SAKI 3Si-LS2 SMT 3D SPI makina

Zotsatirazi ndizofotokozera zambiri za SAKI 3D SPI 3Si-LS2

1. Zida Mwachidule

Chitsanzo: SAKI 3Si-LS2

Mtundu: 3D Solder Paste Inspector

Kore ntchito: Ntchito SMT kupanga mzere pambuyo kusindikiza ndi pamaso zigamba kuti azindikire magawo atatu azithunzi-thunzi monga solder phala voliyumu, kutalika, mawonekedwe, etc., kuonetsetsa kusindikiza khalidwe ndi kupewa zilema pambuyo reflow soldering.

Njira yaukadaulo: Gwiritsani ntchito ma triangulation a laser kapena kuyezetsa kowoneka bwino (kutengera kasinthidwe) kuti mukwaniritse chithunzi cha 3D cholondola kwambiri.

2. Zofunika Kwambiri

Tsatanetsatane wa Parameter

Detection Technology Laser Scanning/Multi-frequency Structured Light (posankha)

Kusintha kwa Z-axis ≤1μm (kubwerezabwereza)

Kuthamanga kwa 15 ~ 50cm² / s (malingana ndi zofunikira zolondola)

Kuzindikira kocheperako chigawo 01005 (0.4mm×0.2mm)

Zolemba malire bolodi kukula 510mm×460mm (customizable)

Solder phala muyeso magawo Volume, kutalika, dera, kuchepetsa, bridging chiopsezo

3. Ukadaulo wapakatikati ndi ntchito

(1) Kujambula kolondola kwambiri kwa 3D

Laser triangulation:

Jambulani phala la solder ndi mizere yothamanga kwambiri ya laser kuti mupange data yamtambo ya 3D kuti muwone kutalika, kuchuluka, ndi kuphatikizika kwa phala la solder.

Kusamvana kungafikire 0.5μm (Z-axis), yomwe ili yoyenera pazitsulo zabwino kwambiri (monga 0.3mm phula BGA).

Kuwunikira kothandizira kwamitundu yambiri (ngati mukufuna):

Kuphatikizidwa ndi gwero la kuwala kwa RGB, imatha kuzindikira nthawi imodzi yosindikiza ya solder paste ndi zotsalira zazitsulo.

(2) Mapulogalamu osanthula mwanzeru

SAKI SPI VisionPro:

Ziwerengero zenizeni za SPC: Pangani mapu ogawa kutalika kwa solder paste, Cpk/Ppk process capability index, ndikuwunika kukhazikika kwa njira yosindikiza.

Chenjezo lachilema: Ingodzilembani nokha malata otsika, kukoka nsonga, ndi malo omwe ali pachiwopsezo, ndikufananiza ndi data yopangira ma mesh.

Kusintha kwa AI: Phunzirani momwe solder paste morphology yamitundu yosiyanasiyana ya pad imathandizira kuchepetsa ma alarm abodza (<2%).

(3) Kuthekera kophatikizana kwa mzere

Mawonekedwe a MES/ERP: Thandizani protocol ya SECS/GEM ndikuyika data yoyendera munthawi yeniyeni.

Kuwongolera kotsekeka: Lumikizanani ndi osindikiza phala la solder (monga DEK, MPM) kuti muyankhe nokha ndikusintha kuthamanga kwa scraper kapena liwiro.

4. Ubwino waukulu

(1) Kuyerekeza ndi 2D SPI

Muyezo weniweni wa voliyumu: Yesani mwachindunji kuchuluka kwa phala la solder kuti mupewe kulingalira molakwika kwa 2D komwe kumachitika chifukwa cha mtundu kapena mawonekedwe.

Kudziletsa kodziletsa: Kuneneratu zolakwika monga zolumikizira zoziziritsa kukhosi ndi miyala yam'manda pambuyo pakuwotcheranso kudzera muutali/kuwunika kwa voliyumu.

(2) Kuyerekeza ndi 3D SPI yofananira

Kuthamanga ndi kulondola bwino: Kuthamanga kwa laser ndikwabwino kuposa moiré fringe projection SPI, yoyenera kupanga mizere yothamanga kwambiri.

Kusintha kwa mapadi ovuta: Kuzindikira bwino pazitsulo zazitsulo zoponderezedwa ndi ma micro-hole arrays (monga Flip Chip).

(3) Kusunga ndalama

Fast ROI: Chepetsani chiwongolero pambuyo pa 30% ~ 50%, kuchepetsa mtengo wokonzanso.

Kukonzekera kwapang'onopang'ono: Palibe zigawo zowonongeka zowonongeka (monga interferometers), kukhazikika kwanthawi yaitali.

5. Zochitika zogwiritsira ntchito

Zamagetsi zamphamvu kwambiri:

Smartphone motherboard (0.3mm pitch CSP), wotchi yanzeru PCB yaying'ono.

Zamagetsi zamagalimoto:

Engine control unit (ECU), ADAS sensor, ikufuna solder phala yosindikiza CPK ≥ 1.67.

Kupaka kwa Semiconductor:

Kuzindikira kusindikiza kwa mpira wawafer-level (WLP).

6. Zolakwa wamba ndi zothetsera

Cholakwika Choyambitsa Chothetsera

ERR-LS-201 Laser calibration offset Pangani njira yosinthira yokha kapena sinthani pamanja njira yowonera.

ERR-MOT-305 Motion nsanja yadutsa malire Onani ngati chotchingira cha PCB chilipo ndikukhazikitsanso gawo losuntha.

Chithunzi cha Kamera cha ERR-CAM-412 sichiwoneka bwino Yeretsani mandala, yang'anani molunjika kapena sinthaninso.

WARN-DATA-503 Detection yasefukira (paste wokwera modabwitsa) Tsimikizirani ngati ukhondo wa mesh yachitsulo kapena zosindikizira ndi zachilendo.

7. Kusamalira ndi kusanja

Kukonza tsiku ndi tsiku:

Tsukani zenera la laser ndi tebulo lagalasi tsiku lililonse kuti fumbi lisakhudze chithunzicho.

Kuwongolera pafupipafupi:

Tsimikizirani kulondola kwa Z-axis pogwiritsa ntchito mbale yofananira (yokhala ndi masitepe odziwika a kutalika) mwezi uliwonse.

Moyo wa zigawo zikuluzikulu:

Moyo wa module ya laser ndi pafupifupi maola 20,000, ndipo kuchepetsedwa kwa mphamvu kuyenera kuyang'aniridwa.

8. Kuyerekeza kwa msika

Kufananiza zinthu SAKI 3Si-LS2 Competitors (monga Koh Young KY8030)

Tekinoloje ya Detection Laser scanning Moiré fringe projection

Z-axis kusamvana 0.5μm 0.3μm (mtengo wapamwamba)

Liwiro Liwiro lalitali (30cm²/s@10μm) Liwiro lapakati (20cm²/s@5μm)

Ntchito ya AI Yomangidwa mu adaptive algorithm Chilolezo chowonjezera chofunikira

Mtengo Wapakati-mpaka-wokwera kwambiri (wotsika mtengo kwambiri) Wapamwamba kwambiri (umafunika 20% ~ 30%)

9. Malingaliro osankha ogwiritsa ntchito

Masankhidwe ovomerezeka:

Mizere yopangira imakhala ndi zofunikira kwambiri pa kusinthasintha kwa voliyumu ya solder (monga zamagetsi zamagalimoto).

Kupanga kosakanikirana kwakukulu kumayenera kuyankha mwachangu (kusintha kwa mzere pafupipafupi).