ASM E BY DEK ekyuma ekikuba ebitabo

DEK E by DEK ye mulembe omupya ogwa fully automatic high-precision solder paste printer eyatongozebwa kkampuni ya ASM Assembly Systems (eyali DEK). Ekoleddwa ku layini z’okufulumya ez’omulembe eza SMT (surface mount technology) era esaanira okukuba precision solder paste printing ya high-density PCBs (nga motherboards z’amasimu, ebyuma by’emmotoka, ne modules za 5G). Omuze guno gwongera okulongoosebwa ku musingi gwa DEK TQL, nga guwa sipiidi eya waggulu, obutuufu, n’emirimu egy’amagezi okutuukiriza ebyetaago bya Industry 4.0.

2. Omusingi gw’okukola

Okutambuza kwa PCB n’okuteeka mu kifo

PCB eyingira mu kifo ky’okukuba ebitabo ng’eyita mu luguudo lw’okutambuza, etereezebwa enkola y’okusiba, era kkamera ya CCD ey’obulungi obw’amaanyi etegeera ekifo kya Mark okusobola okukwatagana obulungi.

Okusiba akatimba k’ekyuma

Ekyuma ekiyitibwa steel mesh ne PCB biyungibwa nga bikozesebwa vacuum adsorption oba mechanical clamping okukakasa nti tewali bbanga (ekisumuluzo okukosa omutindo gw’okukuba ebitabo).

Okukuba ebitabo mu solder paste

Ekisekula (ekyuma oba polyurethane) kinsika ekikuta kya solder ku puleesa, enkoona, ne sipiidi eziteekeddwawo, ne kikulukuta okuyita mu kifo ekiggulwawo kw’akatimba k’ekyuma okutuuka ku paadi ya PCB.

Okuggya ebikuta n’okuzuula

Akatimba k’ekyuma kaawulwa ku PCB (sipiidi y’okufulumya ekyuma etereezebwa), era ebika ebimu bisobola okuteekebwamu 3D SPI (solder paste detection) okulondoola omutindo gw’okukuba ebitabo mu kiseera ekituufu.

III. Ebirungi Ebikulu

Ebirungi Ennyonnyola

Ultra-high precision ±15μm okukuba ebitabo obutuufu (Cpk≥1.33), ewagira 01005 ebitundu ne 0.3mm eddoboozi BGA.

Okufulumya okw’amaanyi Okutuuka ku 400mm/s sipiidi y’okukuba ebitabo, obudde bw’okukyusa layini

Intelligent closed-loop control Okutereeza mu kiseera ekituufu puleesa ya scraper ne demolding speed okukakasa consistency.

Modular design Scrapers, visual systems, ne cleaning modules zisobola okukyusibwa amangu okukendeeza ku budde obutakola.

Industry 4.0 compatible Ewagira MES/ERP docking okutuuka ku kulondoola data n'okulondoola okuva ewala.

4. Ebikulu ebikwata ku nsonga eno

Ebikwata ku Parameters

Sayizi ya PCB esinga obunene 510 × 460 mm

Obutuufu bw’okukuba ±15μm (3D SPI models zisobola okutuuka ku ±10μm)

Sipiidi y’okukuba ebitabo 50–400 mm/s (esobola okuteekebwateekebwa)

Puleesa ya scraper range 5–30 kg (okuddamu kwa puleesa okw’amagezi) .

Obuwanvu bwa stencil obuwanirira mm 0.1–0.3

Sipiidi y’okuggya ekikuta 0.1–5 mm/s (etereezebwa)

Amaanyi ageetaagisa 220VAC/50-60Hz, 2.0kW

Puleesa y’ensibuko y’empewo 0.5–0.7 MPa

5. Ebintu ebikulu

1. Enkola y’okusenya ey’amagezi

Adaptive pressure control: Teekateeka puleesa ya scraper mu ngeri ey’otoma okusinziira ku steel mesh tension okwewala okukulukuta kwa solder paste oba solder obutamala.

Dual scraper design: Ewagira okukuba ebitabo mu ngeri emu/ebiri okusobola okutuukiriza ebyetaago by’enkola eby’enjawulo.

2. Okukwatagana kw’ebifaananyi okw’omulembe

10μm-level CCD camera: Ewagira precise alignment ya PCB ne steel mesh, era ekyasobola okuzuulibwa ne bwe kiba nti mark point efuuse encaafu katono.

3D SPI integration (optional): Okuzuula mu kiseera ekituufu obuwanvu n’obunene bwa solder paste okuziyiza ebintu ebiriko obuzibu okukulukuta mu nkola ya patch.

3. Okwoza akatimba k’ekyuma mu ngeri ey’otoma mu bujjuvu

Okwoza mu ngeri eziwera: okusiimuula okukalu, okusiimuula ennyogovu, okugatta okusikiriza mu vacuum okukendeeza ku bisigalira bya solder paste (osobola okuteekebwawo okuyonja mu ngeri ey’otoma oluvannyuma lwa buli N okukuba ebitabo).

4. Dizayini enyangu okukozesa

Touch screen HMI: Graphical enkola interface, okuwagira okunyiga omulundi gumu recipe okuyita.

Enkyukakyuka ya layini ey’amangu: Okukyusa sayizi ya PCB kutereeza mu bujjuvu mu ngeri ey’otoma okukendeeza ku nsobi z’abantu.

VI. Emirimu n’emirimu

1. Emirimu emikulu

High-precision solder paste printing: Kakasa nti welding okwesigika kw’ebitundu fine-pitch.

