SAKI smt 3D SPI 3Si-LS3EX

SAKI 3Si-LS3EX ni ibikoresho byo mu rwego rwo hejuru bya 3D bigurisha ibikoresho byo kugenzura (SPI, Solder Paste Inspection), byashizweho ku murongo wa SMT (tekinoroji yo hejuru). Ikoreshwa muguhita umenya ibipimo byingenzi nkubunini, uburebure, imiterere, offset, nibindi bya paste yagurishijwe nyuma yo gucapa na mbere yo gutobora kugirango habeho uburyo bwo gucapa neza no kugabanya inenge zagurishijwe nyuma yo kugurisha.

1. Incamake y'ibikoresho

Icyitegererezo: SAKI 3Si-LS3EX

Ubwoko: 3D SPI (Laser Scanning Solder Paste Sisitemu)

Gusaba Ibyingenzi:

Menya ibicuruzwa byacapishijwe ubuziranenge bwo gucapa (amabati make, amabati menshi, ikiraro, gukurura inama, offset, nibindi).

Tanga amakuru ya SPC (Igenzura ryibikorwa) kugirango uhindure uburyo bwo gucapa.

Ihuza na printer (nka DEK, MPM) kugirango ugere kumugenzuzi ufunze.

2. Ikoranabuhanga ryibanze & Ibikoresho

(1) Ubuhanga bwo Kwerekana amashusho ya 3D

Triangulation ya Laser:

Koresha lazeri yogusuzuma neza kugirango upime uburebure, ingano, agace, hamwe na coplanarity ya paste paste.

Z-axis ikemura ≤1μm, ishoboye kumenya ultra-ntoya yibikoresho nka 01005 (0.4mm × 0.2mm).

Amatara menshi yingirakamaro (itabishaka):

Ufatanije na RGB + infragre yumucyo utanga isoko, byongera itandukaniro riri hagati yuwagurishije paste na PCB kandi bigatezimbere gutahura.

(2) Sisitemu yo gutahura byihuse

Umuvuduko wo gutahura:

20 ~ 60cm² / s (ukurikije ibisabwa byukuri, kugeza kuri 10 mm ikemurwa).

Kugenzura icyerekezo:

Koresha moteri ihanitse cyane ya moteri kugirango urebe neza gusikana no gusubiramo.

Shyigikira ibice bibiri-byerekana (bidakenewe) kugirango utezimbere umusaruro.

(3) Porogaramu yubwenge ya software

SAKI VisionPro cyangwa AIx (AI yazamuye verisiyo):

Isesengura-nyaryo rya SPC: Bikora mu buryo bwikora Cpk / Ppk hanyuma ukurikirane ibicuruzwa byagurishijwe bihamye.

Gutondekanya inenge ya AI: Menya mu buryo bwikora inenge nka amabati adahagije, ikiraro, hamwe no gukurura inama zo kugabanya igipimo cyo guca imanza (<1%).

Igenzura rifunze: Ihujwe na printer (nka DEK, MPM) kugirango uhite uhindura ibipimo bya scraper.

3. Ubushobozi bwibanze bwo kumenya

(1) Solder paste ibipimo bya 3D

Ibintu byo gutahura Ibipimo byo gupima Inenge zisanzwe

Uburebure bwa Solder paste uburebure (μm) Amabati adahagije, amabati arenze

Umubumbe wa Solder paste ingano (mm³) Amabati adahagije, kugurisha paste ikwirakwizwa

Agace Solder paste ikwirakwizwa (mm²) Offset, ibyago byo gukemura

Shakisha Solder paste kontour (kwerekana imiterere ya 3D) Gukurura inama, gusenyuka

(2) Guhuza

Ingano ya PCB: Inkunga ntarengwa 510mm × 460mm (birashoboka).

Urutonde rw'ibigize:

Kugaragaza byibuze 01005 (0.4mm × 0.2mm) padi.

