SAKI smt 3D SPI 3Si-LS3EX

I-SAKI 3Si-LS3EX yinto ephezulu yokusebenza ye-3D ye-solder yokuhlola izixhobo zokuhlola (SPI, i-Solder Paste Inspection), eyenzelwe i-SMT ephezulu echanekileyo (i-teknoloji ye-surface mount) imigca yokuvelisa. Isetyenziselwa ukufumanisa ngokuzenzekelayo iiparameters eziphambili ezifana nomthamo, ukuphakama, ukumila, i-offset, njl.

1. Isishwankathelo seZixhobo

Umzekelo: SAKI 3Si-LS3EX

Uhlobo: 3D SPI (Inkqubo yoHlolo yokuHlola iSolder yeLaser Scanning)

Undoqo wosetyenziso:

Khangela umgangatho wokushicilela we-solder paste (i-tin encinci, i-tin eninzi, ibhulorho, i-tip, i-offset, njl.).

Ukubonelela nge-SPC (uLawulo lweNkqubo yeNkxaso-manani) ukunyusa inkqubo yoshicilelo.

Ikhonkco nabashicileli (abanje nge DEK, MPM) ukufikelela kulawulo oluvaliweyo.

2. Ubuchwephesha obungundoqo kunye noBumbeko lweHardware

(1) ITekhnoloji yoMfanekiso ye-3D

ILaser Triangulation:

Sebenzisa i-laser echanekileyo ephezulu yokuskena ukulinganisa ubude, umthamo, indawo, kunye ne-coplanarity ye-solder paste.

Isisombululo se-Z-axis ≤1μm, ekwaziyo ukubona iipads zecandelo ezincinci ezifana ne-01005 (0.4mm×0.2mm).

Isibane esincedisayo esinamehlo amaninzi (ukhetho):

Idityaniswe ne-RGB + umthombo wokukhanya kwe-infrared, yongeza umahluko phakathi kwe-solder paste kunye ne-PCB kwaye iphucula uzinzo lokubona.

(2) Inkqubo yokufumanisa isantya esiphezulu

Isantya sokubhaqa:

20 ~ 60cm²/s (kuxhomekeke kwiimfuno zokuchaneka, ukuya kuthi ga kwisisombululo se-10μm).

Ulawulo lwentshukumo:

Sebenzisa i-motor echanekileyo ephezulu yomgca ukuqinisekisa ukuzinza kokuskena kunye nokuphindaphinda.

Ixhasa ukufunyanwa kweendlela ezimbini (ukhetho) ukuphucula ukuveliswa komgca wemveliso.

(3) Iqonga lesoftware elikrelekrele

I-SAKI VisionPro okanye i-AIx (uguqulelo oluphuculweyo lwe-AI):

Uhlalutyo lwexesha langempela le-SPC: Bala ngokuzenzekelayo i-Cpk / Ppk kwaye ubeke iliso kwi-solder paste ukuzinza kokushicilela.

Ukuhlelwa kwesiphene se-AI: Ukuchonga ngokuzenzekelayo iziphene ezifana ne-tin eyaneleyo, i-bridging, kunye neengcebiso zokutsala ukunciphisa izinga lokugweba kakubi (<1%).

Ulawulo lwe-loop evaliweyo: Idityaniswe nabashicileli (abafana ne-DEK, i-MPM) ukulungisa ngokuzenzekelayo iiparamitha ze-scraper.

3. Izakhono zokubona ezingundoqo

(1) I-Solder incamathelise umlinganiselo weparamitha ye-3D

Izinto zokubona Imilinganiselo yeeparamitha Iziphene eziqhelekileyo

Ubude Itoti yokuncamathisela yeSolder (μm) Itoti engonelanga, inkonkxa egqithisileyo

Umthamo womthamo weSoda yokuncamathisela (mm³) Itoti enganelanga, intlama yesoda yosasazo

Indawo yokugutyungelwa kwentlama yeSolder (mm²) Ukulinganisa, umngcipheko wokuvala ibhuloho

I-Shape Solder Cola icontour (imodeli ye-3D) Iingcebiso zokutsalwa, bhitya

(2) Ukuhambelana

Ubungakanani bePCB: Ubuninzi benkxaso 510mm × 460mm (customizable).

