I-Sony SMT Feeder (I-Feeedr) iteknoloji ithatha indawo ebalulekileyo kwintsimi yokuvelisa i-electronic high-end, ngokukodwa kwintsimi yokubekwa kwe-micro-component ephezulu (njengeemodyuli zekhamera kunye neenzwa). Eli nqaku liza kuhlalutya ngokubanzi uyilo olulodwa lweSony SMT Feeder ukusuka kwimilinganiselo yobugcisa bokwakha, iingenelo eziphambili, kunye neemeko zesicelo.

1. Uyilo lobugcisa lweSony SMT Feeder

1.1 Inkqubo yokuqhuba: ulawulo lwe-servo oluphezulu

I-Sony Feeder ithatha yonke i-servo drive yombane. Xa kuthelekiswa nesiqhelo i-stepper motor feeder, inezi mpawu zilandelayo zobugcisa:

Ukuchaneka kwe-Nano-level positioning: i-servo motor ivaliwe i-loop control, ukondla ukuchaneka kwenyathelo le-± 0.005mm, ifanelekile kumacandelo amancinci afana ne-01005 (0.4mm × 0.2mm).

Ummiselo wesantya esiguquguqukayo: uhlengahlengiso ngokuguquguqukayo isantya sokutya ngokwesingqisho sentloko yesiziba ukunciphisa ixesha lokulinda (njenge-SI-E series feeder).

1.2 Indlela yokutya: uyilo oluchasene nokuphazamiseka

Inkqubo yebhanti yoxinzelelo olubini:

Isondo eliphambili lebhanti loxinzelelo liqinisekisa ukuqhubela phambili okugudileyo kwebhanti yokuthwala, kwaye isondo elincedisayo lebhanti loxinzelelo lithintela ukuphindaphinda kwaye lithintele ukutenxa kwecandelo (ingakumbi kumabhanti okuphatha abhityileyo).

Isisele se-vacuum adsorption (ezinye iimodeli):

Lungisa ibhanti ngoxinzelelo olubi lokunciphisa i-component flipping ebangelwa yi-vibration (esebenzayo kwi-0.3mm pitch BGA).

1.3 Ulawulo olukrelekrele

Ukuchongwa kwethegi ye-IC:

I-Feida ine-chip eyakhelwe-ngaphakathi yokugcina ukurekhoda iiparamitha zecandelo (ezifana nenombolo yezinto eziphathekayo, ubuninzi obuseleyo), kwaye idibanisa ngokungenamthungo kunye ne-software ye-Sony SMT yomatshini (njenge-F series).

Inkqubo yokuzixilonga:

Ukubekwa esweni kwangexesha lokwenyani lokunxitywa kwezixhobo kunye nomthwalo wemoto, isilumkiso sangethuba seempazamo (ezifana ne-alamu ye-LED ye-SI-F Feida).

2. Iingenelo ezingundoqo kunye nokuthelekisa nabakhuphisana nabo

2.1 Ukuchaneka kwe-Ultra-high: UKumkani we-micro-component placement

IiParameters uSony feeder Competitor (Panasonic KXF) Competitor (Fuji IP)

Ubuncinane becandelo 01005 (0.2mm×0.1mm) 0201 (0.25mm×0.125mm) 0201

Ukuchaneka kokutya ±0.005mm ±0.02mm ±0.02mm

Iimeko ezisebenzayo Imodyuli yekhamera, isivamvo se-MEMS Izixhobo zombane ze-Auto Consumer electronics motherboard

2.2 Uyilo lwemodyuli: Ingcali yokutshintsha umgca okhawulezayo

Ukutshixa iMagnetic: Kuthatha isekhondi enye kuphela ukubuyisela i-feeder, ekhawuleza ngokuphindwe ka-5 kunokulungisa isikrufu semveli.

I-interface yendalo yonke: I-feeder efanayo iyahambelana nezizukulwana ezininzi ze-Sony SI-E, i-SI-F kunye nabanye oomatshini bokubeka, ukunciphisa iindleko zokuphucula.

2.3 Ukuthembeka: ukuziqhelanisa nemekobume engenathuli

Indlela yokutya evalelweyo: Uyilo lokugquma uthuli luthintela uthuli lweworkshop kwizinto ezingcolisa (ngokuhambelana ne-ISO 14644-1 yoKlasi 5 oluqhelekileyo).

Inketho yezixhobo zeCeramic: Kwiindawo ezinobungozi (ezifana nokuveliswa kwesixhobo sonyango), ubomi begiya bandiswa ukuya kwi-800 yezigidi zemijikelo.

3. Iimeko zesicelo esiqhelekileyo

3.1 Ii-elektroniki zabathengi

Imodyuli yekhamera ye-smartphone:

I-Sony feeder's ±0.005mm ukuchaneka iqinisekisa ukunyuswa ngaphandle kwe-offset ye-CMOS sensors (ezifana nomgca wokuvelisa ikhamera ye-iPhone).

Imibhobho ye-TWS ye-earphone:

Ukutya okuzinzileyo kwe-01005 resistors/capacitors, kunye nesivuno sinyuke saya kuma-99.99%.

3.2 Ishishini elikumgangatho ophezulu

Uluvo lwe-MEMS:

I-vacuum adsorption feeder ikhusela umonakalo wokungcangcazela ngexesha lokunyuswa kwamacandelo amancinci e-electromechanical.

Izixhobo zokufakelwa kwezonyango:

Isitya se-Ceramic gear siyaxhathisa kwi-corrosion yesibulala-zintsholongwane kwaye sifanelekile kwi-pacemaker PCB yemveliso.

4. Ukulinganiselwa kobugcisa

Iindleko eziphezulu: I-Servo feeder yombane yi-2 ~ 3 amaxesha abiza kakhulu kune-feeder eqhelekileyo.

I-ecosystem evaliweyo: ihambelana kuphela nezinye iimodeli ze-Sony/JUKI, ukungahambelani kakuhle komntu wesithathu.

5. Iindlela zophuhliso lwexesha elizayo

Ukondla okulungiselelwe kwe-AI: qikelela ukubekwa kwecandelo ngokufunda ngomatshini, kwaye ulungelelanise i-feeder ngexesha lokwenyani (i-Sony ifake isicelo samalungelo awodwa abenzi afanelekileyo).

Isondlo esiluhlaza: nciphisa indawo yekhabhoni yoshishino lokwenziwa kwezixhobo zombane kuvavanyo lwezixhobo ezingonakali.

Ukuqukumbela

I-Sony's chip placement machine feeder iseyi-benchmark yobugcisa kwinkalo yokubeka i-micro-component kunye nokuchaneka kwe-servo drive kunye noyilo oluchasene nokuphazamiseka. Nangona ishishini layo lidityanisiwe kwi-JUKI, iteknoloji yayo ephambili ye-patent (efana nenkqubo yebhanti yoxinzelelo oluphindwe kabini) isasetyenziswa. Kwiimfuno ezichaneke kakhulu (ezifana neemodyuli ze-optical kunye ne-elektroniki yezonyango), i-Sony's feeder iselukhetho olungenakuthathelwa indawo.