‌ASM wire Bonder AB550 is a high performance ultrasonic wire bonder with many advanced functions and features

‌KS MAXUM PLUS wire bonding machine‌ is a fully automatic wire bonding machine, mainly used for internal lead welding of light-emitting diodes, small and medium-sized power transistors, integrated circuits and some special semiconductor devices. It is sui

KS wire Bonder 8028PPS‌ is a fully automatic wire bonding machine, mainly used in the field of LED packaging equipment. It has the characteristics of high power and can handle high power 1W, 3W integrated welding tasks

KAIJO-FB900 is a fully automatic gold wire bonding machine, mainly used for gold wire bonding in the LED packaging production process

Features●30% UPH improvement●Application based on typical copper wire●22μm solder ball●Expert skills, solder ball can be as small as 22μm in the case of 0.5mil line●High-end application of ultra-fine 30μm solder jointsOther configurations to adapt to the

Features●Micro-pitch wire bonding capability, specialized in advanced packaging products●High-precision rotary welding head design●Zhuanli "PR on the Fly" function●Extremely large effective wire bonding range●Supports diversified fixture design

FeaturesExcellent performance●UPH increased by up to 30%●In traditional copper wire applications●Ball size up to 22 μm●Professional engineering design reduces ball diameter to 22 μm at 0.5mil wire diameter●Applicable to 30µm●Other features include●Pre-set

Features● High-speed wire bonding capability● 1588 (128 lines) hourly capacity: 21,500+ lines● Double eight-shaped digital tube (16 lines): 14,500+ lines● Equipped with 4" diameter wire range to save loading and unloading time● Micro-pad handling cap

Features●LED-specific high-speed wire bonding system●New hardware architecture, easy to maintain●High resolution of welding head, accuracy can reach 40nm●Innovative EFO cabinet adopts segmented spark formation for non-gold wire●Better FAB shape control●Ne