I-ULTRALUX™ PLUS liqonga le-K&S lokudibanisa ibhola eliphezulu lokuvelisa ii-LED ezinkulu nezingabizi kakhulu kunye nee-Mini-LED. Ibekwe ngaphezulu kwe-OptoLux™ Plus, ine-UPH throughput ephezulu, ukuchaneka kwe-bonding ye-2.5μm@3σ, kunye nokukwazi ukuhlanganisa ucingo lwe-copper/silver alloy, ijolise ekuncedeni izityalo zokupakisha ukunciphisa iindleko zemveliso iyonke ngaphezulu kwe-10%. Yenzelwe ngokukodwa ukuvelisa ii-LED zokukhanyisa eziphezulu iiyure ezingama-24 ngosuku, ii-Mini-LED, kunye nezixhobo ze-infrared optoelectronic ezisebenza iiyure ezingama-24 ngosuku, iintsuku ezisixhenxe ngeentsuku ezisixhenxe.
Umatshini opheleleyo we-ULTRALUX™ PLUS
I. Ukubekwa kwezixhobo
I-ULTRALUX™ PLUS yi-K&S's flagship ball bonder yokupakisha i-optoelectronic, igxile kwi-ultrasonic ball bonding interconnects ze-SMD LEDs, ii-LED ezinamandla aphezulu, ii-Mini-LEDs, izixhobo ze-infrared emit/receiving, kunye nee-light sensors, igqibezela i-wire bonding phakathi kwee-chip PADs kunye ne-substrate/support.
Xa kuthelekiswa ne-OptoLux™ / OptoLux™ Plus, uyilo lwentshukumo, umbono, ukhuseleko lwegesi, kunye nekhithi yenkqubo ziphuculwe ngokupheleleyo. Yenzelwe izityalo zokupakisha eziphakathi ukuya kwezinkulu ezilandela imveliso ephezulu, i-copper/silver wire bonding enkulu, kunye ne-small-pad Mini-LEDs, kwaye ayenzelwanga ukupakisha i-IC chips ye-logic ephezulu.
II. Inkqubo yeHardware ePhambili
Inkqubo yeServo ye-XYZ eKhaphukhaphu neQinileyo: Ulwakhiwo lwentshukumo oluncinci noluqinileyo luphucula ukukhawulezisa kwaye lunciphisa ixesha lokungasebenzi; isantya sokubopha ukuya kuthi ga kwimigca engama-25/yesibini (ubude bentambo ye-2mm) sinyusa kakhulu i-UPH; iluphu evaliweyo yoxinzelelo lwe-Z-axis oluchanekileyo kakhulu icinezela umngcipheko wokonakala kwee-electrodes ezincinci, ezifanelekileyo kwimveliso yobunzima eqhubekayo ixesha elide.
Injini Yokubona I-Progressive Scan Vision yesizukulwana esilandelayo (i-PRS): Ilensi encinci ebonakalayo ene-crosshair offset encinci; I-Look-Ahead pre-scan; i-optics yokukhulisa eyi-3.5× (i-OptoLux Plus yi-2×/4×), ilungelelanisa ukuskena okukhulu kwe-field-of-view kunye nokuqondwa kwe-pad encinci; i-algorithm yokuqondwa elungiselelweyo yokubonakalisa okunamandla, umahluko wemibala, kunye nongcoliseko kwizixhobo ezixhasayo nge-electroplated.
Ukulungiswa kwempazamo ngokuzenzekelayo okuphuculweyo kuxhasa ukuzama kwakhona ngokuzenzekelayo kwiimpazamo ezininzi ezifana ne-SHTL, i-NSOP, kunye ne-NSOL, okuphucula kakhulu ixesha eliphakathi le-MTBA kunye nokunciphisa ixesha lokungasebenzi kwe-handwriting.
Inkqubo yokulawula ukuhamba kwegesi ephuculweyo: Yenzelwe ngokukodwa ukwenza iintambo ze-FAB zebhola yomoya okhululekileyo ezenziwe ngeentambo ze-alloy zobhedu nezesilivere, izinzisa umgangatho we-arcing kunye nokwenziwa kweebhola, inciphisa i-oxidation yebhola yobhedu kunye neziphene zesimo sebhola yesilivere. Ngesixhobo sokukhusela esingqongileyo esincinci esinganyanzelekanga, ingaqhuba ngokuthe ngqo iintambo zobhedu nezesilivere kwiibhetshi ezinkulu, ixhasa izisombululo zokunciphisa iindleko zomzi-mveliso.