Uluhlu lwamacandelo:

Ubuncinci bokufumanisa i-01005 (0.4mm×0.2mm) pad.

Ixhasa ukupakishwa koxinano oluphezulu njengeBGA, QFN, CSP, Flip Chip, njl.

Uhlobo lomnatha wentsimbi:

Isebenza kwi-steel mesh, i-nano-coated metal mesh, i-electroformed steel mesh, njl.

4. Iinzuzo eziphambili

(1) Ukuthelekisa kunye ne-2D SPI

Izinto zokuthelekisa i-SAKI 3Si-LS3EX (3D SPI) ye-2D SPI yesiNtu

Ukubona imilinganiselo ye-3D (ubude + nomthamo) 2D (indawo kuphela)

Umlinganiselo wento yokuncamathisela yesoda Ngqo ubungakanani betoti Thembela kuqikelelo lwexabiso le-grayscale

Izinga lokubona isiphene Uyakwazi ukubona i-solder ebandayo kunye neengxaki ze-coplanarity Ayinakubona iziphene ezinxulumene nobude

Iimeko ezisebenzayo Ukuchaneka okuphezulu kweemoto/izixhobo zombane zezonyango Iindleko eziphantsi zabathengi

(2) Ukuthelekisa kunye ne-3D SPI ekhuphisanayo

Izinto zokuthelekisa i-SAKI 3Si-LS3EX Koh Young KY8030 ViTrox V810i

Itekhnoloji yokufumanisa I-laser triangulation I-Moiré fringe projection Intelekelelo yokukhanya eyakhiweyo

Ukuchaneka kwe-Z-axis ≤1μm ≤0.5μm ≤1.5μm

Isantya sokubhaqa 20 ~ 60cm²/s 15~50cm²/s 10 ~ 40cm²/s

Umsebenzi we-AI Wakhelwe ngaphakathi (i-AIx ngokuzikhethela) Ifuna ugunyaziso olongezelelweyo I-algorithm esisiseko

Ukubekwa kwexabiso Mid-to-high-end High-end Mid-range

5. Iimeko zesicelo esiqhelekileyo

I-motherboard ye-smartphone: Khangela i-0.3mm pitch ye-BGA / CSP ye-solder yokuprinta umgangatho wokushicilela.

I-Automotive electronics: Qinisekisa ukuba i-solder paste ye-ECU kunye neemodyuli ze-sensor idibana ne-IPC-A-610 ye-Class 3 yeklasi.

Ukupakishwa kwe-Semiconductor: Ukufunyanwa kwebhola ye-Solder yokupakisha i-wafer-level packaging (WLP).

6. Iimpazamo eziqhelekileyo kunye neendlela zokuphatha

Ikhowudi yempazamo enokwenzeka Isisombululo

ERR-LS-301 ulungelelwaniso lweLaser olungaqhelekanga Yenza ulungelelwaniso oluzenzekelayo okanye uqhagamshelane nenkxaso yobuchule ye-SAKI

I-ERR-MOT-402 iqonga lentshukumo liphumile kumda Jonga ukuba iPCB ibambekile kwaye usete ngokutsha imodyuli yentshukumo

I-ERR-CAM-511 Ukungaphumeleli konxibelelwano lwekhamera Qala kwakhona inkqubo kwaye ukhangele uxhulumaniso lwekhebula ledatha

IWARN-DATA-601 Uncamathiselo lwedatha yeSolder engafanelekanga

7. Iingcebiso zogcino kunye nolungelelwaniso

Ukugcinwa kwemihla ngemihla: Coca ifestile yelaser kunye netafile yeglasi.

Ulungelelwaniso lweveki: Sebenzisa ibhloko yobude obusemgangathweni ukuqinisekisa ukuchaneka kwe-Z.

Isishwankathelo

I-SAKI 3Si-LS3EX sisixhobo esichanekileyo, esinesantya esiphezulu, esikrelekrele se-3D SPI esifanelekileyo kwimveliso ye-elektroniki ephezulu kunye neemfuno ezingqongqo kumgangatho wokushicilela we-solder, ngakumbi kwiinkalo ze-automotive electronics kunye ne-semiconductor packaging. Ukudibanisa kwayo ukuskena kwe-laser + uhlalutyo lwe-AI kunokuphucula kakhulu isivuno se-SMT kunye nokunciphisa iindleko zokusebenza kwakhona.