SAKI BF-3AXiM200 smt 3d X-RAY mashiinka

Kuwa soo socdaa waa hordhac dhamaystiran oo ku saabsan SAKI X-RAY BF-3AXiM200, oo daboolaya qeexitaannada, faa'iidooyinka farsamada, sifooyinka asaasiga ah, khaladaadka caadiga ah iyo hababka maaraynta, iwm, oo ay weheliso heerarka warshadaha iyo sifooyinka qalabka la midka ah:

1. Dulmarka Qalabka

Model: SAKI X-RAY BF-3AXiM200

Nooca: 3D X-ray System Inspection Automatic (AXI)

Codsiga Muhiimka ah: Baaritaanka raajada saddex-geesoodka ah ee saxda ah ee saxda ah ee golaha PCB (PCBA), gaar ahaan kala-goysyada alxanka qarsoon iyo cilladaha qaabdhismeedka gudaha sida BGA, CSP, QFN.

Dariiqa farsamada: Waxay qabataa isha raajada-yar ee diiradda-yar-yar-yar-yar-yar-yar-yar-yar-yar-yar-yar-yareedka + qalabka-baaraha-xallada-sare-sare, wuxuu taageeraa CT-ga (qaabayn ikhtiyaari ah).

2. Tilmaamaha Muhiimka ah

Faahfaahinta Halbeegga Shayga

Isha raajada Diiradda yar ee xidhan, kala duwanaanshaha danab 60-160kV, awood 10W ~ 32W

Xallinta Ogaanshaha Ilaa 0.5μm (waxay kuxirantahay waynaynta)

Cabbirka looxa ugu badan 510mm × 460mm (la beddeli karo)

Xawaaraha ogaanshaha 10-30 ilbiriqsi/ goob muuqaal ah (waxay kuxirantahay xallinta iyo qaabka iskaanka 3D)

Kartida Sawirka 3D Waxay taageertaa iskaanka CT-ga leexday (xagal kala duwan ± 70°)

Platform Software SAKI X-Ray VisionPro, waxay taageertaa kala soocida cilladaha AI

3. Faa'iidooyinka iyo Tilmaamaha Muhiimka ah

(1) Faa'iidooyinka Farsamada

Sawir 3D sax ah oo sarreeya:

Dib-u-dhiska qaab-dhismeedka gudaha ee wadajirka alxanka iyada oo loo marayo CT tomografi, oo qiyaas cabbirrada sida heerka faaruqinta, mugga kubbadda alxanka, iyo xagasha leexinta alxanka.

Ogaanshaha xagal badan:

Shaqada iskaanka leexleexadu waxay ogaan kartaa buuxinta godka oo aan ku filnayn ama kala goysyada alxanka qaboobaha (sida qaybaha fur-in).

Falanqaynta AI ee la xoojiyey:

Algorithm-ku-dhisan ayaa si toos ah u kala saaraya cilladaha (sida dildilaaca kubbadda alxanka, kala-goysyada alxanka qaboobaha, walxaha shisheeye), oo leh qiime been abuur ah oo ka yar 2%.

(2) Astaamaha codsiga

Ogaanshaha xirmo isku dhafan:

Lagu dabaqi karo baakadaha PoP, modules-yada SiP, iyo aaladaha korontada ee baabuurta (sida tayada alxanka IGBT).

Tijaabooyin aan burburin:

Cilladaha gudaha waxaa lagu ogaan karaa iyada oo aan la kala saarin, oo ku habboon falanqaynta fashilka iyo xaqiijinta kalsoonida.

(3) La qabsiga khadka wax soo saarka

Isdhexgalka otomaatiga

Waxay taageertaa rarista gacanta iyo dejinta, iyo dhexgalka xogta nidaamka MES (SECS/GEM borotokool).

Qaabeynta dabacsan:

Khadka tooska ah ee ikhtiyaariga ah (falanqaynta shaybaarka) ama khadka tooska ah (ku dhejinta khadka wax soo saarka SMT).

