SAKI BF-3AXiM200 smt 3d X-RAY umatshini

Oku kulandelayo sisingeniso esibanzi kwi-SAKI X-RAY BF-3AXiM200, egubungela iinkcukacha, iinzuzo zobugcisa, iimpawu eziphambili, iimpazamo eziqhelekileyo kunye neendlela zokuphatha, njl., kudityaniswe nemigangatho yoshishino kunye neempawu zezixhobo ezifanayo:

1. Isishwankathelo seZixhobo

Umzekelo: SAKI X-RAY BF-3AXiM200

Uhlobo: 3D X-ray Automatic Inspection System (AXI)

Isicelo esingundoqo: Ukuhlolwa kwe-X-reyi ephezulu-echanekileyo macala amathathu kwindibano ye-PCB (PCBA), ngokukodwa kwi-solder efihliweyo kunye neziphene zesakhiwo zangaphakathi ezifana ne-BGA, i-CSP, i-QFN.

Indlela yobuchwephesha: Yamkela i-micro-focus ye-X-ray umthombo + i-high-resolution flat-panel detector, ixhasa i-CT tomography (ubumbeko olukhethwayo).

2. Iinkcukacha ezingundoqo

Iinkcukacha zeParameter

Umthombo weX-reyi Evaliweyo kugxilwe kancinci, uluhlu lwamandla ombane 60-160kV, amandla 10W~32W

IsiGqibo sokuFumana ukuya kuthi ga kwi-0.5μm (kuxhomekeke kulwandiso)

Ubukhulu bebhodi ubukhulu 510mm × 460mm (customizable)

Isantya sokubona imizuzwana eyi-10-30 / indawo yokujonga (kuxhomekeke kwisisombululo kunye nemowudi yokuskena ye-3D)

Isakhono somfanekiso we-3D Uxhasa ukuskena kwe-CT ethambekileyo (uluhlu lwe-engile ± 70°)

I-Software Platform SAKI X-Ray VisionPro, ixhasa ukuhlelwa kwesiphene se-AI

3. Izinto eziluncedo ezingundoqo kunye neempawu

(1) Izinto eziluncedo kwezobuGcisa

Ukuchaneka okuphezulu komfanekiso we-3D:

Yakha kwakhona ulwakhiwo lwangaphakathi lwejoyinti ye-solder nge-CT tomography, kwaye ulinganise iiparitha ezifana nezinga le-void, ivolumu yebhola ye-solder, kunye ne-solder tilt angle.

Ukufunyanwa kweekona ezininzi:

Umsebenzi wokuskena we-tilt unokubona ukugcwaliswa komngxuma onganelanga okanye ukudityaniswa kwe-solder ebandayo esecaleni (ezinje ngeplagi-in components).

Uhlalutyo olongeziweyo lwe-AI:

I-algorithm eyakhelwe-ngaphakathi ihlela ngokuzenzekelayo iziphene (ezifana nokuqhekeka kwebhola ye-solder, i-solder joints, into yangaphandle), kunye nesantya esilungileyo sobuxoki esingaphantsi kwe-2%.

(2) Iimpawu zesicelo

Ukufunyanwa kwepakethe entsonkothileyo:

Isebenza kwipakethe ye-PoP, iimodyuli ze-SiP, kunye nezixhobo zamandla zombane zemoto (ezifana nomgangatho we-IGBT welding).

Uvavanyo olungonakalisi:

Iziphene zangaphakathi zingabonwa ngaphandle kokuchithwa, zilungele uhlalutyo lokungaphumeleli kunye nokuqinisekiswa kokuthembeka.

(3) Ukulungelelanisa umgca wokuvelisa

Ukudibanisa okuzenzekelayo:

Ixhasa ukulayishwa kwengalo yerobhothi kunye nokukhulula, kunye nokusebenzisana kwedatha kunye nenkqubo ye-MES (SECS / GEM protocol).

Ubumbeko olubhetyebhetye:

Ukuzikhethela ngaphandle kwe-intanethi (uhlalutyo lwebhubhoratri) okanye kwi-intanethi (i-SMT yokuvelisa umgca we-embedding).

