SAKI smt 2D AOI BF-LU1

Oku kulandelayo yintshayelelo eneenkcukacha ye-SAKI 2D AOI BF-LU1, equka indawo yayo, iimpawu zobugcisa, imisebenzi engundoqo, ukukhuphisana kwemarike kunye neemeko zosetyenziso eziqhelekileyo.

1. Isishwankathelo seZixhobo

Umzekelo: SAKI BF-LU1

Uhlobo: Isantya esiphezulu se-2D isixhobo sokuhlola okuzenzekelayo (AOI)

Ukubekwa kwe-core: Ukuhlolwa kwe-PCB ngokukhawuleza kwi-middle and back end ye-SMT imigca yokuvelisa (emva kwe-reflow soldering), kugxininise ekusebenzeni kweendleko eziphezulu kunye nezinga lokufumanisa oluzinzileyo, olufanelekileyo kwiinkalo zeendleko ezifana ne-electronics yabathengi kunye nolawulo lwamashishini.

Indlela yobuchwephesha: I-2D ye-optical imaging ecocekileyo, idibaniswe nokukhanya kwe-multi-spectral kunye nokulungiswa kwe-algorithm, isantya sokulinganisa kunye nokuchaneka.

2. Itekhnoloji engundoqo kunye noqwalaselo lwe-hardware

(1) Inkqubo yokujonga umfanekiso

Ikhamera enesisombululo esiphezulu:

Ixhotyiswe nge-5-megapixel ukuya kwi-20-megapixel yekhamera ye-CMOS (kuxhomekeke kuqwalaselo), ubuncinci becandelo elibonakalayo liyi-01005 (0.4mm×0.2mm).

Inkqubo yomthombo wokukhanya oneengile ezininzi:

Iringi ye-RGB + indibaniselwano yokukhanya kwe-coaxial, ixhasa ngaphezulu kwe-16 iindlela zokukhanyisa, yongeza umahluko wamalungu e-solder, abalinganiswa, kunye nemizimba yecandelo.

(2) Uyilo lomatshini

Ubume bemodyuli:

Ukukhetha okuguquguqukayo kobubanzi bomzila wokuhambisa (ixhasa ububanzi bebhodi 50mm ~ 450mm) ukulungelelanisa kwimveliso eyahlukeneyo.

Ulawulo lwentshukumo olukwisantya esiphezulu:

Ukwamkela i-servo motor drive, isantya sokubona sinokufikelela kwi-25cm²/s~40cm²/s (kuxhomekeke kububunzima kunye noqwalaselo).

(3) Umsebenzi weSoftware

I-algorithm yokubona umgangatho we-SAKI:

Isigwebo esisekelwe kumthetho, sixhasa ngaphezu kwe-50 iintlobo zeziphene ezifana ne-solder joints (i-tin eyoneleyo, i-bridging), amacandelo (amalungu alahlekileyo, i-offset, i-polarity ebuyela umva).

Ujongano lokusebenza olulula:

Inkqubo yeGraphical (i-Drag & Drop), ixhasa ukungenisa iresiphi engaxhunyiwe kwi-intanethi, kunye nexesha lokutshintsha umgca lingalawulwa kwimizuzu eyi-15.

3. Izakhono zokubona ezingundoqo

(1) Ukufunyanwa kwe-solder joint

Uhlalutyo lwe-2D ye-morphological: ijaji ye-solder paste anomalies (efana ne-bridging, i-solder enganelanga) ngombala, i-contour, indawo, njl.

Unyino: ayikwazi ukulinganisa ngokuthe ngqo ukuphakama kwejoyinti ye-solder okanye umthamo, kwaye inamandla okubona okulinganiselweyo kwi-BGA / CSP ye-solder joints ezantsi.

(2) Ukubonwa kokubekwa kwecandelo

Ubukho / i-polarity: chonga i-0402/0201/01005 amacandelo, ulwalathiso lwe-IC, kunye namacandelo angahambelaniyo (njengama-resistors axubileyo kunye ne-capacitors).

Ukuchaneka kwesikhundla: fumana i-offset (± 25μm), i-tilt (ilitye lengcwaba).

(3) Ukuhambelana

Ukulungelelaniswa kohlobo lwebhodi: ibhodi eqinile, ibhodi elula eguquguqukayo (ukulungiswa okukhethekileyo kuyafuneka).

