SAKI smt 3D SPI 3Si-LS3EX

SAKI 3Si-LS3EX ndi zida zowunikira kwambiri za 3D solder paste (SPI, Solder Paste Inspection), yopangidwira mizere yolondola kwambiri ya SMT (surface mount technology). Amagwiritsidwa ntchito kuti azindikire magawo ofunikira monga voliyumu, kutalika, mawonekedwe, kuchotsera, ndi zina za solder phala pambuyo pa kusindikiza ndi pamaso pa zigamba kuonetsetsa ndondomeko khola yosindikiza ndi kuchepetsa soldering zilema pambuyo reflow soldering.

1. Zida Mwachidule

Chitsanzo: SAKI 3Si-LS3EX

Mtundu: 3D SPI (Laser Scanning Solder Paste Inspection System)

Ntchito Yoyambira:

Dziwani mtundu wosindikizira wa solder (matani ochepa, malata ambiri, mlatho, nsonga yokoka, offset, etc.).

Perekani deta ya SPC (Statistical Process Control) kuti muwongolere ndondomeko yosindikiza.

Lumikizani ndi osindikiza (monga DEK, MPM) kuti mukwaniritse kuwongolera kotseka.

2. Core Technology & Kukonzekera kwa Hardware

(1) 3D Imaging Technology

Laser Triangulation:

Gwiritsani ntchito sikani yolondola kwambiri ya laser kuti muyeze kutalika, voliyumu, malo, ndi coplanarity wa solder phala.

Z-axis kusamvana ≤1μm, yokhoza kuzindikira mapepala ang'onoang'ono monga 01005 (0.4mm × 0.2mm).

Kuwunikira kothandizira kwamitundu yambiri (ngati mukufuna):

Kuphatikizidwa ndi gwero la kuwala kwa RGB + infrared, kumapangitsa kusiyana pakati pa solder phala ndi PCB ndikuwongolera kukhazikika.

(2) Njira yodziwira mwachangu

Liwiro lozindikira:

20 ~ 60cm²/s (malingana ndi zofunikira zolondola, mpaka 10μm kusamvana).

Zowongolera:

Gwiritsani ntchito injini yolondola kwambiri kuti mutsimikizire kukhazikika komanso kubwerezabwereza.

Imathandizira kuzindikira kwa ma track awiri (posankha) kuti apititse patsogolo njira zopangira.

(3) Pulatifomu yanzeru

SAKI VisionPro kapena AIx (mtundu wowonjezera wa AI):

Kusanthula kwanthawi yeniyeni kwa SPC: Kuwerengera zokha Cpk/Ppk ndikuwunika kukhazikika kwa kusindikiza kwa solder.

Gulu lachilema cha AI: Dziwitsani zokha zolakwika monga malata osakwanira, kutsekereza, ndi nsonga zokoka kuti muchepetse kuganiziridwa molakwika (<1%).

Kuwongolera kotsekeka: Kulumikizidwa ndi osindikiza (monga DEK, MPM) kuti azitha kusintha magawo a scraper.

3. Kutha kuzindikira koyambira

(1) Solder phala 3D parameter muyeso

Zinthu zodziwikiratu Zoyezera zofananira

Kutalika kwa phala la phala la kutalika (μm) malata osakwanira, malata ochulukirapo

Voliyumu ya Solder paste voliyumu (mm³) Tini yosakwanira, kufalikira kwa phala la solder

Area Solder paste coverage area (mm²) Offset, chiwopsezo cholumikizira

Shape Solder paste contour (3D modeling) Malangizo okoka, kugwa

(2) Kugwirizana

PCB kukula: Zolemba malire thandizo 510mm × 460mm (customizable).

Mbali zosiyanasiyana:

Kuzindikira kochepa 01005 (0.4mm×0.2mm) pedi.

Imathandizira ma CD olimba kwambiri monga BGA, QFN, CSP, Flip Chip, etc.

