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Ekizibu ky’okupakinga eky’omulembe

ASM AERO Ekiyungo kya waya | Ekyuma ekigatta waya za Semiconductor ez'omulembe Platform

ASM AERO ye nkola y’ekyuma ekwata waya ey’omulembe oguddako eyakolebwa okupakinga kwa semiconductor okw’omulembe, okutuusa obutuufu obw’amaanyi ennyo, okufuga enkola okunywevu, n’obusobozi bw’okufulumya ku sipiidi ey’amaanyi ku chips za AI, ebyuma by’emmotoka, n’okugatta 2.5D/3D IC.

✔ Okukwatagana okw’obutuufu obw’amaanyi ennyo ku ddaala lya micron/sub-micron
✔ Okufulumya ku sipiidi ey’amaanyi olw’okupakinga kwa semiconductor okw’omulembe
✔ Okukwatagana kw’okulaba mu kiseera ekituufu n’okufuga entambula okukyusakyusa
✔ Erongooseddwa ku AI, HPC, chips ez'omutindo gw'emmotoka
Okubuuza ku WhatsApp
ASM AERO Wire Bonder Machine - Advanced Semiconductor Packaging Equipment
Enkola y’okusiba waya Enkola

Engeri ASM AERO Wire Bonding Gy'ekola

Enkola y’okusiba waya ya ASM AERO yeesigamiziddwa ku nkola ya thermosonic bonding mechanism, nga amasoboza ag’amaloboozi amangi, ebbugumu, n’amaanyi ag’ebyuma bifugibwa bulungi okukola enkolagana ey’ebyuma ennywevu wakati wa chip pads ne substrates.

✔ Omutwe gwa bond gukozesa amaanyi agafugibwa
✔ Okukankana kw’amaloboozi amangi (ultrasonic vibration) kikola okutondebwa kw’ebyuma wakati
✔ Ebbugumu litebenkeza enkolagana y’okukwatagana
✔ Waya loop ekolebwa n'okufuga enkola entuufu
✔ Bond eyookubiri emaliriza okuyunga amasannyalaze
Wire bonding process diagram showing ultrasonic bonding, wire loop formation and chip interconnection

Enzimba y’enkola ya AERO

Enkola y’omutwe gwa Bond
Okufuga amaanyi okunywevu ennyo nga kuliko okunyigiriza okukankana kwa micro-vibration.
Enkola y’okulaba
Okutereeza okukwatagana mu kiseera ekituufu olw’obutuufu bwa sub-micron.
Enkola y’okutambula
Multi-axis adaptive motion control ku nkola enzibu.
Okufuga Enkola
Stable thermal ne loop control okusobola okukola consistency.
Enkola y’okuliisa waya
Okufuga okusika okulungi ku waya ya zaabu/ekikomo/aluminiyamu.
Enkola ya Sofutiweya
Adaptive enkola tuning n'okulondoola mu kiseera ekituufu.

Ebirungi Ebikulu mu by’Obukugu

- Obutuufu bw’okukwatagana obulungi ennyo ku ddaala lya micron/sub-micron
- Enkola ey’omulembe ey’okukwatagana n’okulaba (adaptive vision alignment system).
- Eddirisa ly’enkola enywevu eri okufulumya ebintu mu bungi
- Erongooseddwa okusobola okukola ensengeka z'okupakinga ez'omulembe
- Obusobozi obw’okuyita waggulu mu makolero

Enkola z’okupakinga ez’omulembe

Okupakinga Chips za AI & HPC
Semikondokita z’amaanyi g’emmotoka (SiC / GaN) .
2.5D / 3D IC Okugatta
Ebyuma Ebijjukiza Ebinene (High-Density Memory Devices).
Chips za RF & Empuliziganya ez'omulembe
Ennyiriri za Semiconductor ez’omulembe oguddako

ASM AERO ne Standard Wire Bonder

Ekintu eky'enjawulo ASM AERO Standard Wire Bonder
Puloguramu endala... Okupakinga okw’omulembe (AI, HPC, mmotoka) . Okupakinga kwa IC okwa bulijjo
Obutuufu Obutuufu bwa sub-micron obw’amaanyi ennyo Obutuufu obw’omutindo gwa micron-level
Enkola y’okulaba Okukwatagana okukwatagana mu kiseera ekituufu Okukwatagana kw’okulaba okwa bulijjo
Okufuga Entambula Enkola ya multi-axis adaptive system Okufuga entambula okunywevu
Okutebenkera kw’enkola Erongooseddwa okusobola okufuna eddoboozi erya ultra-fine Okutebenkera kw’okufulumya okw’omutindo

