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xhI-ASM wire bonder I-Eagle Aero Reel ukuya kwi-Reel sisixhobo sokubopha ucingo oluphezulu olulungiselelwe ukupakishwa kwe-semiconductor kunye nemveliso yokuvavanya. Oku kulandelayo yintshayelelo eneenkcukacha:
Iimpawu
Ukuchaneka okuphezulu: I-Eagle Aero wire bonder ithatha iteknoloji ye-optical positioning technology kunye ne-high-precision motion control system, enokufezekisa inkqubo yokudibanisa ucingo oluchanekileyo.
I-Multi-function: Ifanelekile kwiindidi zeepakethe ezahlukeneyo, ezibandakanya i-QFN, i-DFN, i-TQFP, i-LQFP yokupakisha, kunye ne-module ye-optical COC, i-COB yokupakisha.
Ukusebenza okuphezulu: Ngokuhamba ngesantya esiphezulu kunye nemisebenzi yokutshintsha ucingo ngokukhawuleza, kunokuphucula kakhulu ukusebenza kwemveliso.
Kulula ukusebenza: Ngojongano lokusebenza olusebenziseka lula kunye nenkqubo yokulawula ekrelekrele, ukusebenza kulula kwaye kulula ukuyifunda.
Imeko yesicelo
I-Eagle Aero wire bonder isetyenziswa kakhulu kwinkqubo yokubopha ucingo kwi-semiconductor yokupakisha kunye nokuveliswa kovavanyo. Umgangatho wokudibanisa ucingo uchaphazela ngokuthe ngqo ukuthembeka kunye nokusebenza kwemveliso epakishweyo. Ke ngoko, i-Eagle Aero wire bonder inokuhlangabezana neemfuno zokubopha ucingo lweentlobo ezahlukeneyo zeepakethe kwaye ibonelele ngenkqubo esebenzayo nechanekileyo yokubopha ucingo lokupakishwa kwe-semiconductor kunye novavanyo lokuvelisa.
