ASMPT DEK horizon 03ix smt ekyuma ekikuba ebitabo ku ssirini

DEK 03IX kye kyuma eky’omulembe ekikuba ebitabo ku ssirini ekikolebwa kkampuni ya DEK (kati kitundu kya ASM Assembly Systems), ekyakolebwa mu makolero g’okukola ebyuma, naddala okukozesebwa mu kukuba ebitabo mu ngeri entuufu mu layini z’okufulumya tekinologiya ow’okussa ku ngulu (SMT).

Okuteeka Ebintu mu kifo

DEK 03IX eteekeddwa nga eky’okukuba ebitabo ekya SMT eky’omu makkati okutuuka ku mutindo ogwa waggulu, okusinga nga kiweereza:

Abakola ebyuma ebikozesebwa mu byuma bikalimagezi

Abagaba ebyuma by’ebyuma by’emmotoka

Abakola ebyuma by’amasannyalaze mu makolero

Abakola ebyuma by’empuliziganya

Abakola ebyuma eby’amasannyalaze eby’obujjanjabi

Ebipimo by’ebyekikugu

Ebikwata ku nsonga enkulu

Ekifo eky’okukuba ebitabo: Sayizi ya PCB esinga obunene ya mm 510 × mm 460

Sipiidi y’okukuba ebitabo: Okutuuka ku sikonda 20/cycle (okusinziira ku buzibu bwa PCB)

Ddamu obutuufu: ±12.5μm @ Cpk≥1.0

Obutuufu bw’okukwatagana: ±15μm @ Cpk≥1.0

Puleesa ya scraper: 0-20kg etereezebwa

Sipiidi y’okwawula: 0.1-20mm/s etereezebwa

Ebintu eby’ebyuma

Okukwatagana kwa sayizi ya fuleemu: kuwagira 29 "×29" standard screen frame

Z-axis okutambula: 0-6mm okutereezebwa

θ-ekisiki okutereeza: ±5° obusobozi okutereeza enzitoya

Obugumu bwa substrate: 0.2-6mm

Enkola y’okufuga

Ekwata enkola ey’omulembe ey’okulaga ebifaananyi eya VisionAlignTM

Enkola y’okukuba ebifaananyi ey’obulungi obw’amaanyi eriko kkamera nnyingi

Omulimu gw’okukung’aanya n’okwekenneenya amawulire ga SPC mu kiseera ekituufu

Okuwagira enkola y'empuliziganya eya SECS/GEM

Tekinologiya omukulu n’ebintu ebiyiiya

1. Tekinologiya ow’amagezi ow’okukuba ebitabo

Enkola y’okufuga ey’ekiseera ekituufu: esobola okutereeza mu ngeri ey’otoma parameters z’okukuba okusinziira ku mpisa za solder paste

Okufuga puleesa mu ngeri ey’amagezi: okutereeza puleesa y’okusenya mu ngeri ey’amaanyi okusobola okutuukagana ne dizayini za paadi ez’enjawulo

Enkola y’okuyonja screen mu ngeri ey’obwengula: programmable cleaning frequency n’enkola

2. Enkola y’okulaba ey’obutuufu obw’amaanyi

Ekwata amataala agakola enkoona eziwera ne kkamera ya CCD ey’obulungi obw’amaanyi

Awagira enkola z’okutegeera obubonero obuwera

Tekinologiya w’okukola ebifaananyi mu ngeri ya sub-pixel

Omulimu gw’okutereeza essira n’okutaasa mu ngeri ey’otoma

3. Okufuga enkola okw’omulembe

Enkola y’okusenya efugirwa mu loopu enzigale

Okulondoola mu kiseera ekituufu omutindo gw’okukuba ebitabo

Omulimu gw’okuzuula obuzito bwa solder paste mu ngeri ey’obwengula

3D solder paste okuzuula eky'okulonda (module endala zeetaagibwa)

4. Dizayini enyangu okukozesa

Enkola ya yinsi 15 eya langi touch screen

Embeera y’okukola pulogulaamu ez’ebifaananyi

Enkola y’okuddukanya enkola ya formula

Okuzuula obulwadde okuva ewala n’omulimu gw’okuddaabiriza

Enzimba y’enkola

Ebitonde bya Hardware

Host frame: ensengekera ya aluminiyamu ey’amaanyi amangi, egaba obuwagizi obutebenkevu

Enkola y’omutwe gw’okukuba ebitabo: omuli ekyuma ekisekula emirundi ebiri, sensa ya puleesa ne sensa y’obugulumivu

Enkola y’okulaba: ensengeka ya kkamera bbiri eza waggulu n’eza wansi

Enkola y’okutambuza amasannyalaze: eggaali y’omukka ekwata ku mutindo ogw’amaanyi n’okuvuga omusipi

Enkola y’okutereeza stencil: ekyuma ekikwata empewo

Enkola y’okuteeka substrate mu kifo: ppini y’obuwagizi ekolebwa pulogulaamu ne edge clamp

Enkola ya software

Enkola y’emirimu eya DEK InstinctivTM V9: pulogulaamu eyeetongodde eyesigamiziddwa ku musingi gwa Windows

Module y'okulongoosa enkola: omulimu gw'okuteesa ku parameter mu ngeri ey'otoma

Ekintu eky’okwekenneenya amawulire: ekipande kya SPC mu kiseera ekituufu n’okwekenneenya emitendera

Okuyungibwa ku mutimbagano: okuwagira okugatta enkola ya MES mu kkolero

Ennimiro y’okusaba

Okukozesa okwa bulijjo

Ultra-fine pitch printing ya 01005 n’ebitundu ebitonotono

Flip chip Chip) ebikozesebwa

Okupakinga ku ddaala lya wafer (WLCSP) .