ASM AERO Yinginiya w’enkola y’okusiba waya

Enkola y’okusiba waya ya ASM AERO ya yinginiya okwetoloola enkola y’okukwatagana ey’ebbugumu efugirwa ennyo, ng’amasoboza ag’amaloboozi amangi, ebbugumu, n’amaanyi ag’ebyuma bikwatagana mu ngeri ey’amaanyi okutuuka ku kuyungibwa okunywevu ku butuufu obw’omutindo gwa micron.

Mu kiseera ky’okukola, enkola y’okusiba si nsengekera etakyukakyuka wabula loopu erongooseddwa obutasalako, ng’okuddamu kw’enkola kutereeza parameters mu kiseera ekituufu okukuuma obutebenkevu bw’enkola mu mbeera za substrate ez’enjawulo.

Emisingi emikulu egya yinginiya mulimu:

- Okufuga okuyungibwa kw’amasoboza ag’amaanyi (ultrasonic energy coupling control) okusobola okutebenkera kw’okutondebwa kw’ebyuma wakati - Enkolagana y’ebbugumu wakati w’ebbugumu n’okukankana olw’obulungi bw’enkolagana - Okufuga amaanyi ga loopu enzigale okuziyiza okwonooneka kwa paadi mu kiseera ky’okusiba - Okufuga obugulumivu bwa loopu okukyukakyuka ku bizimbe by’okupakinga ebya density enkulu - Okuliyirira mu kiseera ekituufu olw’enkyukakyuka y’ebintu n’obutabeera bulungi bwa substrate

Enkola y’emirimu gy’enkola ya ASM AERO mu mbeera y’okufulumya

Mu layini y’okufulumya semikondokita, ASM AERO ekola ng’enkola y’okukwatagana mu bujjuvu mu nkola y’emirimu ey’obwengula ey’amaanyi.

Enzirukanya y’okukwatagana eya bulijjo erimu:

1. Wafer or substrate loading into precision stage system 2. Vision-based alignment of bonding pads 3. Bond head positioning with sub-micron correction 4. First bond formation using ultrasonic energy 5. Controlled wire loop formation 6. Second bond connection to substrate or lead frame 7. Wire cut and system reset for next cycle

Buli mutendera gulondoolebwa buli kiseera okukakasa obutuufu bw’ekifo, okutebenkera kwa loopu, n’obutakyukakyuka mu kukwatagana mu mbeera z’okufulumya ez’obuzito obw’amaanyi.

Enkola y’okufuga Parameter

ASM AERO ekuuma obutebenkevu bw’okukwatagana okuyita mu nkola efugibwa ennyo eya multi-parameter eyategekebwa embeera z’okupakinga semikondokita ez’omulembe.

Ebipimo ebikulu eby’okufuga mulimu:

- Okufuga amaanyi g’okusiba okukakasa okukwatagana kwa paadi okunywevu awatali kwonooneka kwa substrate - Okukyusakyusa amaanyi ga ultrasonic okusobola okutondebwawo wakati w’ebyuma obutakyukakyuka - Okulungamya ebbugumu okukuuma eddirisa ly’okusiba ebbugumu - Okufuga okusika omuguwa kw’emmere ya waya okusobola okukwataganya enkola ya loopu ennywevu - Okukwatagana kw’enkola eyesigamiziddwa ku budde okusobola okufulumya ebyuma ebiyita waggulu

Ebipimo bino bitereezebwa buli kiseera mu kiseera ekituufu okusinziira ku biddibwamu okuva mu nkola z’okulaba ne sensa z’entambula, okukakasa nti zikola bulungi wansi w’embeera ez’enjawulo ez’okufulumya.

Emitendera egy’okulemererwa egya bulijjo n’ensonga z’okukyama mu nkola

Mu kukola semikondokita ez’obuzito obw’amaanyi, okutebenkera kw’okukwatagana kwa waya kuyinza okukosebwa olw’okwambala kw’enkola mpolampola n’okukyama kw’enkola okusinga okulemererwa kw’ekyuma okw’amangu.

