SAKI smt 3D AOI Machine 3Di-MS3

I-SAKI 3D AOI (iNkqubo yokuSebenza ngokuSebenzayo) i-3Di-MS3 yinkqubo yokwenziwa kombane yeNkampani ye-SAKI yodidi oluphezulu, uyilo lwale mihla lodibaniso lwePCB, kwaye ibonelela ngesakhono sokuvavanya inkqubo yeendlela ezintathu. Oku kugqiba itekhnoloji ye-optical ephucukileyo, uyilo lomatshini oluchanekileyo kunye nendlela yokubala ekrelekrele, kunye neshishini lemveliso ye-elektroniki linokubonelela ngezisombululo zolawulo lomgangatho.

2. Uluhlu lweenkcazelo

ityala elinzima

Inkqubo yokulinganisa: izinga eliphezulu lokwahlula umatshini wesigaba seCCD, izinga lokuhlukana kunokwenzeka 10-25μm

Ukucwangciswa komthombo wokukhanya: Umthombo wokukhanya ojikelezayo we-LED oneengile ezininzi, i-angle yokukhanya ehlengahlengisiweyo

Isantya sokudlala: ubuninzi obunokwenzeka kwimizuzwana eyi-0.05 / indawo yokudlala (imisela isantya esiphumeleleyo)

Ubungakanani bePCB: ubuncinci benkxaso 50 x 50 mm ukuya kubuninzi 510 x 460 mm (ubungakanani obukhulu buyafumaneka)

Umlinganiselo wobude: umlinganiselo wokukhanya obunzima obunxantathu okanye itekhnoloji yokutshintsha kwesigaba, izinga lokuqengqeleka uZ livumelekile 1μm

Ukuchaneka koomatshini: Ukuchaneka kwendawo ±15μm, ukuchaneka komxhuzulane ±5μm

leyo

Inkqubo yokusebenza: Ujongano lomsebenzisi olusekwe kwiWindows

indlela yokubala: Inkxaso yohlalutyo lobungwevu lwe-2D, uhlalutyo lwemilo ye-3D, ukuqondwa kombala, njl njl. iindlela zokubala ezininzi

Ujongano lokuqhubekekisa: Ukwandisa inani leenkxaso ze-CAD ujongano lwemodeli

Inani lezinto ezithunyelwa ngaphandle: inkxaso inkqubo ye-akhawunti ye-SPC, inani lokulawula ukuthunyelwa kwamanye amazwe, unxibelelwano lweenjongo ezininzi

3. Izakhono ezingundoqo

1. Umsebenzi womdlalo we-3D

Ubukho bezixhobo zokuqala/ukulahleka kobukho

Umlinganiselo wobude besixhobo sokuqala kunye ne-coplanarity

Uhlalutyo lwemilo emacala-ntathu

Hikikyoku yokoku yowagata

2. Umsebenzi womdlalo we-2D

Ukuchongwa kwepropati yoqobo

Ukuchongwa kweleyibhile (OCR/OCV)

idayiwe kunye nezinto ezahlukeneyo

Ukudluliselwa kwesixhobo sokuqala kunye nokujikeleza

3. isakhono esikhethekileyo

Ukukwazi ukudlala iibhodi ezininzi

Uhlengahlengiso lwenombolo yokuzilungisa

Imodeli yokulinganisa umgca onemifanekiso

Ukwenziwa kwezigqibo ezifikelela kude

4. Umgaqo wokusebenza

I-SAKI 3D AOI kunye ne-3Di-MS3 indibaniselwano yetekhnoloji yokucinga ngeendlela ezininzi:

Umgaqo womfanekiso we-3D:

Indlela yokutshintsha iSigaba: Isicwangciso esicacileyo sesikhokelo sokukhanya, isicwangciso sonxibelelwano sitshintsha ulwazi lokubala lobude

Ubungakanani bomlinganiso wokukhanya obukhali ongunxantathu: umphezulu wokukhanya ogxininise umzobo, uqhagamshelwano lweCCD kunye nobude obubonakalisiweyo bokubala indawo

