Zipangizo Zogwiritsidwa Ntchito Semiconductor Electroplating System Raider® Edge ECD

Dongosolo la Raider® Edge ECD la Applied Materials limayimira ngati muyezo pakupanga ma electrochemical deposition (ECD) mkati mwa semiconductor. Chifukwa cha kuphatikiza kwaukadaulo pambuyo poti Applied Materials yagula Semitool, dongosololi limagwiritsidwa ntchito kwambiri mu njira zolumikizirana zapamwamba komanso za wafer-level, zomwe zimasiyanitsidwa ndi kusinthasintha kwake kwakukulu, mphamvu yake yogwira ntchito, komanso kuwongolera bwino njira.

**Kuyika Makhalidwe**

**Kampani:** Applied Materials, Inc.

**Chitsanzo cha Zogulitsa:** Raider® Edge ECD

**Mtundu wa Zipangizo:** Dongosolo Lodzipangira Ma Electrochemical Deposition la Zipinda Zambiri Lokhala ndi Wafer Imodzi Yokha

**Kufunika Kwa Mbiri:** "Chizindikiro Cha Makampani" chodziwika bwino pankhani ya ukadaulo wopangira ma plates a single-wafer. Chimayimira m'badwo wachinayi wa zida za single-wafer ECD; njira yomwe idakhazikitsidwa kale, Raider GT, idapangidwa poyamba kuti ithandizire chitukuko cha mibadwo itatu ya ukadaulo wa chip.

**Mfundo Zazikulu**

Kuyika kwa electrochemical kumaphatikizapo kugwiritsa ntchito mphamvu yamagetsi kuti ichepetse ma ayoni achitsulo pamwamba pa wafer, motero kupanga filimu yopyapyala. Dongosolo la Raider Edge ECD limapitilira kupangira ma plating osavuta; kudzera mu dongosolo lowongolera lapamwamba, limalola njirayi kukwaniritsa molondola mulingo wa atomiki. Kuphatikiza apo, dongosololi limathandizira njira zosiyanasiyana zoyeretsera zonyowa, monga kupukuta ndi kuyeretsa wafer.

**Makhalidwe ndi Ubwino**

Mphamvu yake siili kokha mu kuthekera kwake kugwira ntchito zokhazikika, koma chofunika kwambiri ndi kusinthasintha kwake kwapadera, kuwongolera bwino njira, komanso kapangidwe kake kodzipangira wekha.

**Mbali/Ubwino** | **Kufotokozera Kwatsatanetsatane**

**Kusinthasintha kwa Njira** | Imatha kukonza ma wafer osiyanasiyana, kuphatikiza 150mm, 200mm, ndi 300mm; imathandizira njira zambiri zonyowetsera ma wafer, kuphatikiza kuyika zitsulo, kudula, ndi kuyeretsa.

**Kuthandizira Zinthu Zambiri** | Imathandizira kuyika zitsulo ndi zinthu zosiyanasiyana, monga mkuwa, nickel, golide, tin-silver, maginito alloys, ndi gold-tin eutectic solders. Imathandizanso kuyika zinthu zambiri pazipangizo zapadera monga CZT ndi AlN.

**Kuwongolera Njira Zapamwamba** | Imagwiritsa ntchito gulu la anode la malo ambiri kuti ikwaniritse kuyika kofanana, ngakhale pa zigawo za mbewu zoonda kwambiri kapena zotsutsa. Pa ma wafer a 300mm, reactor yake yowonjezeredwa ya chipinda imatha kusintha kuchuluka kwa magetsi kuti iwonetsetse kuti malo ake ndi ofanana.

**Kugwiritsa Ntchito Kwambiri & Mtengo Wotsika** | Makina olondola a "Teachless" amachotsa nthawi yogwira ntchito yokhudzana ndi kukonza ndi manja, pomwe ukadaulo wa ion membrane umawonjezera moyo wa bafa wa mankhwala, zomwe zimapangitsa kuti ndalama zogwirira ntchito zikhale zochepa kwambiri. Kuphatikiza apo, mawonekedwe ake ocheperako amawonjezera bwino mphamvu yonse yopangira. **Kukula kwa Ukadaulo wa Eni:** Dongosolo la Raider GT lomwe linayambitsidwa kale, linathandizira zipinda zisanu ndi chimodzi zolumikizira ndipo limapereka ma module osankha annealing kapena metrology, komanso zipinda zophatikizika zoyeretsera m'mphepete mwa wafer, bevel, ndi kumbuyo.

