SAKI BF-3AXiM200 smt 3d X-RAY machine

The following is a comprehensive introduction to SAKI X-RAY BF-3AXiM200, covering specifications, technical advantages, core features, common errors and handling methods, etc., combined with industry standards and characteristics of similar equipment:

1. Equipment Overview

Model: SAKI X-RAY BF-3AXiM200

Type: 3D X-ray Automatic Inspection System (AXI)

Core Application: High-precision three-dimensional X-ray inspection for PCB assembly (PCBA), especially for hidden solder joints and internal structural defects such as BGA, CSP, QFN.

Technical route: Adopts micro-focus X-ray source + high-resolution flat-panel detector, supports CT tomography (optional configuration).

2. Core Specifications

Item Parameter Details

X-ray Source Closed micro focus, voltage range 60-160kV, power 10W~32W

Detection Resolution Up to 0.5μm (depending on magnification)

Maximum board size 510mm × 460mm (customizable)

Detection Speed 10-30 seconds/field of view (depending on resolution and 3D scanning mode)

3D Imaging Capability Supports tilted CT scanning (angle range ±70°)

Software Platform SAKI X-Ray VisionPro, supports AI defect classification

3. Core Advantages and Features

(1) Technical Advantages

High-precision 3D imaging:

Reconstruct the internal structure of the solder joint through CT tomography, and quantify parameters such as void rate, solder ball volume, and solder tilt angle.

Multi-angle detection:

The tilt scanning function can detect insufficient through-hole filling or sidewall cold solder joints (such as plug-in components).

AI enhanced analysis:

Built-in algorithm automatically classifies defects (such as solder ball cracks, cold solder joints, foreign matter), with a false positive rate of less than 2%.

(2) Application features

Complex package detection:

Applicable to PoP packaging, SiP modules, and automotive electronic power devices (such as IGBT welding quality).

Non-destructive testing:

Internal defects can be detected without disassembly, suitable for failure analysis and reliability verification.

(3) Production line adaptability

Automation integration:

Supports robotic arm loading and unloading, and data interaction with MES system (SECS/GEM protocol).

Flexible configuration:

Optional offline (laboratory analysis) or online (SMT production line embedding).

4. Common error messages and processing methods

Error code Possible cause Solution

ERR-XRAY-101 X-ray tube overheating Pause detection and cool the system; check whether the cooling fan is normal.

ERR-DET-205 Flat panel detector communication interruption Restart the detector; check the cable connection or replace the interface board.

ERR-MOT-304 Motion axis out of limit (mechanical jam) Manually reset the motion module; check the track foreign matter or motor drive.

ERR-SOFT-409 Image reconstruction failed (data loss) Rescan; upgrade software or contact SAKI technical support.

WARN-HV-503 High voltage power supply fluctuation Check the power supply stability; whether the grounding wire is reliable.

5. Typical application scenarios

High-end electronic manufacturing:

Smartphone motherboard (Underfill glue filling detection), 5G RF module.

Automotive electronics:

ECU control board solder joint reliability verification (compliant with AEC-Q100).

Semiconductor packaging:

Wafer-level packaging (WLP), TSV silicon through-hole detection.

6. Maintenance and calibration recommendations

Daily maintenance:

Clean the X-ray window (dust-proof film) every week and calibrate the grayscale value every month.

Life of key components:

The life of the X-ray tube is about 20,000 hours, and the radiation intensity attenuation needs to be monitored regularly.

Safe operation:

Ensure that the equipment shielding door is closed and the radiation leakage meets the IEC 62494-1 standard (≤1μSv/h).

7. Market competitiveness comparison

Comparison items SAKI BF-3AXiM200 Competitive products (such as Nordson Dage XD7600)

Resolution 0.5μm (local magnification) 0.3μm (higher cost)

CT scanning speed Medium speed (taking into account accuracy) Low speed (high-precision mode)

AI function Built-in defect classification Requires third-party software expansion

Price Mid-to-high-end (outstanding cost-effectiveness) High-end (30%~50% premium)

8. User selection suggestions

Recommended selection scenarios:

Production line sampling or laboratory analysis that needs to balance speed and accuracy.

Automotive/medical electronics manufacturers with limited budgets but still need 3D X-Ray functions.

Not recommended scenarios:

Require nanometer resolution (such as chip-level failure analysis) or fully automatic 100% online detection.