Ensonga ezitera okwetegereza mulimu:

- Okwambala omutwe gw’ekiyungo mpolampola ekivaako amaanyi g’okusiba agatali gakwatagana - Obujama bw’emisuwa obukosa enneeyisa y’okukyusa waya - Okuwuguka kw’okulaba okuvaako obutakwatagana okutono mu kutunuulira paadi - Obutabeera mu ntebenkevu mu kunyigirizibwa kw’emmere ya waya olw’enkyukakyuka mu kusikagana kw’ebyuma - Okuwuguka kw’ebbugumu okukosa obutakyukakyuka bw’amasoboza g’okukwatagana okumala enzirukanya empanvu ez’okufulumya

Ensonga zino zitera okweyoleka nga enkyukakyuka mu makungula oba obutakwatagana mu kukwatagana okutegeerekeka nga okulemererwa kw’ebyuma okwa nnamaddala tekunnabaawo, ekifuula okuddaabiriza okuziyiza okwetaagisa mu mbeera z’okufulumya.

Ddi lw'olina Okulonda ASM AERO Wire Bonder

ASM AERO esengekeddwa ku mbeera z’okufulumya ezeetaaga:

- Ebyetaago by’okusiba mu ngeri ey’obutuufu ennyo (Ultra-high precision bonding).
- Enzimba y'okupakinga ey'omulembe (2.5D / 3D IC)
- Enkola za kompyuta ezikola obulungi
- Omutindo gw'okwesigamizibwa ogw'omutindo gw'emmotoka
- Okukola semikondokita ez’obuzito obw’amaanyi ezitebenkedde

Ebibuuzo Ebitera Okubuuzibwa

ASM AERO Wire Bonder ekozesebwa ki?
Ekozesebwa mu kupakinga kwa semiconductor okw’omulembe omuli chips za AI, ebyuma by’emmotoka, n’ebizimbe bya IC ebya density enkulu.
ASM AERO esaanira okukola ebintu mu bungi?
Yee, ekoleddwa ku mbeera z’okukola semikondokita ez’obuzito obw’amaanyi ezeetaaga okufuga enkola okunywevu.
Kiki ekifuula ASM AERO ey’enjawulo?
Egatta enkola ey’omulembe ey’okufuga entambula, okukwataganya okulaba mu kiseera ekituufu, ne tekinologiya ow’okukwatagana mu ngeri entuufu ennyo.
Kiyinza okuwagira okupakinga okw’omulembe?
Yee, erongooseddwa okusobola okugatta 2.5D/3D IC n’ebyuma bya semiconductor ebikola obulungi.

Lwaki abantu bangi basalawo okukola ne GeekValue?

Brand yaffe esaasaana okuva mu kibuga okudda mu kirala, era abantu abatabalika bambuuzizza nti, "GeekValue kye ki?" Kisibuka mu kwolesebwa okwangu: okutumbula obuyiiya bw’Abachina nga bakozesa tekinologiya ow’omulembe. Guno mwoyo gwa kika ogw’okulongoosa obutasalako, ogukwese mu kugoberera kwaffe okutasalako okukola buli kantu n’essanyu ery’okusukka ebisuubirwa buli lwe tutuusa. Obukugu buno kumpi obw’okwewaayo n’okwewaayo si kugumiikiriza kwokka kw’abatandisi baffe, wabula n’omusingi n’ebbugumu ly’ekibinja kyaffe. Tusuubira nti ojja kutandikira wano era otuwe omukisa okutondawo obutuukirivu. Tukolere wamu okutondawo ekyamagero ekiddako ekya "zero defect".

Ebikwata ku ddyo

Tuukirira omukugu mu by’okutunda

Tuuka ku ttiimu yaffe ey’abatunzi okunoonyereza ku nkola ezikoleddwa ku mutindo ogutuukana obulungi n’ebyetaago bya bizinensi yo n’okukola ku bibuuzo byonna by’oyinza okuba nabyo.

Okusaba Okutunda

Tugoberere

Sigala ng’okwatagana naffe okuzuula obuyiiya obusembyeyo, ebiweebwayo eby’enjawulo, n’okutegeera okujja okusitula bizinensi yo ku ddaala eddala.

Okutambulira mu Mangu

TUKUTUUKAKO

Endagiriro y’okutuukirira:

No. 18, oluguudo lw’amakolero mu Shangliao, mu kibuga Shajing, mu Disitulikiti y’e Baoan, Shenzhen, China

Ennamba y’essimu ey’okwebuuza:

+86 13823218491

Email:

smt-okutunda3@gdxinling.cn

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