Ekyuma kya SAKI 3Si-LS2 SMT 3D SPI

Wammanga ye nnyanjula enzijuvu ku SAKI 3D SPI 3Si-LS2

1. Okukubaganya ebirowoozo ku byuma

Omuze guno: SAKI 3Si-LS2

Ekika: Omukebera Paste ya 3D Solder

Core Application: Ekozesebwa ku layini y’okufulumya SMT oluvannyuma lw’okukuba ebitabo era nga tonnaba kukola patching okuzuula parameters ez’ebitundu bisatu nga solder paste volume, height, shape, n’ebirala, okukakasa omutindo gw’okukuba ebitabo n’okuziyiza obulema oluvannyuma lw’okuddamu okusolder.

Ekkubo ery’ekikugu: Kozesa laser triangulation oba structured light projection (okusinziira ku configuration) okutuuka ku high-precision 3D imaging.

2. Ebikwata ku nsonga enkulu

Ebikwata ku Parameter y'Ekintu

Tekinologiya w’okuzuula Laser Scanning/Ekitangaala ekitegekeddwa eky’emirundi mingi (eky’okwesalirawo)

Z-axis resolution ≤1μm (okuddiŋŋana) .

Sipiidi y'okuzuula 15 ~ 50cm2/s (okusinziira ku byetaago by'obutuufu)

Ekitundu ekitono eky’okuzuula 01005 (0.4mm×0.2mm)

Sayizi y’olubaawo esinga obunene 510mm×460mm (esobola okulongoosebwa)

Solder paste measurement parameters Volume, obuwanvu, ekitundu, offset, akabi k’okuzimba omukutu

3. Tekinologiya omukulu n’emirimu

(1) Okukuba ebifaananyi mu ngeri entuufu ennyo mu ngeri ya 3D

Enjuyi essatu eza layisi:

Sikaani kungulu kwa solder paste ne layini za laser ez’amaanyi okukola 3D point cloud data okugera obungi bw’obuwanvu, volume, ne coplanarity ya solder paste.

Okusalawo kuyinza okutuuka ku 0.5μm (Z-axis), nga kino kirungi ku paadi z’amaloboozi amalungi ennyo (nga 0.3mm pitch BGA).

Amataala agayambako aga spectral multi-spectral (eky’okwesalirawo):

Nga egattibwa wamu n’ensibuko y’ekitangaala kya RGB, esobola okuzuula mu kiseera kye kimu solder paste printing offset ne steel mesh residue.

(2) Sofutiweya ow’amagezi eyeekenneenya

SAKI SPI VisionPro: Omuntu w'abantu:

Ebibalo bya SPC mu kiseera ekituufu: Okukola maapu y’okugabanya obuwanvu bwa solder paste, omuwendo gw’obusobozi bw’enkola ya Cpk/Ppk, n’okulondoola okutebenkera kw’enkola y’okukuba ebitabo.

Okulabula ebikyamu: Laga mu ngeri ey’otoma ebifo ebirimu akabi mu bbaati, ensonga y’okusika, n’omutala, era geraageranya n’ebikwata ku dizayini y’akatimba k’ekyuma.

AI adaptation: Yiga enkula ya solder paste eya bulijjo ey’ebika bya paadi eby’enjawulo okukendeeza ku muwendo gwa alamu ey’obulimba (<2%).

(3) Obusobozi bw’okugatta layini z’okufulumya

MES/ERP interface: Okuwagira SECS/GEM protocol n'okuteeka data y'okukebera mu kiseera ekituufu.

Closed-loop control: Link ne solder paste printers (nga DEK, MPM) okusobola okuddamu mu ngeri ey’otoma n’okutereeza puleesa oba sipiidi ya scraper.

4. Ebirungi ebikulu

(1) Okugeraageranya ne 2D SPI

Okupima obuzito obw’amazima: Okugera obutereevu obungi bwa solder paste okwewala okusalawo obubi mu 2D okuva ku langi oba okutunula.

Okufuga okuziyiza: Lagula obulema nga ebiyungo bya solder ebinyogovu n’amayinja ag’entaana oluvannyuma lw’okusoda okuddamu okukulukuta okuyita mu kwekenneenya obuwanvu/obunene.

