asm waya Ekyuma ekigatta ab550

ASM Wire Bonding Machine AB550 ye kyuma ekikola obulungi mu ultrasonic wire bonding machine nga erina emirimu mingi egy’omulembe n’ebintu.

Ebintu eby'enjawulo

Obusobozi bw’okusiba waya ku sipiidi ya waggulu: Ekyuma ekikwata waya ekya AB550 kirina obusobozi bw’okusiba waya ku sipiidi era kisobola okuweta waya 9 buli sikonda.

Obusobozi bw’okuweta mu ngeri ya micro-pitch: Ekyuma kino kirina obusobozi bw’okuweta mu ngeri ya micro-pitch, nga n’obunene bw’ekifo ky’okusoda obutono buba 63 μm x 80 μm ate nga n’ebanga erisinga obutono mu kifo ky’okusoda liri 68 μm.

Dizayini empya ey’entebe y’okukoleramu: Dizayini y’entebe y’okukoleramu efuula okuweta okwangu, okutuufu era okunywevu.

Extra large welding range: A wide range of effective welding wires, ezisaanira okukozesebwa mu bintu eby’enjawulo, okulongoosa obulungi okufulumya.

Dizayini y'okuddaabiriza "Zero": Dizayini ekendeeza ku byetaago by'okuddaabiriza n'okukendeeza ku nsaasaanya y'okufulumya.

Tekinologiya w’okutegeera ebifaananyi: Tekinologiya w’okutegeera ebifaananyi alina patent ayongera ku busobozi bw’okufulumya.

Ebitundu by’okukozesa n’ebirungi ebirimu

AB550 wire bonding machine ekozesebwa nnyo mu kisaawe ky’okupakinga semiconductor era naddala esaanira embeera z’okufulumya ezeetaaga obutuufu obw’amaanyi n’obulungi. Obusobozi bwayo obw’okusiba waya ku sipiidi n’okuweta micro-pitch bugiwa enkizo ennene mu kukola ebyuma era esobola okulongoosa ennyo enkola y’okufulumya n’omutindo gw’ebintu. Okugatta ku ekyo, ekika kyayo ekinene ennyo eky'okuweta n'enkola yaayo ey'okuddaabiriza "zero" byongera okutumbula omuwendo gwayo ogw'okukozesa mu kukola mu makolero