Iphakheji yenkqubo epheleleyo ye-optoelectronic yeQuick-LED-2 Suite: Idibanisa iQuick Bond, iQuick Stitch, kunye neQuick Loop, elungiselelwe kwangaphambili ngenani elikhulu lee-arc ze-wire arc ezivuthiweyo, i-arcing, kunye neeparamitha zexesha loxinzelelo lwe-ultrasonic; kunye nolawulo lwebhola ye-solder ye-ACCUBMP kunye nokuzilungiselela kwenkqubo ye-Auto-BITS, ihlawula ngokuguquguqukayo ukuguguleka kwe-cutter kunye nokuguquguquka kwezinto ze-wire ngexesha lokuveliswa kwezixhobo, ivumela ukuqinisekiswa ngokukhawuleza kunye nokusasazwa koomatshini abatsha kunye neemveliso, inciphisa imijikelo yokwazisa imveliso.
Inkqubo yeNethiwekhi yeZixhobo zeKNet PLUS ixhasa ukujonga imeko yezixhobo ngexesha langempela kunye nokufunyanwa kwedatha yemveliso, idibana neenkqubo ze-MES zefektri ukufezekisa ukulandeleka ngokupheleleyo kwedatha yenkqubo, kwaye iyahambelana nemigca yemveliso ezenzekelayo ye-Industry 4.0; ikwahambelana neefreyimu zenkxaso eziqhubekayo kunye neepallet carriers, kwaye inokudityaniswa neendlela zokulayisha nokukhulula ngokuzenzekelayo.
III. Iinkcukacha zeNkqubo ePhambili
Iintambo ezihambelanayo: Ucingo lwegolide, ucingo lwesilivere oluxutyiweyo, ucingo lwepalladium lobhedu, ucingo lwekopolo (kunye nekhithi yokukhusela okusingqongileyo okufana nayo)
Ububanzi beNtambo Esebenzayo: 20-50μm, igubungela ububanzi bentambo eqhelekileyo yee-LED zesiqhelo, ii-LED ezinamandla aphezulu, kunye nee-Mini-LED
Ukuchaneka kweBonding: 2.5μm@3σ, ingcono kune-3μm@3σ ka-OptoLux Plus, ifanelekile kwimveliso yeMini-LED enesithuba esincinci sephedi
Indawo yokubopha esebenzayo: 56mm (X) × 80mm (Y), iyahambelana neebrakethi ezahlukeneyo ze-LED bridging kunye ne-ceramic substrates
Ukusebenza kwe-Wire Arc (i-wire ye-25.4μm): Ubude be-wire obuphezulu yi-5mm, ubude be-arc obuncinci yi-65μm; I-Quick-Loop-LED ixhasa iimilo ezahlukeneyo ze-wire arc ezintsonkothileyo, inciphisa ukujija kwe-wire kwaye iphucula ukuthembeka kwesixhobo.
Ukuhambelana komthwali: Ububanzi bebhokisi yebracket yi-35-98mm, exhasa imveliso yeebracket ze-LED ezineenkcukacha ezininzi
IV. Imizekelo ephambili yokusetyenziswa
Ukupakishwa kwe-LED: Uluhlu olupheleleyo lwee-LED ze-SMD surface mount, ii-LED ze-ceramic ezinamandla aphezulu, iimodyuli ze-COB, ii-Mini-LEDs Ukuveliswa okukhulu kweetships ze-LED
Izixhobo ze-Optoelectronic: Ii-emitters/receivers ze-Infrared (IR), ii-sensors ze-photoelectric, ii-optocouplers (izixhobo ezifihlakeleyo)
Imigca yemveliso enciphisa iindleko efanelekileyo kwimveliso enkulu yocingo lobhedu kunye nocingo lwesilivere oluxutyiweyo
V. Iingenelo zeZixhobo eziPhambili
Ubuchule obuNgapheliyo bokuVelisa uBuninzi: Iqulethe uyilo lwe-servo-motion lwesizukulwana esilandelayo olunyusa i-UPH ngakumbi xa kuthelekiswa ne-OptoLux™ Plus; imveliso ephezulu ngeyunithi nganye inciphisa iindleko zokuvelisa nge-LED nganye, nto leyo ekhokelela ekunciphiseni ngaphezulu kwe-10% kwiindleko zokuvelisa zizonke.
