I-OptoLux™ ngumatshini wokubopha ibhola we-ultrasonic ozenzekelayo ngokupheleleyo ovela kwi-K&S (Kulisofa) wokupakisha i-LED optoelectronic. Liqonga eliqhelekileyo lokuvelisa ii-LED ezinkulu kunye nezixhobo ze-optoelectronic, kamva laphuculwa laba yinguqulelo ye-OptoLux™ Plus. Ezi zixhobo zigxile kwii-LED zokukhanyisa, ii-Mini-LED, kunye nezixhobo ze-infrared optoelectronic, amandla okulinganisela, i-bonding yield, kunye nokuhambelana kwenkqubo, kwaye isetyenziswa kakhulu kwimigca yemveliso yokupakisha i-optoelectronic kwihlabathi liphela.
I. Ukubekwa kwezixhobo
I-OptoLux™ ibekwe njenge-ball bonder ezinikeleyo ngesantya esiphakathi ukuya kwesiphezulu ye-optoelectronics, igxile ekudibaniseni izixhobo ze-optoelectronic ezahlukeneyo, ukugqiba i-ultrasonic ball bonding ye-gold wire, i-silver alloy, kunye ne-copper wire phakathi kwe-chip pads kunye ne-substrate/support. Ifanelekile kwimveliso ephezulu ye-SMD LEDs, ii-LED ezinamandla aphezulu, ii-infrared emitters kunye nee-receivers, kunye nee-optoelectronic sensors; ngelixa ikwacinga ngokulula kokulungisa iimpazamo, ifanelekile kwizityalo ezincinci ukuya kwezinkulu zokupakisha ze-LED, kodwa hayi kwi-logic IC chip packaging ephezulu.
II. Inkqubo yeHardware ePhambili
Iqonga le-XYZ High-Speed Servo Motion: I-servo drive evaliweyo ilungiselela indlela yokuhamba kwesakhiwo esixhasayo esiqhubekayo, inciphisa ukulahleka kokuhamba okungenzi nto, kwaye iqinisekisa amandla emveliso esisiseko ye-UPH; ulawulo oluchanekileyo lwe-Z-axis pressure closed-loop lunciphisa umngcipheko wokonakalisa i-chip PAD kwii-electrodes ze-LED ezincinci.
Inkqubo yokuJonga Phambili eCwangcisiweyo: Ukuskena kwangaphambili kunye nokubeka kwangaphambili kunciphisa ixesha lokulinda lokufumana umfanekiso; ixhotyiswe ngenkqubo yokukhanyisa ethe nkqo ye-WAVI ebanzi, imithombo yokukhanya ecwangcisiweyo ebomvu nebhlowu + ukukhanya okuncinci okucwangcisiweyo, ukuze kujongwane nokukhanyiswa okuvela kwinkxaso efakwe ngombane kunye nokuphazamiseka kokwahluka kwemibala kwinkxaso, okuphucula uzinzo lokubeka i-PRS.
I-SHTL kunye ne-NSOL eyakhelwe ngaphakathi i-automatic fault recovery logic izanywa kwakhona ngokuzenzekelayo xa kuchongwa izinto ezingaqhelekanga, nto leyo enciphisa ixesha lokungasebenzi kwaye iphucula ixesha eliphakathi le-MTBA.
Inkqubo yokubona: I-optical esemgangathweni ye-2× magnification, ekwaziyo ukuskena okukhulu kwe-field-of-view kunye nokujonga ii-pad, ihlangabezana neemfuno ze-LED yesiqhelo kunye nokuchongwa kwee-pad ze-Mini-LED kwangethuba.
Ikhithi yeNkqubo ye-LED eKhethekileyo ye-Quick-LED Suite
I-K&S inikezela ngesiseko sedatha senkqubo esenzelwe wena sokupakisha i-optoelectronic, ibandakanya i-arc yentambo evuthiweyo, i-ignition, kunye neeparameter ze-ultrasonic-pressure timing. Idityaniswe netekhnoloji ye-ACCUBMP solder ball guiding, iqinisekisa ukuhambelana kwebhola ye-solder, ivumela ukuqaliswa ngokukhawuleza koomatshini abatsha kunye nokunciphisa umqobo wokuseta inkqubo.
Ixhotyiswe nge-algorithm yokuzilungiselela ye-Auto-BITS, ifunda ngokuzenzekelayo kwaye ilungise iiparameter zokubopha ngexesha lokusebenza kwezixhobo, ihlawulela ukushukuma kwenkqubo okubangelwa kukuguguleka kwe-cleaver kunye nokuguquguquka kwezinto zentambo, ngaloo ndlela izinzisa isivuno sebhetshi.
III. Iinkcukacha zeNkqubo ePhambili
Iintambo ezihambelanayo: Ucingo lwegolide, ucingo lwesilivere oluxutyiweyo, ucingo lwepalladium-copper; ikhithi yokukhusela imeko-bume encinci enokukhetha ixhasa ukuveliswa kweentambo zobhedu kwaye ithintela ukuxinana kweentambo zobhedu kunye ne-oxidation.
