SAKI smt 3D SPI 3Si-LS3EX

SAKI 3Si-LS3EX ye kyuma eky’okukebera solder paste mu ngeri ya 3D (SPI, Solder Paste Inspection), ekoleddwa ku layini z’okufulumya SMT (surface mount technology) ezikola obulungi ennyo. Kikozesebwa okuzuula mu ngeri ey’otoma ebikulu ebipimo nga volume, height, shape, offset, n’ebirala ebya solder paste oluvannyuma lw’okukuba ebitabo era nga tonnaba kussaako patching okukakasa nti stable printing process n’okukendeeza ku soldering defects after reflow soldering.

1. Okukubaganya ebirowoozo ku byuma

Omutindo gwa mmotoka: SAKI 3Si-LS3EX

Ekika: 3D SPI (Enkola ya Laser Scanning Solder Paste Enkola y’okukebera)

Okukozesa Omusingi:

Zuula omutindo gw’okukuba ebitabo mu solder paste (ebbaati entono, ebbaati enyingi, omutala, ensonga y’okusika, offset, n’ebirala).

Okuwa data ya SPC (Statistical Process Control) okulongoosa enkola y’okukuba ebitabo.

Link ne printers (nga DEK, MPM) okutuuka ku closed-loop control.

2. Okusengeka Tekinologiya Omukulu & Hardware

(1) Tekinologiya w’okukuba ebifaananyi mu ngeri ya 3D

Enjuyi essatu eza layisi:

Kozesa laser scanning ey’obutuufu obw’amaanyi okupima obuwanvu, obuzito, ekitundu, n’obutafaanagana bwa solder paste.

Z-axis resolution ≤1μm, esobola okuzuula paadi z’ebitundu ebitono ennyo nga 01005 (0.4mm×0.2mm).

Amataala agayambako aga spectral multi-spectral (eky’okwesalirawo):

Ng’ogasseeko ensibuko y’ekitangaala kya RGB+infrared, kyongera enjawulo wakati wa solder paste ne PCB n’okulongoosa okutebenkera kw’okuzuula.

(2) Enkola y’okuzuula ku sipiidi ey’amaanyi

Sipiidi y’okuzuula:

20 ~ 60cm2 / s (okusinziira ku butuufu obwetaagisa, okutuuka ku 10μm okusalawo).

Okufuga entambula:

Kozesa high-precision linear motor okukakasa nti sikaani enywevu era nga eddibwamu.

Awagira okuzuula okw’emitendera ebiri (eky’okwesalirawo) okulongoosa enkola y’okufulumya layini y’okufulumya.

(3) Omukutu gwa pulogulaamu ogw’amagezi

SAKI VisionPro oba AIx (enkyusa erongooseddwa mu AI):

Okwekenenya SPC mu kiseera ekituufu: Bala Cpk/Ppk mu ngeri ey’otoma n’okulondoola obutebenkevu bw’okukuba ebitabo mu solder paste.

Okugabanya obulema mu AI: Laba mu ngeri ey’otoma obulema nga bbaati obutamala, okuzimba omukutu, n’ensonga ezisika okukendeeza ku muwendo gw’okusalawo obubi (<1%).

Closed-loop control: Eyungiddwa ku printers (nga DEK, MPM) okutereeza otomatika parameters za scraper.

3. Obusobozi bw’okuzuula obukulu

(1) Solder paste 3D parameter okupima

Ebintu ebizuula Ebipimo ebipima Ebikyamu ebya bulijjo

Obugulumivu Obugumu bw’ekikuta kya solder (μm) Ebbaati etamala, bbaati esukkiridde

Volume Volume ya solder paste (mm3) Ebbaati etamala, okusaasaana kwa solder paste

Ekitundu Ekitundu ekibikka ekikuta kya solder (mm2) Offset, bridge risk

Shape Solder paste contour (3D modeling) Ensonga z’okusika, okugwa

(2) Okukwatagana

Sayizi ya PCB: Obuwagizi obusinga obunene 510mm × 460mm (esobola okulongoosebwa).

Ekitundu ky’ebitundu:

Ekitono eky’okuzuula 01005 (0.4mm×0.2mm) pad.

