SAKI 3Si-LS2 SMT 3D SPI mashiinka

Kuwa soo socdaa waa horudhac tafatiran oo SAKI 3D SPI 3Si-LS2

1. Dulmarka Qalabka

Model: SAKI 3Si-LS2

Nooca: 3D Alxanka koodhka Kormeeraha

Codsiga Muhiimka ah: Waxaa loo isticmaalaa khadka wax soo saarka SMT ka dib daabacaadda iyo ka hor inta aan la dhejin si loo ogaado xuduudaha saddex-geesoodka ah sida mugga koollada alxanka, dhererka, qaabka, iwm., si loo hubiyo tayada daabacaadda oo looga hortago cilladaha ka dib alxanka dib u soo celinta.

Jidka farsamada: Isticmaal saddex-xagalka laysarka ama saadaalinta iftiinka habaysan (waxay kuxirantahay qaabeynta) si aad u gaarto sawir 3D oo sax ah.

2. Tilmaamaha Muhiimka ah

Faahfaahinta Halbeegga Shayga

Baadhista Tignoolajiyada Laysarka Sawirka/Iftiin habaysan oo soo noqnoqonaya (ikhtiyaar ah)

Xallinta dhidibka Z-≤1μm (ku celcelin karo)

Xawaaraha ogaanshaha 15 ~ 50cm²/s (waxay kuxirantahay shuruudaha saxda ah)

Qaybta ogaanshaha ugu yar 01005 (0.4mm×0.2mm)

Cabbirka guddiga ugu badan 510mm × 460mm (la beddeli karo)

Halbeegyada cabbiraadda koollada alxanka, mugga, dhererka, aagga, ka-goynta, khatarta keenista

3. Farsamooyinka iyo hawlaha muhiimka ah

(1) Sawir 3D sax ah oo sax ah

Saddex-xagalka leysarka:

Ku sawir dusha koollada alxanka leh xadhkaha laysarka xawaaraha sare leh si aad u soo saarto xogta daruurta dhibicda 3D si aad u qiyaasto dhererka, mugga, iyo isku-dhafka koollada alxanka.

Xallinku wuxuu gaari karaa 0.5μm (Z-axis), kaas oo ku habboon suufka garoonnada aadka u-fiican (sida 0.3mm garoonka BGA).

Iftiinka caawiye ee kala duwan (ikhtiyaar):

Marka lagu daro isha iftiinka RGB, waxay si isku mar ah u ogaan kartaa daabacaadda alxanka iyo haraaga mesh birta.

(2) Software falanqaynta caqliga

SAKI SPI VisionPro:

Tirakoobka waqtiga-dhabta ah ee SPC: Samee khariidad qaybinta dhererka koollada alxanka, tusmada awoodda habka Cpk/Ppk, oo la soco xasilloonida habka daabacaadda.

Digniin cilad leh: Si toos ah u calaamadee daasad hoose, caarada jiid, iyo meelaha halista buundada, oo barbar dhig xogta naqshadaynta birta.

La qabsiga AI: Baro qaabka caadiga ah ee koollada alxanka ee noocyada kala duwan ee suufka si loo yareeyo heerka digniinta beenta ah (<2%).

(3) Awood is dhexgalka khadka wax soo saarka

Isku xirka MES/ERP: Taageer borotokoolka SECS/GEM oo geli xogta kormeerka wakhtiga dhabta ah.

Xakamaynta wareegga xiran: Isku xidhka daabacayaasha koollada alxanka leh (sida DEK, MPM) si aad si toos ah uga jawaabto oo aad u hagaajiso cadaadiska qashinka ama xawaaraha.

4. Faa'iidooyinka asaasiga ah

(1) Isbarbardhigga 2D SPI

Cabbirka mugga dhabta ah: Si toos ah u qiyaas tirada xabagta alxanka si aad uga fogaato 2D-xukun ee uu keeno midabka ama milicsiga.

Xakamaynta ka-hortagga: Saadaali cilladaha sida kala-goysyada alxanka qabowga iyo dhagxaanta qubuuraha ka dib alxanka dib-u-socodka iyada oo loo marayo falanqaynta dhererka/mugga.

