paper sizealambre Bonder AB550 is a high performance ultrasonic alambre bonder with many advanced functions and features
2024-12-10KS MAXUM PLUS alambre bonding makina is a fully automatic alambre bonding makina, mainly used for internal lead welding of light-emitting diodes, small and medium-sized power transistors, integrated circuits and some special semiconductor devices. It is sui
2024-11-12KSalambreAng Bonder 8028PPS ay ganap na awtomatikoalambre bonding makina, pangunahing ginagamit sa larangan ng LED packaging equipment. Ito ay may mga katangian ng mataas na kapangyarihan at kayang hawakan ang mataas na kapangyarihan na 1W, 3W na pinagsamang mga gawain sa hinang
2024-11-12KAIJO-FB900 is a fully automatic gold alambre bonding makina, pangunahing ginagamit para sa gintoalambre bondingsa proseso ng produksyon ng LED packaging
2024-11-12Mga Tampok●30% na pagpapabuti ng UPH●Aplikasyon batay sa karaniwang tansoalambre●22μm solder ball●Expert skills, solder ball ay maaaring kasing liit ng 22μm sa kaso ng 0.5mil line●High-end na application ng ultra-fine 30μm solder jointsIba pang mga configuration upang iangkop sa
2024-11-10Mga Tampok●Micro-pitchalambre bondingkakayahan, dalubhasa sa mga advanced na produkto ng packaging●High-precision rotary welding head na disenyo●Zhuanli "PR on the Fly" function●Extremely large effectivealambre bondingrange●Sinusuportahan ang sari-saring disenyo ng fixture
2024-11-10FeaturesExcellent performance●UPH increased by up to 30%●In traditional copper alambre applications●Ball size up to 22 μm●Professional engineering design reduces ball diameter to 22 μm at 0.5mil alambre diameter●Applicable to 30µm●Other features include●Pre-set
2024-11-10Mga Tampok● Mataas na bilisalambre bondingkakayahan● 1588 (128 linya) oras-oras na kapasidad: 21,500+ linya● Dobleng walong hugis digital na tubo (16 linya): 14,500+ linya● Nilagyan ng 4" na diameteralambrehanay upang makatipid ng oras sa paglo-load at pagbabawas ● Micro-pad handling cap
2024-11-10Mga tampok●mataas na bilis na partikular sa LEDalambre bondingsystem●Bagong arkitektura ng hardware, madaling mapanatili●Mataas na resolution ng welding head, ang katumpakan ay maaaring umabot sa 40nm●Ang makabagong EFO cabinet ay gumagamit ng naka-segment na spark formation para sa hindi gintoalambre●Mas mahusay na FAB shape control●Ne
2024-11-10Leverage Geekvalue’ s expertise and experience to elevate your brand to the next level.
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