How the Device Enters
Package orientation, surface condition, dimensions and upstream media determine the correct onload configuration.
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Plan the material route, parallel test architecture and package protection around the actual machine.
The FT2026 combines a 26-nozzle turret, support for up to 16 parallel test sites, six-sided vision and several input and output routes. For a buyer, the key question is whether the available machine has the media modules, tester interface, contact hardware and packing automation required by the product.
Reference image and published platform information only. Current availability, installed test sites, media modules, contact functions, vision options, packing automation, software and machine condition must be confirmed for the individual unit.
Open the product page to review the published machine record. Availability, year, installed test sites, tester interface, input and output modules, software, included accessories and refurbishment scope should be confirmed before quotation.
The platform can support several material routes, but the installed loading and unloading modules determine how a specific product can enter, move through and leave the machine.
Package orientation, surface condition, dimensions and upstream media determine the correct onload configuration.
The handler picks, orients, presents, tests, inspects, classifies and routes the device through the installed process stations.
The final route must match the pass, fail or grade logic, customer packing requirement and installed finish modules.
These published values help place the FT2026 in the right project range. The installed configuration of the individual machine still determines the usable test and material-handling setup.
Electrical test time, fitted and usable sites, tester resources and interface mapping determine whether multisite testing improves accepted output.
Nozzles, guides, nests, tray pockets, feeders and other change parts determine whether the device can be presented reliably and without damage.
Contactor condition, force, alignment, six-sided vision, lighting and defect criteria influence yield, retest and package protection.
Tube, tray or tape-and-reel modules, sealing checks, replenishment and reel-change options determine how accepted devices leave the process.
You do not need a complete FT2026 specification to begin. A package drawing, tester reference, media route and production target are enough for us to identify the machine records, configuration points and open questions that matter next.
Not sure the FT2026 is the right platform? Smaller-package projects may be easier to evaluate through the ASMPT FT2018 product record. Broader comparisons can continue through the turret-handler and semiconductor-tester categories when the FT2026 is not the clearest fit.
The published direction is for semiconductor devices larger than 2 × 2 mm², including medium and larger packages. Final suitability also depends on thickness, shape, orientation, surface sensitivity, change parts, input media, contact hardware and output requirements.
No. The platform supports up to sixteen parallel test stations, but the installed quantity, interface mapping and usable test strategy must be confirmed on the individual machine together with the connected tester resources.
Published configurations include vibratory bowl, tube, metal tray and JEDEC tray loading, together with tube, tray and tape-and-reel output directions. The actual installed modules and product-specific change parts must be checked on the candidate machine.
A package drawing, dimensions, incoming media, tester model, approximate test time, desired site count, inspection criteria and final output format are enough to begin. Machine identity, software, modules, tooling and condition can then be checked against the available record.
Share the package, tester, input media and output requirements. We will use the available FT2026 product and machine information to clarify the likely fit, missing configuration points and the scope worth pricing.
Miksi niin monet ihmiset valitsevat GeekValuen?
Brändimme leviää kaupungista toiseen, ja lukemattomat ihmiset ovat kysyneet minulta: "Mikä on GeekValue?" Se juontaa juurensa yksinkertaisesta visiosta: voimaannuttaa kiinalaista innovaatiota huipputeknologialla. Tämä on jatkuvan parantamisen brändihenki, joka piilee yksityiskohtien tavoittelussamme ja odotusten ylittämisen ilossa jokaisella toimituksella. Tämä lähes pakkomielteinen käsityötaito ja omistautuminen ei ole vain perustajiemme sinnikkyyttä, vaan myös brändimme ydin ja lämpö. Toivomme, että aloitat tästä ja annat meille mahdollisuuden luoda täydellisyyttä. Tehdään yhdessä töitä seuraavan "nollavirheellisen" ihmeen luomiseksi.
YksityiskohdatOta yhteyttä myyntiasiantuntijaan
Ota yhteyttä myyntitiimiimme, niin tutustumme räätälöityihin ratkaisuihin, jotka vastaavat täydellisesti yrityksesi tarpeita ja vastaavat kaikkiin mahdollisiin kysymyksiisi.