SAKI 3D SPI 3Si LS2

SAKI 3D SPI 3Si LS2 nkola ya 3D ey’okukebera solder paste, okusinga ekozesebwa okuzuula omutindo gw’okukuba solder paste ku printed circuit boards (PCBs).

Ebintu ebikulu n’embeera z’okukozesa

SAKI 3Si LS2 erina ebintu bino ebikulu:

High precision: Awagira resolutions ssatu eza 7μm, 12μm ne 18μm, ezisaanira high-precision solder paste okuzuula ebyetaago.

Obuwagizi bwa format ennene: Buwagira sayizi za circuit board okutuuka ku yinsi 19.7 x 20.07 (500 x 510 mm), ezisaanira embeera ez’enjawulo ez’okukozesa.

Z-axis solution: Omulimu omuyiiya ogwa Z-axis optical head control gusobola okwekenneenya ebitundu ebya waggulu, ebitundu ebikutte ne PCBAs mu fixture, okukakasa okuzuula obulungi ebitundu ebya waggulu.

Okuzuula mu ngeri ya 3D: Ewagira emitendera gya 2D ne 3D, ng’obugulumivu obusinga obunene butuuka ku mm 40, nga busaanira ebitundu ebizibu ebiteekebwa ku ngulu.

Ebikwata ku by’ekikugu n’ebipimo by’omutindo gw’emirimu

Ebikwata ku by’ekikugu n’ebipimo by’omutindo gwa SAKI 3Si LS2 mulimu:

Okusalawo: 7μm, 12μm ne 18μm

Sayizi ya bboodi: Esinga obunene yinsi 19.7 x 20.07 (500 x 510 mm)

Obugulumivu obusinga obunene okupima: mm 40

Sipiidi y’okuzuula: Square milimita 5700 buli sikonda

Okuteeka akatale mu mbeera n’okwekenneenya abakozesa

SAKI 3Si LS2 eteekeddwa ku katale ng’enkola ey’okukebera solder paste eya 3D mu ngeri entuufu ennyo mu makolero ezeetaaga okuzuula mu ngeri entuufu. Okwekenenya kw’abakozesa kulaga nti enkola eno ekola bulungi mu butuufu bw’okuzuula n’obulungi, era esobola okulongoosa ennyo obulungi bw’okufulumya n’omutindo gw’ebintu.