Awagira okupakinga okw’amaanyi nga BGA, QFN, CSP, Flip Chip, n’ebirala.

Ekika ky’akatimba k’ekyuma:

Ekozesebwa ku mutendera ekyuma akatimba, nano-coated ekyuma akatimba, electroformed ekyuma akatimba, n'ebirala.

4. Ebirungi ebikulu

(1) Okugeraageranya ne 2D SPI

Ebintu ebigeraageranya SAKI 3Si-LS3EX (3D SPI) SPI ey’ekinnansi eya 2D

Ebipimo by’okuzuula 3D (obugulumivu + obuzito) 2D (ekitundu kyokka) .

Okupima ekikuta kya solder Okugera obutereevu obungi bwa bbaati Weesigamye ku kuteebereza omuwendo gw’enzirugavu

Omuwendo gw’okuzuula obulema Gusobola okuzuula ebiyungo bya solder ebinyogovu n’ebizibu bya coplanarity Tesobola kuzuula bulema obukwatagana n’obugulumivu

Ensonga ezikozesebwa Ebyuma ebikozesebwa mu mmotoka/eby’obujjanjabi eby’obutuufu obw’amaanyi Ebyuma ebikozesebwa mu bulamu obwa bulijjo

(2) Okugeraageranya ne 3D SPI evuganya

Ebintu ebigeraageranya SAKI 3Si-LS3EX Koh Young KY8030 ViTrox V810i

Tekinologiya w’okuzuula Laser triangulation Moiré fringe projection Okulaga ekitangaala ekitegekeddwa

Obutuufu bwa Z-axis ≤1μm ≤0.5μm ≤1.5μm

Sipiidi y'okuzuula 20 ~ 60cm2 / s 15 ~ 50cm2 / s 10 ~ 40cm2 / s

Omulimu gwa AI Guzimbibwamu (AIx optional) Yeetaaga olukusa olw’enjawulo Basic algorithm

Ensengeka y’emiwendo Mid-to-high-end High-end Eky’omu makkati

5. Ensonga eza bulijjo ez’okukozesa

Smartphone motherboard: Zuula 0.3mm pitch BGA / CSP solder paste omutindo gw'okukuba ebitabo.

Ebyuma ebikozesebwa mu mmotoka: Kakasa nti solder paste ya ECU ne sensor modules etuukana n’omutindo gwa IPC-A-610 Class 3.

Okupakinga kwa semiconductor: Okuzuula omupiira gwa solder okusobola okupakinga ku ddaala lya wafer (WLP).

6. Ensobi eza bulijjo & enkola z'okukwata

Koodi y'ensobi Ekiyinza okuvaako Ekigonjoolwa

ERR-LS-301 Obutabeera bwa bulijjo mu kupima layisi Kola okupima okw’otoma oba tuukirira abayambi ab’ekikugu aba SAKI

ERR-MOT-402 Motion platform out of limit Kebera oba PCB esibidde era oddemu okuteekawo modulo y’entambula

ERR-CAM-511 Empuliziganya ya kamera eremereddwa Ddamu okutandika enkola era okebere omukutu gwa data cable

WARN-DATA-601 Solder paste data abnormality Kebera oba akatimba k’ekyuma kazibiddwa oba parameters za printer nkyamu

7. Ebiteeso ku ndabirira n’okupima

Okuddaabiriza buli lunaku: Yoza eddirisa lya layisi n’emmeeza y’endabirwamu.

Okupima buli wiiki: Kozesa bulooka y’obugulumivu eya bulijjo okukakasa obutuufu bwa Z-axis.

Okubumbako

SAKI 3Si-LS3EX ye kyuma kya 3D SPI ekituufu, eky’amaanyi, eky’amagezi ekisaanira okukola ebyuma eby’omulembe nga kiriko ebisaanyizo ebikakali ku mutindo gw’okukuba ebitabo mu solder paste naddala mu by’amasannyalaze g’emmotoka n’okupakinga semiconductor. Okugatta kwayo kwa laser scanning + AI analysis kuyinza okulongoosa ennyo SMT yield n’okukendeeza ku rework costs.