Ukubopha iCopper/Silver Wire Eqinileyo: Ulawulo oluphuculweyo lokuhamba komoya kunye nokuhambelana okuphezulu kwe-FAB (Free Air Ball) kuqinisekisa isivuno esizinzileyo kwimveliso ephezulu yesilivere kunye nentambo yobhedu, ukuhlangabezana neemfuno zasefektri zokunciphisa iindleko.
Ukuchaneka okuphezulu kweBonding: Ifikelela kwi-2.5μm@3σ ngokuchanekileyo nge-3.5× optics, iphatha ngempumelelo iinkqubo zeMini-LED ezibandakanya ii-pads ezincinci kunye nee-fine pitches ngelixa inika iwindow ebanzi yenkqubo.
Ukusetyenziswa kweZixhobo eziPhezulu: Inika ukubuyiselwa ngokuzenzekelayo kwiintlobo ezahlukeneyo zeempazamo kunye nembuyekezo yokuguquguquka ye-Auto-BITS ukunciphisa ukuseta kunye nexesha lokungasebenzi, okwenza ukuba ilungele imveliso eqhubekayo iiyure ezingama-24 ngosuku, iintsuku ezisixhenxe ngeveki.
Intshayelelo yeMveliso eKhawulezayo: I-Quick-LED-2 process suite ifinyeza imijikelo emitsha yokufaneleka kwemveliso kwaye inciphisa umthwalo wokuseta kwiinjineli zeenkqubo.
Ukuhambelana koMgca weMveliso yeDijithali: Uqhagamshelo lwe-KNet-PLUS lwenza ukuba idatha yemveliso ilandeleke kwaye idityaniswe neenkqubo zokulayisha/zokukhulula ezizenzekelayo, nto leyo eyenza ukuba ihambelane ngokupheleleyo nezixhobo zokupakisha zanamhlanje. VI. Uthelekiso olufutshane: ULTRALUX™ PLUS vs. OptoLux™ Plus
Itheyibhile
Into I-ULTRALUX™ PLUS I-OptoLux™ Plus
Indawo yokuma Imodeli yeFlagship; i-output ephezulu kakhulu; yenzelwe iMini-LED kunye nemveliso enkulu ngentambo yobhedu/yesilivere Imveliso yobuninzi eqhelekileyo; imveliso ephezulu yee-LED eziqhelekileyo
Ukwandiswa kokukhanya I-Standard 3.5× I-Standard 2×; 4× ungayikhetha
Ukuchaneka kokubopha 2.5μm @ 3σ 3μm @ 3s
Isantya esiphezulu Iingcingo ezingama-25/isekhondi (ubude beengcingo ezi-2mm) Iphantsi kakhulu
Ulawulo lweGesi Ukuhamba komoya okwandisiweyo ukuze kwenziwe i-Cu/Ag wire FAB ephuculiweyo Ulawulo oluqhelekileyo lokuhamba komoya
I-Process Suite I-Quick-LED-2 Suite I-Quick-LED Suite
Abathengi Abajoliswe Kubo Imigca ye-Mini-LED efunekayo kakhulu; imigca ye-Cu/Ag enomthamo ophezulu igxile ekunciphiseni iindleko Imigca eqhelekileyo ye-SMD eqhelekileyo kunye ne-LED ezinamandla aphezulu
VII. Isishwankathelo
I-K&S ULTRALUX™ PLUS yimodeli ephambili kwipotifoliyo ye-K&S optoelectronics ball bonding. Igxile kwiintsika ezintathu eziphambili zokukhupha okuphezulu, ukuchaneka okuphezulu, kunye nokuveliswa kobunzima obuzinzileyo ngeengcingo ze-copper/silver alloy, ijongana nemingeni ebalulekileyo efana nee-bond pads ezincinci kwi-Mini-LEDs, ukwakheka kakubi kwebhola ngentambo yobhedu, kunye nokuhamba kweenkqubo ngexesha lokuveliswa kobuninzi. Ivumela abavelisi bokupakisha be-LED ukuba banciphise iindleko zemveliso nganye ngelixa begcina isivuno esiphezulu kunye nokuthembeka, okwenza kube yindawo ekhethwayo yokudibanisa iingcingo kwimveliso yobuninzi be-LED kunye ne-Mini-LED yesizukulwana esilandelayo.
