SAKI BF-3AXiM200 smt 3d X-RAY makina

Zotsatirazi ndizofotokozera zambiri za SAKI X-RAY BF-3AXiM200, zofotokozera, ubwino waumisiri, mawonekedwe apakati, zolakwika wamba ndi njira zogwirira ntchito, ndi zina zotero, zophatikizidwa ndi miyezo yamakampani ndi mawonekedwe a zida zofananira:

1. Zida Mwachidule

Chitsanzo: SAKI X-RAY BF-3AXiM200

Mtundu: 3D X-ray Automatic Inspection System (AXI)

Kore ntchito: High-mwatsatanetsatane azithunzi atatu X-ray anayendera kwa PCB msonkhano (PCBA), makamaka zobisika olowa solder ndi mkati structural zolakwika monga BGA, CSP, QFN.

Njira yaukadaulo: Imatengera gwero la Micro-focus X-ray + chojambulira chapamwamba chapamwamba, chimathandizira CT tomography (kusintha kosankha).

2. Zofunika Kwambiri

Tsatanetsatane wa Parameter

Gwero la X-ray Chotsekeka pang'ono, mphamvu yamagetsi 60-160kV, mphamvu 10W ~ 32W

Kuzindikira Kufikira ku 0.5μm (kutengera kukula)

Zolemba malire bolodi kukula 510mm × 460mm (customizable)

Kuzindikira Kuthamanga masekondi 10-30 / malo owonera (kutengera kusanja ndi 3D scanning mode)

Kuthekera kwa Kujambula kwa 3D Kumathandizira kusanthula kwa CT kopendekeka (makona ± 70 °)

Software Platform SAKI X-Ray VisionPro, imathandizira gulu lachilema la AI

3. Pakatikati Ubwino ndi Mbali

(1) Ubwino Waukadaulo

Kujambula kolondola kwambiri kwa 3D:

Konzaninso mawonekedwe amkati a ophatikizana a solder kudzera mu CT tomography, ndikuwerengera magawo monga void rate, voliyumu ya mpira wa solder, ndi ngodya yopendekera ya solder.

Kuzindikira kwamakona angapo:

Ntchito yosanthula mapendekedwe imatha kuzindikira kusakwanira m'mabowo kapena zolumikizira zozizira zam'mbali (monga zida za pulagi).

Kuwunika kowonjezereka kwa AI:

Ma aligorivimu omangidwira amangoyika zolakwika (monga ming'alu ya mpira wa solder, zolumikizira zoziziritsa kukhosi, zinthu zakunja), ndi chiwopsezo chabodza chochepera 2%.

(2) Zogwiritsa ntchito

Kuzindikira kwa phukusi lovuta:

Imagwiritsidwa ntchito popaka ma PoP, ma module a SiP, ndi zida zamagetsi zamagetsi zamagalimoto (monga mtundu wa IGBT wowotcherera).

Kuyesa kosawononga:

Zowonongeka zamkati zimatha kuzindikirika popanda disassembly, zoyenera kusanthula kulephera ndi kutsimikizira kudalirika.

(3) Kusinthasintha kwa mzere wopanga

Kuphatikiza kwa makina:

Imathandizira kutsitsa ndikutsitsa mkono wa robotic, komanso kulumikizana kwa data ndi dongosolo la MES (SECS/GEM protocol).

Kusintha kosinthika:

Zosankha zapaintaneti (kusanthula kwa labotale) kapena pa intaneti (kuyika kwa mzere wa SMT).

4. Mauthenga olakwika wamba ndi njira zopangira

Khodi yolakwika Chifukwa chotheka Kuthetsa

ERR-XRAY-101 X-ray chubu kutenthedwa Imani kaye kuzindikira ndikuziziritsa dongosolo; fufuzani ngati chokupizira chozizira ndi chabwinobwino.

ERR-DET-205 Flat panel detector kusokoneza kulankhulana Yambitsaninso chowunikira; fufuzani kugwirizana kwa chingwe kapena m'malo mwa bolodi la mawonekedwe.

ERR-MOT-304 Motion axis kunja kwa malire (makina kupanikizana) Bwezerani pamanja gawo loyenda; fufuzani njanji zinthu zakunja kapena galimoto galimoto.

ERR-SOFT-409 Kumanganso kwazithunzi kunalephera (kutayika kwa data) Kujambulanso; Sinthani mapulogalamu kapena funsani thandizo laukadaulo la SAKI.

CHENJEZO-HV-503 Kusinthasintha kwamagetsi apamwamba kwambiri Onani kukhazikika kwamagetsi; kaya waya wapansi ndi wodalirika.

5. Zochitika zogwiritsira ntchito

Kupanga kwamagetsi apamwamba kwambiri:

Smartphone motherboard (Underfill glue kudzaza kuzindikira), 5G RF module.

Zamagetsi zamagalimoto:

ECU control board solder joint reliability verification (yogwirizana ndi AEC-Q100).

Kupaka kwa Semiconductor:

Kuyika kwa Wafer-level (WLP), silicon ya TSV kudzera pamabowo.

6. Malingaliro okonza ndi kuwongolera

Kukonza tsiku ndi tsiku:

Yeretsani zenera la X-ray (filimu yoletsa fumbi) sabata iliyonse ndikuyesa mtengo wa imvi mwezi uliwonse.

Moyo wa zigawo zikuluzikulu:

Moyo wa chubu cha X-ray ndi pafupifupi maola 20,000, ndipo kuchepetsedwa kwamphamvu kwa radiation kuyenera kuyang'aniridwa pafupipafupi.

Kuchita bwino:

Onetsetsani kuti chitseko chotchingira zida chatsekedwa ndipo kutulutsa kwa radiation kumagwirizana ndi muyezo wa IEC 62494-1 (≤1μSv/h).

7. Kuyerekezera kwa mpikisano wa msika

Kufananitsa zinthu za SAKI BF-3AXiM200 Zopikisana (monga Nordson Dage XD7600)

Kusamvana 0.5μm (kukulitsa kwanuko) 0.3μm (mtengo wapamwamba)

Kuthamanga kwa CT sikani Kuthamanga kwapakatikati (potengera kulondola) Kuthamanga kochepa (machitidwe olondola kwambiri)

Ntchito ya AI Gulu lachilema Chomangika Pamafunika kukulitsa mapulogalamu a chipani chachitatu

Mtengo Wapakati-mpaka-wokwera kwambiri (wotsika mtengo kwambiri) Wapamwamba kwambiri (30% ~ 50% premium)

8. Malingaliro osankha ogwiritsa ntchito

Masankhidwe ovomerezeka:

Zitsanzo za mzere wopanga kapena kusanthula kwa labotale komwe kumayenera kulinganiza liwiro komanso kulondola.

Opanga zamagetsi zamagalimoto / zamankhwala omwe ali ndi ndalama zochepa koma amafunikirabe ntchito za 3D X-Ray.

Zosavomerezeka:

Pamafunika kusintha kwa nanometer (monga kusanthula kulephera kwa chip) kapena kuzindikira kwathunthu pa intaneti 100%.