4. Farriimaha qaladka caadiga ah iyo hababka habaynta

Koodhka khaladka ah ee suurtogalka ah Xalka

ERR-XRAY-101 tuubada raajada oo kululaynta hakin ogaanshaha oo qabooji nidaamka; hubi in marawaxada qaboojintu ay caadi tahay.

ERR-DET-205 Goosha isgaarsiineed baaraha baal fidsan Dib u bilow baaraha; hubi xidhiidhka fiilada ama beddel guddiga interface.

ERR-MOT-304 Dhaqdhaqaaqa dhidibka ka baxsan xad Hubi jidka arrimaha dibadda ama matoorka.

ERR-SOFT-409 Dib u dhiska sawirku wuu guuldarraystay (xogta luntay) Dib-u-eegis; cusboonaysii software ama la xidhiidh SAKI taageero farsamo.

WARN-HV-503 Isbedbeddelka sahayda korantada ee tamarta sare ee tamarta Hubi xasilloonida sahayda korontada; in siliga dhulka la dhigay uu yahay mid la isku halayn karo.

5. Xaaladaha codsiga caadiga ah

Wax-soo-saarka elegtarooniga ah ee ugu sarreeya:

Motherboard-ka casriga ah (Baahinta buuxinta xabagta ee hoosta), moduleka 5G RF.

Gawaarida Elektrooniga ah:

Xaqiijinta isku halaynta wadajirka ah ee guddiga kontoroolka ECU (oo waafaqsan AEC-Q100).

Baakadaha semiconductor:

Baakadaha heerka wafer (WLP), TSV silicon ogaanshaha godka

6. Talooyinka dayactirka iyo hagaajinta

Dayactirka maalinlaha ah:

Nadiifi daaqada raajada (filimka boodhka ka ilaalinaya) usbuuc kasta oo qiyaas qiimaha cawl bil kasta.

Nolosha qaybaha muhiimka ah:

Nolosha tuubada raajada waa ilaa 20,000 saacadood, hoos u dhigista shucaaca ayaa u baahan in si joogto ah loola socdo.

Hawlgal ammaan ah:

Hubi in albaabka gaashaanka qalabku uu xiran yahay oo ka daadanaya shucaaca uu la kulmay heerka IEC 62494-1 (≤1μSv/h).

7. Isbarbardhigga tartanka suuqa

Waxyaabaha isbarbardhigga ah SAKI BF-3AXiM200 Alaabooyinka tartanka ah (sida Nordson Dage XD7600)

Xallinta 0.5μm (weynaynta deegaanka) 0.3μm (qiimaha sare)

Xawaaraha iskaanka CT-ga Xawaaraha dhexdhexaadka ah (iyada oo la tixgelinayo saxsanaanta) Xawaaraha hooseeya (qaabka saxsanaanta sare)

Shaqada AI Kala soocida cilladda ku dhex dhisan waxay u baahan tahay fidinta software qolo saddexaad

Qiimaha Dhex-ilaa-sare-dhamaadka (kharash-wax-ku-oolnimada aadka u sarreeya)-dhamaadka sare (30% ~ 50% premium)

8. Talooyinka xulashada isticmaalaha

Xaaladaha xulashada ee lagu taliyay:

Samaynta khadka wax soo saarka ama falanqaynta shaybaadhka ee u baahan in la isku dheelitiro xawaaraha iyo saxnaanta.

Soosaarayaasha qalabka elektiroonigga ah ee baabuurta/caafimaadka leh miisaaniyad xaddidan laakiin wali waxay u baahan yihiin hawlaha 3D X-Ray.

Laguma talinayo xaaladaha:

U baahan xallinta nanometerka (sida falanqaynta guul-darrooyinka heerka-chip) ama si toos ah 100% ogaanshaha khadka tooska ah.