Imifanekiso yee-engile ezininzi: imifanekiso yokuthatha iengile ezahlukeneyo, ukubala umahluko oqhubekayo wokubonwayo Iziqwenga ezintathu zolwazi

Umgaqo womfanekiso we-2D:

Isetyenziselwe izinga eliphezulu lokwahlula umfanekiso weCCD enemibala engaphezulu

Ukukhanya okubanzi kwe-multi-optical (ii-angles ezahlukeneyo, umbala ohlukeneyo) Ufumene uhambo olukhethekileyo

Uhlalutyo lwethiyori yomfanekiso ophezulu kunye nohlalutyo lwe-arithmetic yobungwevu, ukuthungwa, umbala, njl.

Ikhosi yeKiyoshi:

I-PCB yokubeka isikolo iqabane

Ukuqokelelwa kwemifanekiso eqingqiweyo emininzi

Uhambo olukhethekileyo lwexabiso

Yosho umlinganiso inani ratio

Imveliso yokugqibela ihlukaniswe ngokweendidi kwaye umphumo wokugqibela uthunyelwa ngaphandle.

5. Indawo enika isiphumo sokusetyenziswa

Ngenjongo ephambili

Ulawulo lomgangatho womgangatho wemveliso weSMT

Uloliwe womphunga

Umdlalo webhodi woxinaniso oluphezulu (HDI).

Ibhodi yokupakisha yeSemi-conductor

Ukwenziwa kwezixhobo zombane zonyango

isenzo soshishino

Isiqinisekiso somgangatho: Umgangatho wemveliso yexesha lokwenyani, Nciphisa izinga elineziphene

Ulawulo lwenkqubo: inani le-SPC ezibonelelweyo, inani labathathi-nxaxheba bobunjineli beekhemikhali abaphumeleleyo

Isishwankathelo sencwadi egqityiweyo: Ukugqitywa kwangethuba, ukucuthwa kohlaziyo lwembuyekezo, inguqulelo egqityiweyo

Ukuphindaphinda: Gqibezela iirekhodi, iirekhodi ezipheleleyo, iimfuno ezibanzi zoshishino

Ingcebiso esebenzayo: isantya esiphezulu sokubaleka

Isithandathu, ukugqwesa kwezobugcisa

Ukuchaneka okuphezulu komlinganiselo we-3D: Ukuphumelela umda we-2D AOI wokuphakama

Ukudibanisa iteknoloji eninzi: Hlanganisa i-2D, i-3D, umbala, njl., iindlela ezahlukeneyo zokudlala

Izibalo ezikrelekrele: ukuzilungisa, uncedo lokufunda olunzulu

Ukubekwa komsebenzi: uyilo lokulinganisa loyilo kwiimfuno ezahlukeneyo zemveliso

Ubuhlobo: Uhlengahlengiso olulula kunye nojongano lokusebenza

7. Umboniso woshishino

I-Miniaturization kunye nokuxinana okuphezulu kwezinto zombane, i-SAKI 3D AOI kunye ne-3Di-MS3 emele isikhokelo sobugcisa kwixesha elizayo:

Ukuchaneka okuphezulu: 01005 Imfuno yoqobo encinci kakhulu

Isantya sokuhlaziya: ukusebenza kwemveliso yomatshini wokuthenga ngesantya esiphezulu

Ubukrelekrele: Ukusetyenziswa kwetekhnoloji ye-AI nzulu-dive ukunciphisa izinga lokubuyiswa

Ukuhlanganiswa kwakhona: Ulungelelwaniso olunzulu lweenkqubo ze-MES/ERP

Imiba eyongezelelweyo: Uhlalutyo lwembali yemidlalo ecocekileyo

Inkampani yakwa-SAKI 3D Inkqubo ye-AOI 3Di-MS3 iye yaphuhliswa ngobuchwephesha bayo obuphezulu kunye nokusebenza okuguquguqukayo, kwaye iphuhliselwe ukunciphisa umthamo wombane oveliswa lishishini lemveliso yombane, kwaye ifumene umgangatho obalaseleyo wemveliso kwimarike ekhuphisana ngokuqatha.