Ububanzi beNtambo Esebenzayo: 20-50μm, igubungela ububanzi bentambo eqhelekileyo yokukhanyisa okuqhelekileyo kunye nee-LED ezinamandla aphezulu.
Ukuchaneka kokubopha: ±3μm@3σ, ukuhlangabezana neemfuno zokubopha zeephedi ezincinci neziphakathi.
Indawo Yokucubungula I-Bonding Esebenzayo: 56×80mm, iyahambelana neenkxaso ze-LED ze-cascade eziqhelekileyo kunye ne-ceramic substrates.
Amandla e-Wire Arc: Ixhasa i-arc ephantsi, i-arc eqhelekileyo, kunye ne-arc ephezulu, iyahambelana nezixhasi zobunzulu obahlukeneyo be-cavity.
Ukuhambelana kokutya: Ixhasa iitreyi kunye neenkxaso ze-cascade; inokudityaniswa neenkqubo zokulayisha nokukhupha izinto ngokuzenzekelayo; ixhasa ukulandeleka kwedatha ye-MES.
IV. Iindawo eziphambili zokusetyenziswa
Ukupakisha i-LED: 2835, 3030, 5050 kunye nezinye ii-SMD surface mount LEDs, ii-LED ze-ceramic ezinamandla aphezulu, ii-COB chips, i-Mini-LED mass production wire bonding yasekuqaleni.
Izixhobo ze-Optoelectronic: Iityhubhu ezikhupha/ezamkelayo ze-infrared IR, ii-sensors ze-photoelectric, izixhobo ze-optocoupler ezizimeleyo.
Ukupakishwa kweDiscrete Device yeConsumer Optoelectronic Device
V. Iingenelo Eziphambili Zezixhobo
Ukuziqhelanisa ngokunzulu neeNkqubo ze-Optoelectronic: Yenzelwe ngokukodwa ukujongana neendawo ezibuhlungu ezifana nokuqaqamba kwiibrakethi ze-electroplating ze-LED kunye nokuchaphazeleka kumonakalo woxinzelelo oluvela kwii-electrodes ezincinci, nto leyo ekhokelela kwifestile ebanzi yenkqubo kunye nemveliso eqinileyo yobuninzi.
I-Low Learning Curve: Inkqubo ye-Quick-LED Suite esele ipakishwe ivumela amaxesha amafutshane okuseta xa utshintshela kwiimodeli ezintsha, nto leyo enciphisa ukuthembela kwiinjineli zeenkqubo eziphezulu.
Ukusebenza Okugqwesileyo: Ukubuyiselwa kwempazamo ebonakalayo ngokuzenzekelayo + imbuyekezo yokuguquguquka kwe-Auto-BITS inciphisa ixesha lokungasebenzi ngenxa yokungenelela kwabantu, okwenza ukuba ifaneleke kwimveliso yobuninzi yexesha elide, engaphazanyiswa.
Ubonelelo lweeNtambo eziNyukayo: Ukuphuculwa kwendawo ukuya kwikhithi yokusingqongileyo kuvumela ukutshintsha ukusuka kwimigca yokuvelisa iintambo zegolide ukuya kwi-silver alloy okanye i-copper wire, okuxhasa izisombululo zokunciphisa iindleko kwiifektri.
Ulondolozo Olulula: Uyilo lweModular luvumela ukuhlanganiswa nokuqhekeka kwe-splitter, i-firing pin, kunye ne-wire feeding mechanism lula, nto leyo enciphisa ixesha lokulungisa.
VI. Umahluko omfutshane phakathi kwe-OptoLux™ kunye ne-OptoLux™ Plus
I-OptoLux™ (Uhlobo oluSisiseko): Iqonga lemveliso yobuninzi be-LED eliqhelekileyo, elivuthiweyo nelizinzileyo, elihlangabezana neemfuno zomthamo wemveliso ye-SMD eqhelekileyo kunye ne-LED enamandla aphezulu, elungiselelwe ukuvelisa ubuninzi be-LED obuqhelekileyo.
I-OptoLux™ Plus (Uhlobo oluHlaziyiweyo): Ineentshukumo ze-servo eziphuculweyo, ii-algorithms zokubona eziphindaphindwayo, i-UPH ephuculweyo ngakumbi (iHlaziyiweyo ngeYure), kunye nokuqina okuphuculweyo kwe-copper wire bonding kunye neenkqubo ze-Mini-LED small pad, okwenza ifaneleke kwimigca yemveliso ephezulu eneemfuno eziphezulu.
VII. Isishwankathelo I-K&S OptoLux™ sisixhobo sokulinganisa ibhola esisetyenziswa kushishino lokupakisha i-LED. Iimpawu zayo eziphambili kukuvuthwa, ukuzinza, ukusebenza okulula, kunye nokugcinwa okulula. Isombulula ngempumelelo iindawo ezibuhlungu zokubonakaliswa kwebracket ye-LED yendabuko, ukungangqinelani kwebhola ye-solder, kunye nokushukuma kwenkqubo ixesha elide ngexesha lokuveliswa; lukhetho oluphambili lwemigca yemveliso yezixhobo ze-LED zokukhanyisa zendabuko kunye ne-infrared optoelectronic.