Mtundu wa zitsulo zachitsulo:

Itha kugwiritsidwa ntchito popondaponda zitsulo, zitsulo zokutira nano, mauna achitsulo opangidwa ndi electroformed, etc.

4. Ubwino waukulu

(1) Kuyerekeza ndi 2D SPI

Kufananitsa zinthu SAKI 3Si-LS3EX (3D SPI) Traditional 2D SPI

Kuzindikira miyeso ya 3D (kutalika + voliyumu) ​​2D (malo okha)

Muyezo wa phala la solder Yeretsani mwachindunji kuchuluka kwa malata Dalirani kuyerekeza kwamtengo

Chiwopsezo chozindikira cholakwika Itha kuzindikira zolumikizira zoziziritsa kukhosi ndi zovuta za coplanarity Sitingazindikire zolakwika zokhudzana ndi kutalika

Zomwe zingagwiritsidwe ntchito Zamagetsi zotsika mtengo kwambiri zamagalimoto/zachipatala

(2) Kuyerekeza ndi mpikisano wa 3D SPI

Zofananira za SAKI 3Si-LS3EX Koh Young KY8030 ViTrox V810i

Tekinoloje ya kuzindikira Laser triangulation Moiré fringe projection Mawonekedwe a kuwala

Kulondola kwa Z-axis ≤1μm ≤0.5μm ≤1.5μm

Kuzindikira liwiro 20 ~ 60cm²/s 15 ~ 50cm²/s 10 ~ 40cm²/s

Ntchito ya AI Yomangidwira (AIx mwasankha) Imafuna chilolezo chowonjezera Basic algorithm

Kuyika kwamitengo Pakati-mpaka-mmwamba-mapeto Kwambiri Pakatikati pakatikati

5. Zochitika zogwiritsira ntchito

Bolodi ya ma Smartphone: Dziwani kuti 0.3mm pitch BGA/CSP solder phala kusindikiza khalidwe.

Zamagetsi zamagalimoto: Onetsetsani kuti phala la solder la ECU ndi ma sensor module akukumana ndi IPC-A-610 Class 3 standard.

Kupaka kwa Semiconductor: Kuzindikira kwa mpira wa Solder kwa ma wafer-level packaging (WLP).

6. Zolakwika wamba & kachitidwe njira

Khodi yolakwika Chifukwa chotheka Kuthetsa

ERR-LS-301 Laser calibration abnormality Pangani ma calibration okha kapena funsani thandizo laukadaulo la SAKI

ERR-MOT-402 Motion nsanja yadutsa malire Onani ngati PCB yakhazikika ndikukhazikitsanso gawo losuntha

ERR-CAM-511 Kulephera kulankhulana kwa kamera Yambitsaninso dongosolo ndikuyang'ana kulumikizana kwa chingwe cha data

WARN-DATA-601 Solder paste data abnormality Onani ngati mauna achitsulo atsekedwa kapena zosindikizira ndizolakwika

7. Malingaliro osamalira ndi kuwongolera

Kukonza tsiku ndi tsiku: Tsukani zenera la laser ndi tebulo lagalasi.

Kuyeza kwa mlungu ndi mlungu: Gwiritsani ntchito chipika chokhazikika kuti mutsimikizire kulondola kwa Z-axis.

Chidule

SAKI 3Si-LS3EX ndi chipangizo cholondola kwambiri, chothamanga kwambiri, chanzeru cha 3D SPI choyenera kupanga zinthu zamagetsi zamagetsi zomwe zimakhala ndi zofunikira kwambiri pamtundu wosindikizira wa solder, makamaka pankhani yamagetsi amagalimoto ndi ma semiconductor. Kuphatikiza kwake kwa kusanthula kwa laser + kusanthula kwa AI kumatha kupititsa patsogolo zokolola za SMT ndikuchepetsa mtengo wokonzanso.