibiranga n'Ibyiza**

Imbaraga zayo ntizishingiye gusa ku bushobozi bwayo bwo gukora imirimo isanzwe yo gushyiramo ibyuma, ahubwo cyane cyane mu bworoshye bwayo budasanzwe, kugenzura neza uburyo ikora, ndetse n'imiterere yayo ikora mu buryo bwikora.

**Ikiranga/Ibyiza** | **Ibisobanuro birambuye**

**Uburyo bworoshye bwo gutunganya** | Ishobora gutunganya ingano zitandukanye za wafer, harimo 150mm, 200mm, na 300mm; ishyigikira uburyo bwo gutunganya wafer mu buryo bunyuranyije n'amazi mu ntambwe nyinshi, harimo no gushyira icyuma mu bubiko, gukata no gusukura.

**Inkunga y'ibikoresho bigari** | Ishyigikira ishyirwa ry'ibyuma n'ibindi bikoresho bitandukanye, nka umuringa, nikeli, zahabu, tini-ifeza, aloyi za magnetiki, na solder za eutectic za zahabu-tin. Ishyigikira kandi gushushanya ahantu hatandukanye ku bikoresho byihariye nka CZT na AlN.

**Igenzura ry’Uburyo Buhanitse** | Ikoresha uburyo bwa anode bugizwe n’uturere twinshi kugira ngo igere ku buryo bumwe, ndetse no ku duce tw’imbuto duto cyane cyangwa dukomeye. Ku duce twa 300mm, reactor yayo y’icyumba ishobora guhindura ubucucike bw’amashanyarazi kugira ngo irebe ko ihuzwa neza.

**Umuvuduko Uhanitse & Ikiguzi Gito** | "Teachless" ikora neza ikuraho igihe cyo kudakora gifitanye isano no gupima intoki, mu gihe ikoranabuhanga rya ion membrane ryongera igihe cyo koga hakoreshejwe imiti, bigatuma ikiguzi cyo gukora kiba gito cyane. Byongeye kandi, imikorere yayo mito yongera ubushobozi bwose bwo gukora. **Kwagura ikoranabuhanga ry'umutungo:** Sisitemu ya Raider GT yabanjirije iyi, yashyigikiraga ibyumba bitandatu byo gushyiramo plating kandi itanga modules zo gupima cyangwa zo gupima, ndetse n'ibyumba bihuriweho byo gusukura impande za wafer, bevel, no inyuma.

**Aho Gukoresha**

**Gupakira no Guhuza Ibikoresho Bigezweho:** Ikoreshwa mu kuzuza umuringa mu gukora chips, igenzura ko kuzuza nta kintu na kimwe; inakoreshwa mu gushyira inkingi z'umuringa, uduce duto two gusoda (harimo na solder idafite icyuma), n'uduce two gukwirakwiza (RDL) mu ipaki ifite ubushobozi bwo gufunga.

**Gukora Ibikoresho By’Umwihariko:** Ikoreshwa mu gushyira ibyuma mu byiciro byinshi nka MEMS na sensor; itanga umuringa mwiza wo kuzuza TSV (Through-Silicon Vias) na TGV (Through-Glass Vias).

**Imashini zikoresha ingufu n'ibikoresho bivanze:** Zikoreshwa mu gushyira umuringa mwinshi mu bikoresho by'amashanyarazi, ndetse no mu gukoresha icyuma gikozwe mu buryo budakoresha imbaraga nyinshi ku byuma bito.

**Indi nzira zidasanzwe:** Ishobora gushyira zahabu binyuze mu miyoboro cyangwa gusukura wafer z'ibirahure hakoreshejwe imvange ishingiye kuri ozone; ishobora gukora ibishushanyo mbonera by'ibice byinshi—irenze ubushobozi bwa UBM (Under Bump Metallization) busanzwe.

**Ibisobanuro bya tekiniki**

**Ubunini bw'ingufu:** 150mm, 200mm, 300mm

**Umubare wa Modules zo Gushyiramo Imashini:** Models z'ibanze zishyigikira modules nyinshi; models zo mu rwego rwo hejuru zishobora kwakira abantu bagera kuri 6.

**Uburyo bwo gushyiramo ibishushanyo:** Imbere mu nganda (amakuru yihariye ntatanzwe).

**Ibikoresho byunganirwa:** Cu (Umuringa), Au (Zahabu), SnAg (Tin-Silver), Ni (Nickel), aloyi za rukuruzi, AuSn (Zahabu-Tin Eutectic), nibindi.

**Ubushobozi bwo gukora:** Ishyigikira umuringa mwinshi ushyirwamo kugeza kuri 100µm, kuzuza imiterere ya High Aspect Ratio (HAR), no kuzuza uduce dufite Critical Dimensions (CD) ntoya kurusha 22nm.

**Urwego rw'imikorere y'ikoranabuhanga:** Ikorana neza, rifite ibyumba byinshi bikoresha ikoranabuhanga; rishyigikira imikorere y'ikoranabuhanga nka SECS/GEM; rijyanye na SMIF na FOUP wafer transfer pods.

Kugereranya na ACM ULTRA ECP app-p

Nk'umukinnyi w'ingenzi mu bijyanye n'ibikoresho byo gupfunyika bya semiconductor, iyi sisitemu ihagaze mu buryo butandukanye cyane n'uburyo bwa ACM Research ULTRA ECP app-p—icyitegererezo wabajije mbere. Guhitamo hagati yabyo byombi biterwa n'ibyo ukeneye mu buryo bwihariye.

**Ingano zo kugereranya** | **Ibikoresho byakoreshejwe Raider Edge ECD** | **Ubushakashatsi bwa ACM ULTRA ECP ap-p**

**Ikoranabuhanga ry'ingenzi** | Yibanda ku gupfunyika neza cyane ku dupfunyika tw'ibumba rimwe | Ikoranabuhanga rigezweho ryo gupfunyika mu buryo butambitse ku dupfunyika two ku rwego rw'ibumba

**Ifatizo ry'inyongera** | Uduce twa wafer twa mm 150 – 300 | Uduce twa mm 510 x 515

**Ibyiza by'ingenzi** | Igipimo ngenderwaho cy'inganda; iterambere ry'ikoranabuhanga riri hejuru; inzira nini | Izuza icyuho cy'inganda; ituma umusaruro mwinshi uhendutse ku rwego rw'itsinda ry'ibikoresho ukorwa neza

**Icyibandwaho mu mikorere** | Ishyira imbere uburyo bwo guhuza neza ibintu hamwe n'uburyo bwo guhuza ibintu imbere | Yagenewe by'umwihariko Fan-Out Panel-Level Packaging (FOPLP)

Imbaraga nyazo za Raider Edge ECD ziri mu iterambere ryayo: mbere yari ikoranabuhanga ryakoreshejwe mu guhuza umuringa kuri node ya 22nm, yahindutse urubuga rufite ubushobozi bwo gushyigikira ibikorwa byinshi byihariye—kuva ku bikoresho bya rukuruzi kugeza ku gupakira bigezweho—bityo bigaragaza ko ikora neza cyane.