**Malo Ogwiritsira Ntchito**

**Kupaka ndi Kulumikizana Kwapamwamba:** Kumagwiritsidwa ntchito podzaza ma chitsulo cholumikizira mkuwa popanga ma chip, kuonetsetsa kuti palibe chodzaza; komanso kuyika zipilala zamkuwa, ma solder bumps (kuphatikiza lead-free solder), ndi magawo ogawa (RDL) mu ma wafer-level packaging.

**Kupanga Zipangizo Zapadera:** Imagwiritsidwa ntchito poyika zitsulo zambiri m'zida monga MEMS ndi masensa; imapereka kudzaza kwa mkuwa kwapamwamba kwambiri kwa ma TSV (Through-Silicon Vias) ndi ma TGV (Through-Glass Vias).

**Ma semiconductor a Mphamvu ndi Ma Compound:** Amagwiritsidwa ntchito poyika mkuwa wokhuthala m'zida zamagetsi, komanso poyika zitsulo kumbuyo zomwe sizimapanikizika kwambiri pa ma wafers owonda.

**Njira Zina Zapadera:** Wokhoza kuyika golide kudzera m'ma liners kapena kutsuka ma wafer agalasi pogwiritsa ntchito mankhwala ochokera ku ozone; amatha kuchita multi-layer stack etching—kupitirira luso lachikhalidwe la UBM (Under Bump Metallization).

**Mafotokozedwe Aukadaulo**

**Chithandizo cha Kukula kwa Wafer:** 150mm, 200mm, 300mm

**Chiwerengero cha Ma Plating Modules:** Ma base model amathandiza ma modules angapo; ma high model amatha kukhala ndi ma modules mpaka 6.

**Kufanana kwa Ma Plating:** Otsogola m'makampani (deta yeniyeni sinaperekedwe).

**Zinthu Zothandizidwa:** Cu (Mkuwa), Au (Golide), SnAg (Tin-Silver), Ni (Nickel), maginito alloys, AuSn (Gold-Tin Eutectic), ndi zina zotero.

**Kutha kwa Njira:** Imathandizira kuyika kwa mkuwa wokhuthala mpaka 100µm, kudzaza kapangidwe ka High Aspect Ratio (HAR), ndi kudzaza ma node okhala ndi Critical Dimensions (CD) yochepera 22nm.

**Mulingo Wodzipangira:** Kapangidwe kake ka zipinda zambiri zodzipangira zokha; kamathandizira ma protocol odzipangira okha a fakitale monga SECS/GEM; imagwirizana ndi ma SMIF ndi ma FOUP wafer transfer pods.

Kuyerekeza ndi pulogalamu ya ACM ULTRA ECP

Monga wosewera wofunikira kwambiri pazida zopangira ma semiconductor plating, makinawa ali osiyana kwambiri ndi a ACM Research ULTRA ECP app-p—chitsanzo chomwe mudafunsapo kale. Kusankha pakati pa ziwirizi kumadalira zomwe mukufuna pa ndondomeko yanu.

**Miyeso Yoyerekeza** | **Zinthu Zogwiritsidwa Ntchito Raider Edge ECD** | **ACM Research ULTRA ECP ap-p**

**Ukadaulo Wapakati** | Imayang'ana kwambiri pakuyika ma wafers olondola kwambiri | Ukadaulo wopita patsogolo woyika ma plaster opingasa pa ma panel level substrates

**Substrate yolunjika** | Ma wafer a 150mm - 300mm | mapanelo a 510mm x 515mm

**Ubwino Waukulu** | Chiyerekezo cha mafakitale; kukhwima kwaukadaulo; zenera lalikulu la njira | Zimadzaza kusiyana kwa mafakitale; zimathandiza kupanga zinthu zambiri pamlingo wa panel kukhala kotsika mtengo

**Kuyang'ana Kwambiri** | Imalimbikitsa kulumikizana bwino ndi njira zolumikizirana za kutsogolo | Yopangidwira makamaka Fan-Out Panel-Level Packaging (FOPLP)

Mphamvu yeniyeni ya Raider Edge ECD ili mu kusintha kwake: poyamba inali ukadaulo wogwiritsidwa ntchito polumikiza mkuwa pa node ya 22nm, yasanduka nsanja yosinthika kwambiri yomwe imatha kuthandizira njira zosiyanasiyana zapadera - kuyambira zinthu zamaginito mpaka ma phukusi apamwamba - motero ikuwonetsa kukula kwake kwakukulu.