Ebipande ebiyunga ebiyungo ebinene (HDI).

Okukuba ebitabo mu ngeri ya flexible circuit board (FPC).

Obusobozi bw’enkola ey’enjawulo

Okukuba ebitabo mu tekinologiya atabuddwa (solder paste ne conductive glue) .

Omutendera gw’okukuba ebitabo mu stencil

Enkola y’okukuba ebitabo mu njuyi bbiri

Okukuba ebitabo ebintu ebirina obuzito bwa waggulu (nga wansi okujjuza) .

Enkizo mu nkola y’emirimu

Okukola obulungi mu kukola ebintu

Obudde bw’okukyusa layini mu bwangu (

Amakungula amangi agayita mu kusooka (FPY) .

Okutebenkera kw’okufulumya okutambula obutasalako okwa waggulu

Wagira okuyonja stencil okutali kwa kuyimirira

Okukakasa omutindo

Okukuba ebitabo okukwatagana kwa waggulu

Omuwendo gw’obulema omutono

Solder paste Omutindo omulungi ennyo ogw’okubumba

Omulimu gw’okuliyirira enkola ey’obwengula

Okukendeeza ku nsimbi

Kasasiro w’ebintu omutono

Ssente entono ez’okuddaabiriza

Okukozesa amaanyi amangi

Enkizo enkulu ey’omuwendo gwonna ogw’obwannannyini (TCO).

Ebintu eby’okwesalirawo

Enkola za Hardware

Enkola y’okukebera solder paste mu 3D: okupima obuzito mu kiseera ekituufu

Enkola y’okutambuza emikutu ebiri: okuwagira okufulumya okutambula obutasalako

Ekyuma ekikuuma nayitrojeni: ku nkola ez’enjawulo

High viscosity material kit: ku bikuta eby’enjawulo

Sofutiweya z’oyinza okulonda

Ekipapula ky’okwekenneenya amawulire eky’omulembe: okwekenneenya enkola mu bujjuvu

Module y'okulondoola okuva ewala: okulaba embeera y'ebyuma mu kiseera ekituufu

Enkola y’okuddaabiriza ey’amagezi: omulimu gw’okuddaabiriza ogw’okuteebereza

Okuddaabiriza n’okuweereza

Okuddaabiriza buli lunaku

Ebintu Ebisemba Okuyonja Buli Bulijjo

Olukalala lw’okukebera buli wiiki

Enteekateeka y’okuddaabiriza buli mwezi

Waliwo nnyunzi

Omukutu gw’Empeereza y’Ensi Yonna

Ennamba y'essimu ey'obuyambi mu by'ekikugu 24/7

Ekitabo ky’okumanya n’okugonjoola ebizibu ku mutimbagano

Okulongoosa Sofutiweya Bulijjo

Ensengeka y’akatale n’okwekenneenya okuvuganya

Akatale akagendererwamu

Layini z’okufulumya SMT eza Volume eya Medium to High

Abakola ebyuma ebikozesebwa mu byuma bikalimagezi nga balina High Mix Production

Ennimiro ezirina Ebyetaago ebikakali eby’omutindo gw’okukuba ebitabo

Okugeraageranya n’Abavuganya Abakulu

Bw’ogeraageranya n’ebyuma ebifaanagana nga MPM Ultraprint 3000, Ekra X5, DEK 03IX erina ebirungi mu bintu bino wammanga:

Enkolagana y’abakozesa esinga okuba ey’omukwano

Enkola ezisingawo ezikyukakyuka mu kusengeka

Ebyetaago by’okuddaabiriza bikendeeze

Okukendeeza ku nsimbi

Emitendera gy’enkulaakulana n’okulongoosa mu biseera eby’omu maaso

Obulagirizi bw’enkulaakulana ya tekinologiya

Okulongoosa enkola nga tuyambibwako AI

Obuyambi mu kuddaabiriza augmented reality (AR).

Okugatta amakolero mu buziba 4.0

Ennongoosereza mu dizayini ezitakuuma butonde era ezikekkereza amaanyi

Ekkubo ly'okulongoosa

Hardware modular design okusobola okwanguyirwa okulongoosa

Okukwatagana okulungi okwa software okudda emabega

Enkolagana ya I/O egaziyizibwa

Okwekenenya abakozesa n’okusiimibwa amakolero

Ebiteeso by’abakozesa ebya bulijjo

"Okutebenkera mu kukuba ebitabo kusukka ku bisuubirwa".

"Obudde bw'okukyusa layini bukendedde nnyo".

"Okukyusakyusa okulungi ennyo ku PCBs enzibu".

"Enkolagana y'emirimu etegeerekeka era ennyangu okukozesa".

Engule n’okuweebwa satifikeeti

Yawangula engule eziwera ez’obuyiiya mu makolero

Egoberera satifikeeti z’obukuumi nga CE ne UL

Atuukiriza ebisaanyizo by’omutindo gwa IPC

Okubumbako

DEK 03IX ekiikirira omutendera ogw’omulembe ogwa tekinologiya w’okukuba ebitabo mu SMT aliwo kati, era egaba eby’okugonjoola okukuba ebitabo ebyesigika mu kukola ebyuma okuyita mu dizayini yaayo ey’obutuufu obw’amaanyi, ey’amagezi era ennyangu okukozesa. Ka kibeere okufulumya mu bungi oba embeera y’okutabula ennyo, 03IX esobola okuwa omulimu omulungi ennyo okuyamba abakozesa okutumbula omutindo, okukendeeza ku nsaasaanya n’okutumbula obulungi.