(2) Isbarbardhigga 3D SPI ee la midka ah

Xawaaraha iyo isku dheelitirnaanta saxda ah: Xawaaraha iskaanka laserku wuu ka fiican yahay moiré fringe saadaasha SPI, oo ku haboon khadadka wax soo saarka xawaaraha sare.

La qabsiga suufka adag: Saamaynta ogaanshaha ka wanaagsan ee mesh birta ah ee jaranjarada ah iyo qalabyada dalool yar yar (sida Flip Chip).

(3) Waxtarka qiimaha leh

ROI degdega ah: Yaree heerka cilladda ka dib dib-u-qulqulka 30% ~ 50%, yaraynta kharashka dib-u-shaqaynta.

Naqshadaynta dayactirka hooseeya: Ma jiraan qaybo indhaha ah oo nugul (sida interferometers), xasilloonida muddada-dheer ee sare.

5. Xaaladaha codsiga caadiga ah

Qalabka elegtarooniga ah ee cufnaanta sare leh:

Motherboard-ka casriga ah (0.3mm garoonka CSP), saacada smart smart micro PCB.

Gawaarida Elektrooniga ah:

Unugga xakamaynta matoorka (ECU), dareeraha ADAS, oo u baahan daabacaadda koollada alxanka CPK ≥ 1.67.

Baakadaha semiconductor:

Baakadaha heerka wafer-ka (WLP) ogaanshaha kubbadda alxanka.

6. Khaladaadka Guud iyo Xalka

Xalka Sababaha Macquulka ah ee Koodhka Khaladka

ERR-LS-201 Ka-soo-baxa is-habaynta Laser-ka Samee habka toosinta tooska ah ama gacanta ku hagaaji jidka indhaha.

ERR-MOT-305 Motion ka baxsan xadka Hubi in isku xidhka PCB uu meesha yaalo oo dib u dajin moduleka dhaqaaqa.

ERR-CAM-412 Sawirka kamaradu waa guduudan yahay Nadiifi muraayadda, hubi mashiinka diiradda ama dib u habeyn.

WARN-DATA-503 Xogta Ogaanshaha oo buuxdhaafay (koollada alxanka oo aan caadi ahayn) Xaqiiji in nadiifinta mesh birta ama cabbirada daabacaha ay yihiin kuwo aan caadi ahayn.

7. Dayactirka iyo hagaajinta

Dayactirka maalinlaha ah:

Nadiifi daaqada laysarka iyo miiska galaaska maalin kasta si aad uga hortagto in boodhka uu saameeyo sawirka.

Sifeynta joogtada ah:

Hubi saxnaanta dhidibka Z-ka adigoo isticmaalaya saxan cabbirka caadiga ah (oo leh tallaabo dherer ah oo la yaqaan) bil kasta.

Nolosha qaybaha muhiimka ah:

Nolosha moduleka laysarka waxay ku dhowdahay 20,000 saacadood, xoog yaraantuna waxay u baahan tahay in la kormeero.

8. Isbarbardhigga meelaynta suuqa

Waxyaabaha isbarbardhigga ah SAKI 3Si-LS2 Tartamayaasha (sida Koh Young KY8030)

Tignoolajiyada ogaanshaha Laser-ka ee saadaalinta Moiré fringe

Xalinta dhidibka Z-0.5μm 0.3μm (qiimaha sare)

Xawaaraha sare (30cm²/s@10μm) Xawaaraha dhexe (20cm²/s@5μm)

Shaqada AI Algorithm-ka la qabsiga ku dhex dhisan Oggolaanshaha dheeriga ah ayaa loo baahan yahay

Qiimaha Dhex-ilaa-sare-dhamaadka (kharash-wax-ku-oolnimada aadka u sarreeya)-dhamaadka sare (qiimaha 20% ~ 30%)

9. Talooyinka xulashada isticmaalaha

Xaaladaha xulashada ee lagu taliyay:

Khadadka wax soo saarku waxay leeyihiin shuruudo adag oo ku saabsan joogteynta mugga koollada alxanka (sida baabuurta elektaroonigga ah).

Wax soo saarka isku-dhafka sare wuxuu u baahan yahay inuu si dhakhso ah uga jawaabo (isbeddelka khadka soo noqnoqda).