SAKI smt 2D AOI BF-LU1

Wammanga ye nnyanjula enzijuvu ku SAKI 2D AOI BF-LU1, ekwata ku kifo kyayo, ebikozesebwa mu by’ekikugu, emirimu emikulu, okuvuganya kw’akatale n’embeera eza bulijjo ez’okukozesa.

1. Okukubaganya ebirowoozo ku byuma

Omuze guno: SAKI BF-LU1

Ekika: Ebyuma ebikebera amaaso mu ngeri ya 2D ey’amaanyi (AOI)

Core positioning: PCB assembly okwekenneenya amangu ku nkomerero ya wakati n’emabega ya SMT production lines (oluvannyuma reflow soldering), essira ku kukola ku ssente ennyingi n’omuwendo gw’okuzuula ogutebenkedde, ogusaanira ennimiro ezikwata ku ssente nga ebyuma ebikozesebwa n’okufuga amakolero.

Ekkubo ery’ekikugu: Okukuba ebifaananyi ebirongoofu mu ngeri ya 2D, nga kugatta wamu n’okutaasa okw’enjawulo (multi-spectral lighting) n’okulongoosa enkola ya algorithm, okutebenkeza sipiidi n’obutuufu.

2. Tekinologiya omukulu n’okusengeka ebikozesebwa

(1) Enkola y’okukuba ebifaananyi mu maaso

Kkamera ey’obulungi obw’amaanyi:

Nga eriko kkamera ya CMOS eya megapikseli 5 okutuuka ku megapikseli 20 (okusinziira ku nsengeka), sayizi y’ekitundu esinga obutono ezuulibwa eri 01005 (0.4mm×0.2mm).

Enkola y’ensibuko y’ekitangaala ey’enkoona eziwera:

Ring RGB + coaxial light combination, ewagira modes z’okutaasa ezisoba mu 16, eyongera ku njawulo y’ebiyungo bya solder, characters, n’emibiri gy’ebitundu.

(2) Enteekateeka y’ebyuma

Ensengeka ya modulo:

Flexible okulonda conveyor track obugazi (awagira board obugazi 50mm ~ 450mm) okutuukagana n'okufulumya multi-enjawulo.

Okufuga entambula ku sipiidi ey’amaanyi:

Okwettanira servo motor drive, sipiidi y’okuzuula esobola okutuuka ku 25cm2/s ~ 40cm2/s (okusinziira ku buzibu n’ensengeka).

(3) Omulimu gwa pulogulaamu

Enkola y’okuzuula omutindo gwa SAKI:

Okusalawo kw’obulema okwesigamiziddwa ku mateeka, kuwagira ebika by’obulema ebisukka mu 50 nga ebiyungo bya solder (ebbaati etamala, bridge), ebitundu (ebitundu ebibula, offset, reverse polarity).

Enkola ennyangu ey’okukola:

Graphical programming (Drag & Drop), ewagira okuyingiza enkola ezitali ku mutimbagano, era obudde bw’okukyusa layini busobola okufugibwa mu ddakiika 15.

3. Obusobozi bw’okuzuula obukulu

(1) Okuzuula ekiyungo kya solder

Okwekenenya enkula ya 2D: salawo obutali bumativu bwa solder paste (nga bridging, solder obutamala) okusinziira ku langi, contour, ekitundu, n’ebirala.

Ebikoma: tasobola kupima butereevu buwanvu oba obuzito bwa kiyungo kya solder, era alina obusobozi obutono obw’okuzuula ebiyungo bya solder wansi ebya BGA/CSP.

(2) Okuzuula okuteekebwa kw’ebitundu

Okubeerawo/polarity: zuula ebitundu 0402/0201/01005, obulagirizi bwa IC, n’ebitundu ebitakwatagana (nga resistors ne capacitors ezitabuliddwa).

Obutuufu bw’ekifo: okuzuula offset (±25μm), okulengejja (ejjinja ly’entaana).

(3) Okukwatagana

Okukyusa ekika kya board: rigid board, simple flexible board (ekintu eky’enjawulo ekyetaagisa).

