Inika uluhlu olubanzi lwezixhobo eziphezulu ze-semiconductor ukuxhasa zonke izigaba zenkqubo yokuvelisa i-semiconductor. Ukusuka kwimveliso ye-wafer ukuya ekupakishweni, izixhobo zethu ziqinisekisa ukuchaneka, ukusebenza kakuhle kunye nokuthembeka, okwenza iinkampani zikwazi ukuhlangabezana neemfuno ezikhulayo zeshishini lombane.
Umatshini wokuhlela we-ASM i-MS90 sisixhobo esenzelwe ukuhlenga-hlengisa iintsimbi zesibane, esinemisebenzi esebenzayo nechanekileyo yokuhlela. Esi sixhobo siveliswe yi-ASM brand, imodeli ye-MS90, ilungele ukuhlela isibane sesibane se-LED...
Umvavanyi we-TRI ICT TR5001T ngumvavanyi onamandla we-intanethi, ofanelekileyo ngakumbi kuvavanyo olusebenzayo lwesekethe evulekileyo kunye neebhodi ezithambileyo ze-FPC. Umvavanyi mncinci kwaye ukhaphukhaphu, kwaye unokunxibelelana ngokulula...
Umvavanyi we-TRI ICT TR518 SII sisixhobo esibanzi sovavanyo lwe-elektroniki, esisetyenziswa kakhulu ukufumanisa ukusebenza kombane kwiibhodi zesekethe ukuqinisekisa ukuba umgangatho weemveliso uyahlangabezana nemigangatho...
Umatshini wokubumba we-BESI's AMS-X ngumatshini wokubumba we-servo hydraulic ophucukileyo oneengenelo ezininzi kunye neempawu
Umatshini wokubumba we-BESI we-MMS-X yinguqulelo yesandla yomatshini wokungunda we-AMS-X. Isebenzisa ipleyiti yokushicilela esandula ukuphuhliswa enesakhiwo esibambene ngokugqithisileyo nesiqinileyo ukufumana isiphelo esigqibeleleyo, esingenambane...
Umsebenzi we-FML womatshini wokubumba we-BESI usetyenziswa ikakhulu kulawulo oluchanekileyo kunye nolawulo ngexesha lokupakishwa kunye nenkqubo ye-electroplating.
Umsebenzi ophambili womatshini we-BESI we-AMS-LM kukucubungula ama-substrates amakhulu kunye nokubonelela ngemveliso ephezulu kunye nokusebenza kakuhle kunye nemveliso. Umatshini uyakwazi ukusetyenzwa 102 x 280 mm substrates ...
I-AMS-i kumatshini wokubumba we-BESI yindibano ezenzekelayo kunye nenkqubo yovavanyo eveliswa yi-BESI. I-BESI yinkampani ye-semiconductor kunye ne-microelectronics yokuvelisa izixhobo ezikomkhulu eNetherlands...
I-AD420XL ibonelela ngesantya esiphezulu, ukuchaneka okuphezulu kunye nokubeka izisombululo ze-Mini ze-LED COB zobukhulu obukhulu be-LCD BLUs (ye-dimming yendawo) kunye ne-ultra-fine pitch displays ye-LED, enobuchule obuncinci bokuphatha i-chip, ...
I-SD8312 ye-ASMPT's SD8312 ezenzekelayo ezenzekelayo ngokupheleleyo inkqubo ye-solder die bonder sisixhobo esiphucukileyo esenzelwe ukusetyenzwa kwe-wafer ye-intshi eyi-12, enobuchule obuphezulu bokwenza isakhelo kunye nebhondi ekhokelela ekufeni...
Iinkcazo kunye nemilinganiselo ye-ASMPT yenkqubo yokudibanisa ukufa ngokuzenzekelayo zezi zilandelayo: Imilinganiselo: W x D x H 1,970 x 1,350 x 2,190 mm
I-AD838l kunye ne-disk bonding ezenzekelayo ngokupheleleyo kunye ne-flip chip system sisixhobo se-bonding ephezulu esichanekileyo kwaye sisebenza ngokufanelekileyo, sisetyenziselwa imveliso ezenzekelayo yokupakishwa kwe-semiconductor...
Iimpawu ● Isizukulwana esitsha somthamo ophezulu we-AD8312 uthotho lwe-die bonders lumisela imigangatho emitsha kushishino ● uyilo olusetyenzwa ngokubanzi, olulungele ukusetyenzwa kwezakhelo zelothe ezinoxinano oluphezulu ● Ifumaneka kwiindawo ezininzi...
Iimpawu ●Isakhono sokudityaniswa kocingo oluncinci, olukhethekileyo kwiimveliso zokupakisha ezikwinqanaba eliphezulu ●Uyilo oluphezulu oluchanekileyo olujikelezayo lwe-welding ● Umsebenzi weZhuanli "PR on the Fly" ●Isebenza ngokugqithisileyo ...
Iimpawu ● 30% UPH uphuculo ● Usetyenziso olusekwe kucingo lwekopha oluqhelekileyo ● 22μm ibhola yesoda ● Izakhono zobuchwephesha, ibhola ye-solder inokuba ncinane njenge-22μm kwimeko yomgca we-0.5mil ● Ukusetyenziswa kwe-high-end ye-ultra-fine ...
Iimpawu ● Isantya esiphezulu sokubophelela ucingo ● 1588 (imigca eyi-128) umthamo weyure: 21,500+ imigca ● Iityhubhu yedijithali enemilo esibhozo (imigca eli-16): 14,500+ imigca ● Ixhotyiswe ngeengcingo eziyi-4" ububanzi ukuya ...
Iimpawu●Ukuchaneka ± 3 µm @ 3s●Ukukhupha iglu/ijetting ukwenzela ukuba kudityaniswe idie ●Imvelaphi yezinto ezilandelekayo zolawulo oluphuculweyo lomgangatho ● Uyilo lwentloko ethengiswayo enelungelo elilodwa lomenzi wechiza ● Ukuya kuthi ga ku-8” x 8” Ukuphathwa kwesubstrate ● Iinketho ●...
I-Yamaha YSH20 flip chip mounter yi-speed-speed, i-high-precision mounter ifanelekile ukuxhoma amacandelo ahlukeneyo.
Iimpawu●Uchaneka ± 12.5 µm @ 3s●Iyakwazi ukusetyenzwa ngokuthe ngqo ii-substrates ze-ceramic●Inkqubo egqwesileyo kunye noyilo lwemodyuli●Ulawulo oluzimeleyo lokubuyiswa kwekristale kunye neenkqubo zecrystal bonding ●Ixhotyiswe nge-IQC syst...
Iimpawu●Inkqubo ye-LED-specific high-speed high-speed wire bonding ●I-architecture entsha ye-hardware, kulula ukuyigcina ●Isisombululo esiphezulu sentloko ye-welding, ukuchaneka kunokufikelela kwi-40nm●Ikhabhinethi ye-EFO ehlaziyiweyo ithatha i-spark ecandiweyo ...
Abaxhasi bethu bonke baphuma kwiinkampani ezinkulu ezichaziweyo ngokubanzi.
Amanqaku oBuchule be-SMT
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Finyelela kwiqela lethu lezentengiso ukuze ujonge izisombululo ezilungiselelweyo ezihlangabezana ngokugqibeleleyo neemfuno zeshishini lakho kwaye ulungise nayiphi na imibuzo onokuba unayo.
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