Shyigikira ibipfunyika byinshi nka BGA, QFN, CSP, Flip Chip, nibindi.

Ubwoko bw'icyuma:

Bikoreshwa mu gutera intambwe ya mesh, nano-yashizwemo ibyuma, amashanyarazi yicyuma, nibindi.

4. Ibyiza byingenzi

(1) Kugereranya na 2D SPI

Kugereranya ibintu SAKI 3Si-LS3EX (3D SPI) Gakondo 2D SPI

Ibipimo byo kumenya 3D (uburebure + ubunini) 2D (agace gusa)

Ibipimo bya Solder bipima Kugereranya mu buryo butaziguye ingano y'amabati Wishingikirize ku giciro cyagaciro

Igipimo cyo gutahura neza gishobora kumenya ingingo zigurisha zikonje hamwe nibibazo bya coplanarity Ntushobora kumenya inenge zijyanye n'uburebure

Ibikurikizwa Byakoreshejwe neza-Imodoka / ubuvuzi bwa elegitoroniki Ubuvuzi buhendutse

(2) Kugereranya na 3D SPI irushanwa

Kugereranya ibintu SAKI 3Si-LS3EX Koh Umusore KY8030 ViTrox V810i

Ubuhanga bwo gutahura Laser triangulation Moiré fringe projection Imiterere yumucyo

Z-axis yukuri ≤1μm ≤0.5μm ≤1.5 mm

Umuvuduko wo kumenya 20 ~ 60cm² / s 15 ~ 50cm² / s 10 ~ 40cm² / s

Imikorere ya AI Yubatswe (AIx itabishaka) Irasaba uruhushya rwinyongera Shingiro algorithm

Ibiciro bihagaze Hagati-hejuru-iherezo-Hejuru-Impera-Hagati

5. Ibisanzwe byo gusaba

Ikibaho cya terefone igendanwa: Menya 0.3mm ikibanza cya BGA / CSP ugurisha ubuziranenge bwo gucapa.

Ibyuma bya elegitoroniki yimodoka: Menya neza ko kugurisha paste ya ECU hamwe na moderi ya sensor yujuje IPC-A-610 Icyiciro cya 3.

Gupakira Semiconductor: Kugurisha umupira wo kugurisha kubipfunyika urwego rwa Wfer (WLP).

6. Amakosa asanzwe & uburyo bwo gukemura

Kode y'amakosa Birashoboka impamvu yo gukemura

ERR-LS-301 Laser Calibration idasanzwe Gukora kalibrasi yikora cyangwa kuvugana na tekinike ya SAKI

ERR-MOT-402 Ihuriro ryimikorere itarenze imipaka Reba niba PCB ikomye hanyuma usubize module yimikorere

ERR-CAM-511 Kunanirwa kw'itumanaho rya Kamera Ongera utangire sisitemu hanyuma urebe amakuru ya kabili

WARN-DATA-601 Solder paste data data idasanzwe Reba niba icyuma cyuma cyahagaritswe cyangwa ibipimo bya printer nibeshya

7. Ibyifuzo byo gufata neza no guhitamo

Kubungabunga buri munsi: Sukura idirishya rya laser hamwe nameza yikirahure.

Calibration ya buri cyumweru: Koresha uburebure busanzwe kugirango umenye Z-axis neza.

Incamake

SAKI 3Si-LS3EX nigikoresho cyihuse cyane, cyihuta, cyubwenge bwa 3D SPI gikwiranye nogukora ibikoresho bya elegitoronike yo mu rwego rwo hejuru kandi bisabwa cyane ku bicuruzwa byacapishijwe ibicuruzwa, cyane cyane mubijyanye n’ibikoresho bya elegitoroniki n’ibikoresho bipfunyika. Gukomatanya kwa laser scanning + AI isesengura birashobora kuzamura cyane umusaruro wa SMT no kugabanya ibiciro byo gukora.