ASMLanguagewaayaBonder AB550 ye ultrasonic ekola obulungiwaayabonder nga erina emirimu mingi egy’omulembe n’ebintu
2024-12-10KS MAXUM EKYOKUGATTAKOwaaya okukwatagana (bonding). masiiniye ya otomatiki mu bujjuvuwaaya okukwatagana (bonding). masiini, okusinga ekozesebwa mu kuweta omusulo ogw’omunda ogwa dayode ezifulumya ekitangaala, transistors z’amaanyi entono n’eza wakati, integrated circuits n’ebyuma ebimu eby’enjawulo ebya semiconductor. Kiba sui
2024-11-12KSwaayaBonder 8028PPS ya otomatiki mu bujjuvuwaaya okukwatagana (bonding). masiini, okusinga ekozesebwa mu kisaawe ky’ebyuma ebipakinga LED. Eriko engeri z’amaanyi amangi era esobola okukola emirimu gy’okuweta amaanyi amangi 1W, 3W integrated welding
2024-11-12KAIJO-FB900 zaabu ya otomatiki mu bujjuvuwaaya okukwatagana (bonding). masiini, okusinga ekozesebwa ku zaabuwaaya okukwatagana (bonding).mu nkola y’okufulumya ebipapula bya LED
2024-11-12Ebirimu●30% UPH improvement●Okukozesa nga kwesigamiziddwa ku kikomo ekya bulijjowaaya●22μm solder ball●Obukugu obw'ekikugu, solder ball esobola okuba entono nga 22μm mu mbeera ya 0.5mil line●High-end okukozesa ultra-fine 30μm solder jointsOther configurations okutuukagana ne
2024-11-10Ebirimu●Eddoboozi eritonowaaya okukwatagana (bonding).obusobozi, okukuguse mu bintu eby'omulembe eby'okupakinga●High-precision rotary welding omutwe design●Zhuanli "PR ku Fly" omulimu●Extremely large effectivewaaya okukwatagana (bonding).range●Ewagira dizayini y'ebintu eby'enjawulo
2024-11-10EbirimuOmulimu omulungi●UPH yeeyongedde okutuuka ku bitundu 30%●Mu kikomo eky'ekinnansiwaayaokukozesebwa●Obunene bw’omupiira okutuuka ku 22 μm●Dizayini ya yinginiya ey’ekikugu ekendeeza ku buwanvu bw’omupiira okutuuka ku 22 μm ku 0.5milwaayadiameter●Ekozesebwa ku 30μm●Ebirala ebirimu mulimu●Pre-set
2024-11-10Ebirimu● Sipiidi ya wagguluwaaya okukwatagana (bonding).obusobozi● 1588 (layini 128) obusobozi buli ssaawa: layini 21,500+● Tubu ya digito ey'enkula munaana ey'emirundi ebiri (layini 16): layini 14,500+● Erimu obuwanvu bwa 4"waayarange okukekkereza obudde bw’okutikka n’okutikkula● Micro-pad handling cap
2024-11-10Ebirimu●LED-specific sipiidi ya wagguluwaaya okukwatagana (bonding).enkola●Ensengekera empya eya hardware, ennyangu okulabirira●High resolution of welding head, obutuufu busobola okutuuka ku 40nm●Innovative EFO cabinet adopts segmented spark formation for non-goldwaaya●Okufuga enkula ya FAB ennungi●Ne
2024-11-10Wanderera amateeka agakwata ku Geekvalue ne amateeka agafuba gamu n'okunyuma akatuukirizibwa okukolebwa ku kinnyo eddeyo.
Kifuula puloguramu ebiyinza okubikkula
Kola alipoota era n'enteekateeka ey'ebikola ku byonna ebiyinza okunoonya enkola ezimanyiddwa mu byonna ebiyinza okuzuula ebyetaago byonna era n'okukozesa byonna ebibazi ebiyinza okusobozesa.