Intelligent process optimization: Okuwandiika mu ngeri ey’otoma parameters z’okukuba ebitabo era n’okuteesa ku nteekateeka ezisinga obulungi okuyita mu AI algorithms.

Okuziyiza obulema: 3D SPI mu kiseera ekituufu okuddamu okukendeeza ku muwendo gw’okuddamu okukola.

2. Omulimu mu layini y’okufulumya SMT

Okwongera amakungula: Okukendeeza ku buzibu mu kuweta nga okusoda mu nnyonta n’okukola omukutu.

Okukendeeza ku nsaasaanya: Okukendeeza ku kasasiro wa solder paste n’okukendeeza ku bwetaavu bw’okuyingira mu nsonga mu ngalo.

Okufulumya okukyukakyuka: Okukwatagana n’ebiragiro eby’enjawulo, ebitonotono (nga ebyetaago by’ebyuma by’emmotoka ebikoleddwa ku mutindo).

VII. Okwegendereza mu kukozesa

1. Obutonde n’okussaawo

Okufuga ebbugumu n’obunnyogovu: 23±3°C, 40-60%RH, okuziyiza ekikuta kya solder okukala.

Okutebenkera kw’ensibuko y’empewo: Puleesa y’empewo yeetaaga okubeera ennywevu ku 0.5–0.7MPa, era enkyukakyuka zijja kuleeta okukuba ebitabo okutali kwa bwenkanya.

2. Ebikwata ku nkola y’emirimu

Enzirukanya ya solder paste: Ddamu okubugumya okumala essaawa 4 + okutabula okumala eddakiika 3 okwewala okukuŋŋaanyizibwa.

Okuddaabiriza akatimba k’ekyuma: Kebera okusika buli lunaku (≥35N/cm2) era oyoze ebisenge buli kiseera.

Okuddaabiriza ebisenya: Ebisenya ebyuma bikyusibwa buli luvannyuma lwa myezi 3, ate ebisekula ebya polyurethane bikeberebwa oba byambala buli wiiki.

3. Okulongoosa enkola

Sipiidi y’okuggya ekikuta: 0.3–1mm/s esengekeddwa, ya mangu nnyo era nnyangu okusika ensonga.

Enkoona y’okusenya: ebiseera ebisinga 45–60°, enkoona entono ennyo ekosa ebbaati.

8. Ensobi eza bulijjo n’okugonjoola ebizibu

1. Ensobi: Okulaganya okulaba kulemereddwa

Ebiyinza okuvaako ensonga eno:

Mark point contamination oba obutafumiitiriza bumala.

Lenzi ya kkamera ncaafu oba ensibuko y’ekitangaala si ya bulijjo.

Okugonjoola:

Okwoza ekifo kya PCB Mark era otereeze okumasamasa kw’ensibuko y’ekitangaala.

Ddamu okupima ekifo kya kkamera.

2. Ensobi: Ensobi mu Puleesa ya Squeegee

Ebiyinza okuvaako ensonga eno:

Sensulo ya squeegee okulemererwa oba okukyukakyuka kwa scraper.

Puleesa y’empewo obutamala ereeta puleesa okukyukakyuka.

Okugonjoola:

Kaliba sensa ya puleesa.

Kebera ekkubo ly’empewo era okyuse ekyuma ekisekula ekyambala.

3. Ensobi: Ensobi mu kukwata Stencil

Ebiyinza okuvaako ensonga eno:

Stencil teteekeddwa bulungi oba ssiringi ekwata (clamping cylinder) eriko ekikyamu.

Okugonjoola:

Ddamu otikka stencil era okebere enkola y’okusiba.

Okwoza n’okusiiga ebisenge bya silinda.

4. Ensobi: Ensobi mu nkola y’empewo (enkola y’empewo okulemererwa) .

Ebiyinza okuvaako ensonga eno:

Puleesa y’ensibuko y’empewo etamala oba okukulukuta kwa payipu z’empewo.

Okugonjoola:

Kebera puleesa efuluma mu kompyuta y’empewo (≥0.5MPa).

Kebera oba interface ya payipu y’empewo ekulukuta.

IX. Ebiteeso ku ndabirira

Ebintu eby’okuddaabiriza Frequency Operation content

Okwoza olutindo Buli lunaku Siimuula olutindo n’olugoye olutaliimu nfuufu okwewala okusigaza ekikuta kya solder.

Okuzuula okusika omuguwa kwa stencil Buli wiiki Kozesa mita y’okusika okupima n’okukakasa nti ≥35N/cm2.

Okukebera ebyuma ebisekula buli mwezi Kebera oba byambala era okyuse bwe kiba kyetaagisa.

Okupima enkola y’okulaba buli luvannyuma lwa myezi esatu Kozesa olubaawo lw’okupima olwa bulijjo okutereeza ebipimo bya kkamera.

Okufulumya amazzi mu ffilta y’empewo Buli mwezi Ziziyiza obunnyogovu okuyingira mu bitundu by’empewo.

X. Mu bufunze

DEK E by DEK ye nkola ennungi ku layini z’okufulumya SMT ez’omulembe nga zirina obutuufu obw’amaanyi ennyo, okufuga okw’amagezi, n’okukwatagana ne Industry 4.0. Okuyita mu nkola ey’omutindo, okuddaabiriza okuziyiza, n’okugonjoola ebizibu mu bwangu, obulungi bw’ebyuma n’amakungula g’okukuba ebitabo bisobola okulinnyisibwa. Ku nsobi enzibu (nga ensobi mu nkola ya servo), kirungi okutuukirira abayambi ab’ekikugu abatongole aba ASM oba okukozesa sipeeya ow’olubereberye okuddaabiriza.