(2) Okugeraageranya ne 3D SPI efaanagana

Sipiidi n’obutuufu: Sipiidi ya layisi esinga moiré fringe projection SPI, esaanira layini z’okufulumya ez’amaanyi.

Okutuukagana ne paadi enzibu: Ekikolwa ekirungi eky’okuzuula ku stepped steel mesh ne micro-hole arrays (nga Flip Chip).

(3) Okukendeeza ku nsaasaanya

Fast ROI: Okukendeeza ku kigero ky'obulema oluvannyuma lw'okuddamu okukulukuta ne 30% ~ 50%, okukendeeza ku ssente z'okuddamu okukola.

Dizayini y’okuddaabiriza entono: Tewali bitundu bya maaso ebitali binywevu (nga interferometers), okutebenkera okw’amaanyi okw’ekiseera ekiwanvu.

5. Ensonga eza bulijjo ez’okukozesa

Ebyuma ebikozesebwa mu byuma bikalimagezi ebirina density enkulu:

Smartphone motherboard (0.3mm pitch CSP), essaawa entegefu micro PCB.

Ebyuma ebikozesebwa mu mmotoka:

Ekitundu ekifuga yingini (ECU), sensa ya ADAS, kyetaagisa okukuba solder paste CPK ≥ 1.67.

Okupakinga kwa semiconductor:

Wafer-level packaging (WLP) okukuba omupiira gwa solder okuzuula.

6. Ensobi eza bulijjo n’Ebigonjoolwa

Error Code Ekiyinza okuvaako Ekigonjoolwa

ERR-LS-201 Laser calibration offset Kola enkola ya automatic calibration oba tereeza mu ngalo ekkubo ly’amaaso.

ERR-MOT-305 Motion platform out of limit Kebera oba PCB clamp eri mu kifo era zzaawo modulo y’entambula.

ERR-CAM-412 Ekifaananyi kya kkamera tekifuuse kizibu Yoza lenzi, kebera motor ya focus oba okuddamu okupima.

WARN-DATA-503 Okujjula data y’okuzuula (okusiiga kwa solder waggulu mu ngeri etaali ya bulijjo) Kakasa oba obuyonjo bw’akatimba k’ekyuma oba parameters za printer si za bulijjo.

7. Okuddaabiriza n’okupima

Okuddaabiriza buli lunaku:

Okwoza eddirisa lya layisi n’emmeeza y’endabirwamu buli lunaku okutangira enfuufu okukosa ebifaananyi.

Okupima buli kiseera:

Kakasa obutuufu bwa Z-axis ng’okozesa ekipande ekipima ekituufu (nga kiriko omutendera gw’obugulumivu ogumanyiddwa) buli mwezi.

Obulamu bw’ebitundu ebikulu:

Obulamu bwa modulo ya layisi buba ssaawa nga 20,000, era okukendeeza kw’amaanyi kwetaaga okulondoolebwa.

8. Okugeraageranya embeera y’akatale

Ebintu ebigeraageranya SAKI 3Si-LS2 Competitors (nga Koh Young KY8030)

Tekinologiya w’okuzuula Laser scanning Moiré fringe projection

Z-axis resolution 0.5μm 0.3μm (omuwendo omunene)

Sipiidi Sipiidi ya waggulu (30cm2/s@10μm) Sipiidi ya wakati (20cm2/s@5μm)

Omulimu gwa AI Built-in adaptive algorithm Olukusa olw’enjawulo lwetaagibwa

Bbeeyi Mid-to-high-end (outstanding cost-effectiveness) Eky'omutindo ogwa waggulu (premium 20%~30%)

9. Ebiteeso by’okulonda abakozesa

Ensonga z’okulonda ezisemba:

Layini z’okufulumya zirina ebisaanyizo ebikakali ku bugumu bw’obuzito bwa solder paste (nga ebyuma by’emmotoka).

Okufulumya okutabula okw’amaanyi kwetaaga okuddamu amangu (enkyukakyuka mu layini enfunda eziwera).