4. Imiyalezo yemposiso eqhelekileyo kunye neendlela zokucubungula

Ikhowudi yempazamo enokwenzeka Isisombululo

I-ERR-XRAY-101 X-ray ityhubhu etshisa kakhulu Misa ukuchongwa kunye nokupholisa inkqubo; khangela ukuba ifeni yokupholisa iqhelekile.

I-ERR-DET-205 Uphazamiseko lonxibelelwano lwe-Flat panel detector Qalisa kwakhona i-detector; khangela uqhagamshelo lwentambo okanye buyisela ibhodi yojongano.

I-ERR-MOT-304 i-Motion axis ngaphandle komda (i-jam yomatshini) Setha ngokutsha imodyuli yesindululo ngesandla; khangela umba wangaphandle okanye i-motor drive.

ERR-SOFT-409 Ukwakhiwa kwakhona komfanekiso akuphumelelanga (ilahleko yedatha) Skena kwakhona; phucula isoftwe okanye uqhagamshelane SAKI inkxaso yobugcisa.

WARN-HV-503 Ukuguquguquka konikezelo lwamandla ombane aphezulu Khangela uzinzo lonikezelo lwamandla; ingaba ucingo lokumisa lunokuthenjwa.

5. Iimeko zesicelo esiqhelekileyo

Imveliso ye-elektroniki ekumgangatho ophezulu:

I-motherboard ye-smartphone (i-Underfill glue yokuzaliswa kokufunyanwa), imodyuli ye-5G RF.

Iimoto zombane:

Ukuqinisekiswa kwebhodi yokulawula ukuthembeka kwe-ECU edibeneyo yokuthembeka (ihambelana ne-AEC-Q100).

Ukupakishwa kweSemiconductor:

I-Wafer-level packaging (WLP), i-TSV silicon ukubonwa ngomngxuma.

6. Iingcebiso zogcino kunye nolungelelwaniso

Ulondolozo lwemihla ngemihla:

Coca ifestile ye-X-reyi (ifilimu engenathuli) veki nganye kwaye ulinganise ixabiso le-grayscale nyanga zonke.

Ubomi bamacandelo aphambili:

Ubomi bombhobho weX-reyi bumalunga neeyure ezingama-20,000, yaye ukuthomalaliswa kwemitha yemitha kufuneka kubekwe esweni rhoqo.

Ukusebenza okukhuselekileyo:

Qinisekisa ukuba umnyango wokukhusela izixhobo uvaliwe kwaye ukuvuza kwe-radiation kuhambelana nomgangatho we-IEC 62494-1 (≤1μSv / h).

7. Ukuthelekisa ukhuphiswano lwemarike

Izinto zokuthelekisa i-SAKI BF-3AXiM200 yeemveliso zoKhuphiswano (ezifana neNordson Dage XD7600)

Isisombululo 0.5μm (ulwandiso lwendawo) 0.3μm (ixabiso eliphezulu)

Isantya sokuskena se-CT Isantya esiphakathi (uthathela ingqalelo ukuchaneka) Isantya esiphantsi (imowudi echanekileyo ephezulu)

Umsebenzi we-AI Eyakhelwe ngaphakathi ukuhlelwa kwesiphene Ifuna ukwandiswa kwesoftware yomntu wesithathu

Ixabiso Eliphakathi ukuya phezulu (ixabiso eligqwesileyo) Ixabiso eliphezulu (30% ~ 50% premium)

8. Iingcebiso zokukhetha umsebenzisi

Iimeko zokukhetha ezicetyiswayo:

Isampula yomgca wokuvelisa okanye uhlalutyo lwebhubhoratri olufuna ukulinganisa isantya kunye nokuchaneka.

Iimoto/abavelisi bombane bezonyango abanohlahlo lwabiwo-mali olulinganiselweyo kodwa basafuna imisebenzi ye-X-Ray ye-3D.

Iimeko ezingacetyiswayo:

Ifuna isisombululo se-nanometer (efana nohlalutyo lokusilela kwinqanaba le-chip) okanye ngokuzenzekelayo ukubonwa kwe-intanethi ye-100%.