SAKI smt 2D aoi mashiinka kormeerka indhaha ee tooska ah BF-10D

SAKI BF-10D waa qalab kormeer indho-indhayn oo toos ah oo 2D ah (AOI) oo ay soo saartay SAKI ee Japan, loogu talagalay PCB-ga aadka u saxsan (sida substrate IC, FPC, guddiga cufnaanta sare ee HDI). Astaamaha asaasiga ah waa xallinta 10μm ee ogaanshaha iyo nidaamka iftiinka wada-shaqeynta badan, kaas oo la qabsan kara baahiyaha ogaanshaha cilladaha kakan ee qaybaha yaryar (sida 01005, 008004) iyo kala-goysyada alxanka oo aad u milicsan.

2. Mabda'a shaqada

2.1 Nidaamka sawirka indhaha

Beer dhalaalaya (goob dhalaalaysa) tignoolajiyada isha iftiinka badan:

Qabo 8-jiho barnaamijeed toosan LED ah (casaan / cagaar / buluug / caddaan / infrared isku dhafka ah), iyada oo loo marayo sifooyinka milicsiga ee hirarka kala duwan ee ilaha iftiinka, kor u farqiga u dhexeeya kala-goysyada alxanka iyo substrates.

Naqshadeynta waddada indhaha ee Coaxial: baabi'inta faragelinta iftiinka nalka oo hubi xasilloonida sawirka.

Kaamirada iskaanka ee xariiqda sare leh:

Ku qalabaysan 10μm/pixel kamarad heer warshadeed ah (ikhtiyaar ah 5μm/pixel), hal iskaan ayaa daboosha goob weyn oo muuqaal ah (FOV), iyadoo lagu xisaabtamayo saxnaanta iyo hufnaanta labadaba.

2.2 Caqliga ogaanshaha cilladda

Algorithm ogaanshaha saddex-heer:

Isbarbardhiga joomatari: Is barbar dhig leexinta booska qaybta iyo koontaroolka qaabka caadiga ah (sida bedelka iyo wareega).

Falanqaynta cabbirka cirrada: Aqoonso kala-goysyada alxanka qabow, kubbadaha alxanka, buundooyinka, iwm. iyada oo loo marayo qaybinta dhalaalka kala-goysyada alxanka.

Kala soocida AI: Kala soocida cilladaysan ee ku salaysan barasho qoto dheer (sida farqiga u dhexeeya burburka kubbadda alxanka BGA iyo niyad jabka caadiga ah).

3. Naqshadaynta qalabka

3.1 Qaab dhismeedka makaanikada

Saldhig marmar ah + mashiinka toosan:

Eber saldhigga qallafsanaanta kulaylka si loo hubiyo xasilloonida muddada-dheer (heerkulka <± 2μm/℃).

Matoor toos ah, xawaaraha iskaanka wuxuu gaari karaa 500mm/s, iyo saxnaanta meelaynta soo noqnoqda waa ± 3μm.

Isku xirka isha nalka modular:

Waxay taageertaa beddelka degdegga ah ee modules-yada LED-ka si ay ula qabsato iibiyeyaasha kala duwan (sida SAC305-ka xorta ah ee rasaasta waxay u baahan tahay ogaanshaha kaaliyaha infrared).

3.2 Qaybaha asaasiga ah

Qaybaha Tilmaamaha Shaqada

Kamarada ugu weyn 10μm/pixel CMOS toosan array (12k pixels) Helitaanka sawir sax ah oo sare

Kaamirada caawinta 20μm/pixel shutter array caalami ah Si degdeg ah u hel barta calaamadda

Xakamaynta isha iftiinka 16-channel hagaajinta PWM ee madaxa banaan Kontoroolka firfircoon ee xoojinta iftiinka

4. Hawlaha Software

4.1 Shaqada ogaanshaha

Ogaanshaha barta alxanka:

SMT barta alxanka: Aqoonso faaruqinta BGA (heerka ogaanshaha>99%), barta alxanka dhinaca QFN oo leh daasad yar.

