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xhASM wire bonder Eagle Aero Reel to Reel meeshaa wayyaa bonding gahumsa olaanaa qabuu fi oomisha semiconductor paakeejii fi qorannoof qophaa'eedha. Seensa bal’aa kan armaan gadiiti:
Amaloota
Sirrummaa olaanaa: Eagle Aero wire bonder teknooloojii optical positioning sadarkaa olaanaa fi sirna to'annoo sochii sirritti ol'aanaa fudhata, kunis adeemsa wire bonding sirritti ol'aanaa galmaan gahuu danda'a.
Hojii hedduu kan qabu: Gosoota paakeejii adda addaatiif kan mijatu yoo ta’u, kunis QFN, DFN, TQFP, qaphxii LQFP, akkasumas moojuulii optikaalaa COC, qaphxii COB dabalatee.
Gahumsa olaanaa: Sochii saffisa olaanaa fi dalagaalee jijjiirraa wayaa saffisaa ta’een gahumsa oomishaa baay’ee fooyyessuu danda’a.
Hojiidhaaf salphaa: Interfeesii hojii fayyadamaadhaaf mijatu fi sirna to’annoo sammuu qabu qabaachuun, hojiin isaa salphaa fi barachuuf salphaadha.
Seenaa iyyannoo
Eagle Aero wire bonder irra caalaa adeemsa wire bonding keessatti paakeejii semiconductor fi oomisha qorannoo keessatti fayyadama. Qulqullinni hidhata sibiilaa amanamummaa fi raawwii oomisha paakeejii irratti kallattiin dhiibbaa qaba. Kanaafuu, Eagle Aero wire bonder barbaachisummaa wire bonding gosoota paakeejii adda addaa guutuu fi adeemsa wire bonding gahumsaa fi sirrii ta’e kan semiconductor packaging fi oomisha qorannoof kennuu danda’a