Uluhlu lwamacandelo: I-01005 i-micro components ukuya kwi-electrolytic capacitors enkulu (ubude ≤15mm).

4. Iimeko zesicelo esiqhelekileyo

Consumer electronics:

Iibhodi zokulawula izixhobo zasekhaya, iimodyuli zokukhanyisa i-LED kunye nezinye iiPCB ezinzima eziphakathi kunye neziphantsi.

Ulawulo lwemizi-mveliso:

Iimodyuli ze-PLC, iibhodi zokulawula amandla, ezifuna isantya sokubona ngokuchaneka okugqithisileyo.

Imigca yemveliso enexabiso eliphantsi, enomthamo ophezulu:

Iindibano zocweyo ze-SMT ekufuneka zisasaze ngokukhawuleza i-AOI kwaye zibenohlahlo lwabiwo-mali olunyiniweyo.

5. Iinzuzo zokukhuphisana kunye nezithintelo

(1) Iingenelo

Ukusebenza kweendleko: ixabiso eliphantsi kakhulu kune-3D AOI, ukugcinwa okulula (akukho kulahleka kwemodyuli ye-laser).

I-Speed ​​​​priority: ifanelekile kwimigca yemveliso emikhulu, i-UPH (inani leebhodi ezivavanywa ngeyure) inokufikelela kwiibhodi ze-200 ~ 300 (kuxhomekeke kubukhulu bebhodi).

Ukusebenziseka ngokulula: umda ophantsi wokusebenza, ofanelekileyo kubasebenzi bezobugcisa ukuba baqalise ngokukhawuleza.

(2) Ukusikelwa umda

Unyino lwetekhnoloji ye-2D:

Ayikwazanga ukubona iziphene ezinxulumene nobude bomdibaniso we-solder (ezifana nezihlanganisi ezibandayo ze-solder, i-coplanarity), kwaye kulula ukungaziqondi kakuhle izinto ezibonisa kakhulu (ezifana neminwe yegolide).

Iimeko ezingasebenziyo:

I-Automotive electronics, izixhobo zonyango kunye nezinye iindawo ezineemfuno ezingqongqo zokufumanisa ubungakanani be-3D.

6. Uthelekiso lokuma kweMarike

Izinto zothelekiso SAKI BF-LU1 (2D) SAKI 3Di Series (3D)

Ukufunyanwa kweDimension 2D (inqwelomoya) 3D (ubude + nomthamo)

Ukukwazi ukubonwa kweNdawo yeSoda kuxhomekeke kuMbala/iContour ngokuNgqo uQinisekisa iSixa seToti

Isantya esiphezulu (25~40cm²/s) Isantya esiphakathi-phezulu (sinqanyulwe kukuskena kwe-3D)

Iindleko eziPhantsi (malunga ne-1/3 ye-3D AOI) Phezulu

I-Industries eSebenzayo i-Electronics yabathengi, i-Automobile ye-Industrial, i-Medical, i-Semiconductor

7. Iingcebiso zokuKhetha uMsebenzisi

Imiqathango yokuKhetha i-BF-LU1:

Umgca wemveliso usekelwe ikakhulu kwi-PCB ephakathi kunye nephantsi, kwaye uhlahlo lwabiwo-mali lulinganiselwe.

Akukho mfuneko engqongqo yokubhaqwa kobude bendawo ye-solder, okanye isixa se-solder paste silawulwe ngezinye iindlela (ezifana ne-SPI).

Iimeko ezingacetyiswanga:

I-BGA / QFN i-solder joints ephantsi okanye i-ultra-fine pitch components (<0.1mm) kufuneka ibonwe.

8. Uhlengahlengiso olukhethwayo lokuphucula

Ukuhlelwa okuncediswa yi-AI: Yongeza imodyuli ye-AI ukunciphisa ii-alamu zobuxoki (ilayisensi eyongezelelweyo iyafuneka).

Ukubonwa kweendlela ezimbini: Phucula i-throughput (efanelekile kwiibhodi ezinobungakanani obuncinci).

9. Izilumkiso

Iimfuno zokusingqongileyo: Gwema ilanga elithe ngqo, kwaye ulawule ubushushu kunye nokufuma ngaphakathi koluhlu oluqhelekileyo lweworkshop ye-SMT (23±3 °C, ukufuma <60%).