Barta alxanka daloolka-hole: Falanqaynta heerka wax-ka-qabashada tin (taageeray ikhtiyaarka fiyuuska xogta raajada).

Ogaanshaha qaybaha:

01005 qeeybta xabaasha, leexashada dhinac, dabada gadaale.

Isku xidhaha biinanka isku xidha (iska dhig dhererka ilaa sawirka 2D).

4.2 Caawinta caqliga

Isku xirka SPI: Si toos ah ugu dhig xogta daabacaadda koollada alxanka oo saadaali cilladaha iman kara (sida koollada alxanka oo aan ku filnayn taasoo horseedaysa alxanka qabow).

Maktabadda kala soocidda NG: heerarka cilladaha caadada ah (Critical/Major/Yar), oo ku habboon heerarka kala duwan ee macaamiisha.

5. Halbeegyada waxqabadka

Qiyaasta Qaybta

Cabbirka PCB Ugu Yar 50mm × 50mm, ugu badnaan 600mm × 500mm (la fidin karo)

Xawaaraha ogaanshaha 0.15 ~ 0.3 ilbiriqsi/barta la ogaado (waxay kuxirantahay kakanaanta)

Qaybta ugu yar 008004 (0.25mm×0.125mm)

Nidaamka isgaarsiinta SECS/GEM, OPC UA, Modbus TCP

Shuruudaha korontada AC 200V± 10%, 50/60Hz, isticmaalka korontada ≤2kW

6. Codsiga warshadaha

6.1 Xaalad caadi ah

Substrate IC: Ogaanshaha xabagta haraaga xaashida naxaasta ah iyo horumarka liidata ee suufyada yar yar (≤50μm).

Wareeg dabacsan (FPC): dildilaaca alxanka ee aagga foorarsiga (waxaa qabsaday isha iftiinka xagal badan).

Qalabka elektaroonigga ah: Tijaabada la isku halleyn karo ee la kulma heerarka AEC-Q100 (sida dildilaaca alxanka heerkulka sare).

6.2 Kiisaska macaamiisha

Soo saaraha semiconductor weyn: loo isticmaalo ogaanshaha cilad ee baakadaha 2.5D interposer, oo leh qaylodhaan been abuur ah <0.05%.

Hormuudka soosaarayaasha taleefannada gacanta: Baadhitaanka shaashadda Motherboard-ka FPC, oo beddelaya xalka 3D AOI ee asalka ahaa si loo yareeyo kharashyada 30%.

7. Faa'iidooyinka tartanka

Xakamaynta saxda ah ee isla heerka: 10μm xallinta ayaa hogaaminaysa suuqa guud ee qalabka 20μm (sida Omron VT-S730).

Dabacsanaanta isha iftiinka: Isku-dhafka-muuqaalka-badanaa wuxuu xalliyaa dhibaatada is-waafajinta ee kala-goysyada alxanka sare/matte.

Fur API: Taageer horumarka sare ee macmiilka iyo ogaanshaha macquulka ah ee la habeeyey.

8. Isbarbardhigga dhibcaha cusboonaysiinta ee BF-TristarⅡ

Waxa ku jira BF-10D BF-TristarⅡ

Xallinta 10μm (ikhtiyaarka 5μm) 10μm

Qaybta ugu yar 008004 01005

Isha iftiinka kanaalka 16 kanaal la bar-barangaran karo 8 kanaal ayaa go'an

Interface Data OPC UA (Industry 4.0 ku haboon) SECS/GEM

9. Kooban

SAKI BF-10D waxay noqotay aaladda 2D AOI ee heerka sare ah ee PCB-dhamaadka sare iyo baakadaha semiconductor-ka iyadoo leh "xakamaynta saxda ah ee saxda ah + iskaashiga multi-spectral + AI xiran loop" isku darka tignoolajiyada, gaar ahaan ku habboon xaaladaha wax soo saarka sare ee raacaya cilladaha eber ppm.