SAKI smt 2D AOI BF-LU1

Zotsatirazi ndi mawu oyambilira a SAKI 2D AOI BF-LU1, kutengera momwe ilili, mawonekedwe ake, ntchito zake zazikulu, mpikisano wamsika komanso momwe amagwirira ntchito.

1. Zida Mwachidule

Chitsanzo: SAKI BF-LU1

Mtundu: Zida zoyendera zothamanga kwambiri za 2D (AOI)

Kuyika kwapakati: PCB imayendera mwachangu kumapeto kwapakati ndi kumbuyo kwa mizere yopanga ma SMT (pambuyo pa reflow soldering), kuyang'ana pakuchita bwino kwamitengo yamtengo wapatali komanso kukhazikika kodziwikiratu, koyenera minda yotsika mtengo monga magetsi ogula ndi kuwongolera mafakitale.

Njira yaukadaulo: Kujambula koyera kwa 2D, kophatikizidwa ndi kuyatsa kwamitundu ingapo ndi kukhathamiritsa kwa algorithm, kuthamanga kofananira ndi kulondola.

2. Zamakono zamakono ndi kasinthidwe ka hardware

(1) Optical imaging system

Kamera yowoneka bwino:

Wokhala ndi 5-megapixel mpaka 20-megapixel CMOS kamera (kutengera kasinthidwe), osachepera detectable chigawo kukula ndi 01005 (0.4mm×0.2mm).

Multi-angle light source system:

Kuphatikizika kwa mphete ya RGB + coaxial kuwala, kumathandizira mitundu yowunikira yopitilira 16, kumakulitsa kusiyana kwa ma solder, zilembo, ndi matupi azinthu.

(2) Kamangidwe ka makina

Mapangidwe a Modular:

flexible kusankha conveyor njanji m'lifupi (imathandizira bolodi m'lifupi 50mm ~ 450mm) kuti azolowere kupanga Mipikisano zosiyanasiyana.

Kuwongolera kothamanga kwambiri:

Kutengera servo motor drive, liwiro lozindikira limatha kufika 25cm²/s~40cm²/s (malingana ndi zovuta ndi kasinthidwe).

(3) Ntchito yamapulogalamu

Algorithm yodziwika bwino ya SAKI:

Chigamulo chokhazikitsidwa ndi malamulo, chimathandizira mitundu yopitilira 50 ya zolakwika monga ma solder joints (malata osakwanira, ma bridging), zida (zigawo zomwe zikusowa, kuchotsera, kusinthasintha).

Mawonekedwe osavuta ogwiritsira ntchito:

Mapulogalamu azithunzi (Kokani & Dontho), amathandizira kulowetsa maphikidwe osagwiritsa ntchito intaneti, ndipo nthawi yosintha mizere imatha kuwongoleredwa mkati mwa mphindi 15.

3. Kutha kuzindikira koyambira

(1) Kuzindikira kolumikizana kwa solder

2D morphological kusanthula: oweruza solder paste anomalies (monga bridging, osakwanira solder) ndi mtundu, contour, dera, etc.

Zolepheretsa: sangathe kuyeza kutalika kwa olowa kapena kuchuluka kwa solder, ndipo ali ndi mphamvu zochepa zodziwira zolumikizira pansi za BGA/CSP.

(2) Kuzindikira koyika kwa gawo

Kukhalapo / polarity: zindikirani zigawo za 0402/0201/01005, malangizo a IC, ndi magawo osagwirizana (monga zopinga zosakanikirana ndi ma capacitor).

Kulondola kwamalo: zindikirani kuchotsera (± 25μm), kupendekera (mwala wamanda).

(3) Kugwirizana

Kusintha kwamtundu wa bolodi: bolodi lolimba, bolodi losavuta losinthika (zofunikira zapadera).

chigawo chapakati: 01005 yaying'ono zigawo zikuluzikulu capacitors electrolytic (kutalika ≤15mm).

4. Zochitika zogwiritsira ntchito

Consumer electronics:

Ma board owongolera zida zapanyumba, ma module owunikira a LED ndi ma PCB ena apakatikati ndi otsika.

Kuwongolera mafakitale:

Ma module a PLC, ma board oyang'anira mphamvu, omwe amafunikira kuthamanga kwa kuzindikira kulondola kwambiri.

Mizere yotsika mtengo, yokwera kwambiri:

Maphunziro a SMT omwe akufunika kutumiza AOI mwachangu komanso kukhala ndi bajeti zochepa.

5. Ubwino wampikisano ndi malire

(1) Ubwino

Kutsika mtengo: mtengo wotsika kwambiri kuposa 3D AOI, kukonza kosavuta (palibe kutayika kwa module ya laser).

Kuthamanga patsogolo: koyenera kupanga mizere yayikulu, UPH (chiwerengero cha matabwa oyesedwa pa ola limodzi) chikhoza kufika matabwa 200 ~ 300 (malingana ndi kukula kwa bolodi).

Kusavuta kugwiritsa ntchito: malo otsika ogwirira ntchito, oyenera ogwira ntchito zaukadaulo kuti ayambe msanga.

(2) Zopereŵera

Zolepheretsa ukadaulo wa 2D:

Sitingathe kuzindikira zolakwika zokhudzana ndi kutalika kwa mfundo za solder (monga malo ozizira a solder, coplanarity), komanso zosavuta kuweruza molakwika zigawo zowunikira kwambiri (monga zala zagolide).

Zochitika zosavomerezeka:

Zamagetsi zamagalimoto, zida zamankhwala ndi magawo ena omwe ali ndi zofunika kwambiri pakuzindikira kuchuluka kwa 3D.

6. Kuyerekeza kwa Maonekedwe a Msika

Kufananiza Zinthu SAKI BF-LU1 (2D) SAKI 3Di Series (3D)

Kuzindikira Dimension 2D (ndege) 3D (kutalika + voliyumu)

Kutha Kuzindikira Malo Ogulitsira Kumatengera Mtundu/Contour Mwachindunji Imayesa Kuchuluka kwa Tini

Liwiro Lalikulu (25 ~ 40cm²/s) Liwiro lapakati (lochepa ndi kusanthula kwa 3D)

Mtengo Wotsika (pafupifupi 1/3 ya 3D AOI) M'mwamba

Applicable Industries Consumer Electronics, Industrial Automobile, Medical, Semiconductor

7. Malangizo Osankha Ogwiritsa Ntchito

Zoyenera kusankha BF-LU1:

Mzere wopanga makamaka zochokera PCBs sing'anga ndi otsika zovuta, ndipo bajeti ndi ochepa.

Palibe chofunikira chokhazikika pakuzindikira kutalika kwa malo a solder, kapena kuchuluka kwa phala la solder kumayendetsedwa ndi njira zina (monga SPI).

Mikhalidwe Yosavomerezeka:

BGA/QFN pansi solder olowa kapena kopitilira muyeso-bwino phula zigawo zikuluzikulu (<0.1mm) ayenera kudziwika.

8. Kusintha kosinthika kosankha

Gulu lothandizidwa ndi AI: Onjezani gawo la AI kuti muchepetse ma alarm abodza (chilolezo chowonjezera chofunikira).

Kuzindikira kwa mayendedwe apawiri: Konzani zotuluka (zoyenera matabwa ang'onoang'ono).

9. Njira zodzitetezera

Zofunikira zachilengedwe: Pewani kuwala kwa dzuwa, ndikuwongolera kutentha ndi chinyezi mkati mwa magawo oyambira a SMT (23 ± 3 ° C, chinyezi <60%).