Ebitundu range: 01005 micro ebitundu okutuuka ku capacitors ennene electrolytic (obugulumivu ≤15mm).

4. Ensonga eza bulijjo ez’okukozesa

Ebyuma ebikozesebwa mu byuma bikalimagezi:

Ebipande ebifuga ebyuma by’omu nnyumba, modulo z’amataala ga LED ne PCB endala ez’obuzibu obw’omu makkati n’obutono.

Okufuga amakolero:

Module za PLC, ebipande ebiddukanya amaanyi, ebyetaaga sipiidi y’okuzuula okusinga obutuufu obuyitiridde.

Layini z’okufulumya ez’ebbeeyi entono, ez’obungi obw’amaanyi:

Emisomo gya SMT egyetaaga okuteeka mu nkola amangu AOI era nga girina embalirira entono.

5. Enkizo n’obuzibu mu kuvuganya

(1) Ebirungi ebirimu

Okukendeeza ku nsaasaanya: bbeeyi ya wansi nnyo okusinga 3D AOI, okuddaabiriza okwangu (tewali kufiirwa kwa modulo ya layisi).

Sipiidi ekulembeza: esaanira layini z’okufulumya ennene, UPH (omuwendo gw’embaawo ezigezesebwa buli ssaawa) esobola okutuuka ku bipande 200 ~ 300 (okusinziira ku sayizi y’embaawo).

Obwangu bw’okukozesa: omusingi gw’emirimu ogwa wansi, gusaanira abakozi ab’ekikugu okutandika amangu.

(2) Ebikoma

Ebikoma ku tekinologiya wa 2D:

Obutasobola kuzuula bulema obukwatagana n’obuwanvu bw’ekiyungo kya solder (nga ebiyungo bya solder ebinyogovu, coplanarity), era nga kyangu okusalawo obubi ebitundu ebitangaaza ennyo (nga engalo za zaabu).

Ensonga ezitakwatagana:

Ebyuma ebikozesebwa mu mmotoka, ebyuma by’obujjanjabi n’emirimu emirala ebirina ebisaanyizo ebikakali eby’okuzuula omuwendo mu ngeri ya 3D.

6. Okugeraageranya embeera y’akatale

Ebintu ebigeraageranya SAKI BF-LU1 (2D) SAKI 3Di Series (3D)

Ekipimo ky’okuzuula 2D (ennyonyi) 3D (obugulumivu + obuzito) .

Obusobozi bw’okuzuula ebifo bya Solder Businziira ku Langi/Contour Buba Butereevu Omuwendo gwa Tin

Sipiidi Sipiidi ya waggulu (25~40cm2/s) Sipiidi eya wakati-ya waggulu (ekoma ku 3D scanning)

Ebisale Ebitono (nga 1/3 ya 3D AOI) Waggulu

Amakolero agakozesebwa Ebyuma ebikozesebwa mu byuma bikalimagezi, Emmotoka y’amakolero, Eby’obujjanjabi, Semiconductor

7. Ebiteeso by’okulonda abakozesa

Obukwakkulizo bw’okulonda BF-LU1:

Layini y’okufulumya okusinga yeesigamiziddwa ku PCB ez’obuzibu obwa wakati n’obuzibu obutono, era embalirira ntono.

Tewali kyetaagisa kikakali ku kuzuula buwanvu bwa solder spot, oba omuwendo gwa solder paste gubadde gufugibwa mu ngeri endala (nga SPI).

Embeera Ezitasemba:

BGA/QFN wansi solder joints oba ultra-fine pitch components (<0.1mm) zeetaaga okuzuulibwa.

8. Ensengeka y’okulongoosa ey’okwesalirawo

Okugabanya okuyambibwako AI: Yongera modulo ya AI okukendeeza ku alamu ez'obulimba (layisinsi ey'enjawulo yeetaagibwa).

Dual-track detection: Okulongoosa throughput (esaanira ku boards entono).

9. Okwegendereza

Ebyetaago by’obutonde: Weewale omusana obutereevu, era fuga ebbugumu n’obunnyogovu mu mutindo gw’omusomo gwa SMT ogwa mutindo (23±3°C, obunnyogovu <60%).