SAKI BF-3AXiM200 smt ekyuma kya X-RAY ekya 3d

Wammanga ye nnyanjula enzijuvu ku SAKI X-RAY BF-3AXiM200, ng’ekwata ku bikwata ku bikwata ku SAKI X-RAY BF-3AXiM200, ekwata ku bikwata ku bikwata ku SAKI X-RAY BF-3AXiM200, ekwata ku bikwata ku nsonga, ebirungi eby’ekikugu, ebikulu, ensobi eza bulijjo n’enkola y’okukwata, n’ebirala, nga bigattiddwa wamu n’omutindo gw’amakolero n’engeri z’ebyuma ebifaanagana:

1. Okukubaganya ebirowoozo ku byuma

Omuze guno: SAKI X-RAY BF-3AXiM200

Ekika: Enkola ya 3D X-ray ey’okukebera mu ngeri ey’obwengula (AXI)

Core Application: High-precision three-dimensional X-ray inspection for PCB assembly (PCBA), naddala ku biyungo bya solder ebikwese n’obulema mu nsengeka ey’omunda nga BGA, CSP, QFN.

Ekkubo ery’ekikugu: Ekwata ensibuko ya X-ray eya micro-focus + ekyuma ekizuula ekipande ekiwanvu eky’obulungi, ewagira CT tomography (ensengeka ey’okwesalirawo).

2. Ebikwata ku nsonga enkulu

Ebikwata ku Parameter y'Ekintu

X-ray Source Closed micro focus, voltage range 60-160kV, amaanyi 10W ~ 32W

Okuzuula Okusalawo Okutuuka ku 0.5μm (okusinziira ku kukula)

Sayizi y’olubaawo esinga obunene 510mm × 460mm (esobola okulongoosebwa)

Sipiidi y’okuzuula 10-30 seconds/field of view (okusinziira ku resolution ne 3D scanning mode)

Obusobozi bw’okukuba ebifaananyi mu 3D Buwagira okusika CT okulengejja (angle range ±70°)

Software Platform SAKI X-Ray VisionPro, ewagira okugabanya obulema mu AI

3. Ebirungi Ebikulu n’Ebirimu

(1) Enkizo mu by’ekikugu

Ebifaananyi bya 3D ebituufu ennyo:

Ddamu okuzimba ensengekera y’omunda ey’ekiyungo kya solder ng’oyita mu CT tomography, n’okugera obungi bw’ebipimo nga void rate, solder ball volume, ne solder tilt angle.

Okuzuula mu nsonda eziwera:

Omulimu gwa tilt scanning gusobola okuzuula obutamala okuyita mu kinnya okujjuza oba sidewall cold solder joints (nga plug-in components).

Okwekenenya okunywezeddwa mu AI:

Built-in algorithm egabanya obulema mu ngeri ey’otoma (nga enjatika z’omupiira gwa solder, ebiyungo bya solder ebinyogovu, ebintu eby’ebweru), n’omuwendo gwa false positive ogutakka wansi wa 2%.

(2) Ebintu ebikwata ku nkola

Okuzuula ebipapula ebizibu:

Ekola ku kupakinga kwa PoP, modulo za SiP, n’ebyuma ebikozesa amasannyalaze ag’amasannyalaze ag’emmotoka (nga omutindo gw’okuweta ogwa IGBT).

Okugezesebwa okutali kwa kuzikiriza:

Ebikyamu eby’omunda bisobola okuzuulibwa awatali kusasika, nga bisaanira okwekenneenya okulemererwa n’okukakasa obwesigwa.

(3) Okukyusakyusa mu layini y’okufulumya

Okugatta ebintu mu ngeri ey’obwengula:

Awagira okutikka n’okutikkula omukono gwa roboti, n’okukwatagana kwa data n’enkola ya MES (SECS/GEM protocol).

Ensengeka ekyukakyuka:

Okwesalirawo nga tolina mutimbagano (okwekenneenya mu laboratory) oba ku mutimbagano (SMT production line embedding).

4. Obubaka obw’ensobi obwa bulijjo n’enkola z’okukola

Koodi y'ensobi Ekiyinza okuvaako Ekigonjoolwa

ERR-XRAY-101 Okubuguma ennyo mu ttanka ya X-ray Yimirirako okuzuula era onyogoze enkola; kebera oba cooling fan ya bulijjo.

ERR-DET-205 Okutaataaganyizibwa kw’empuliziganya ya detector ya flat panel Ddamu okutandika detector; kebera okuyungibwa kwa cable oba zzaawo interface board.

ERR-MOT-304 Ekisiki ky’entambula okuva mu kkomo (jaamu y’ebyuma) Ddamu okuteekawo modulo y’entambula mu ngalo; kebera track foreign matter oba motor drive.

ERR-SOFT-409 Okuddamu okuzimba ebifaananyi kulemereddwa (okufiirwa data) Rescan; okulongoosa pulogulaamu oba tuukirira abayambi ab’ekikugu aba SAKI.

WARN-HV-503 Okukyukakyuka kw’amasannyalaze ga vvulovumenti eya waggulu Kebera obutebenkevu bw’amasannyalaze; oba waya ya grounding yeesigika.

5. Ensonga eza bulijjo ez’okukozesa

Okukola ebyuma eby’omulembe:

Smartphone motherboard (Okuzuula okujjuza glue wansi), module ya 5G RF.

Ebyuma ebikozesebwa mu mmotoka:

ECU control board solder joint okukakasa okwesigika (okukwatagana ne AEC-Q100).

Okupakinga kwa semiconductor:

Okupakinga ku ddaala lya wafer (WLP), TSV silicon okuyita mu kinnya okuzuula.

6. Ebiteeso ku ndabirira n’okupima

Okuddaabiriza buli lunaku:

Okwoza eddirisa lya X-ray (firimu etayingiramu nfuufu) buli wiiki era buli mwezi okalize omuwendo gwa enzirugavu.

Obulamu bw’ebitundu ebikulu:

Obulamu bwa ttanka ya X-ray buba ssaawa nga 20,000, era okukendeeza ku maanyi g’obusannyalazo bwetaaga okulondoolebwa buli kiseera.

Okukola mu ngeri ey’obukuumi:

Kakasa nti oluggi oluziyiza ebyuma luggaddwa era nga okukulukuta kw’obusannyalazo kutuukana n’omutindo gwa IEC 62494-1 (≤1μSv/h).

7. Okugeraageranya okuvuganya kw’akatale

Ebintu ebigeraageranya SAKI BF-3AXiM200 Ebintu ebivuganya (nga Nordson Dage XD7600)

Okusalawo 0.5μm (okukuza mu kitundu) 0.3μm (omuwendo omunene)

Sipiidi ya CT scanning Sipiidi ya wakati (nga tutunuulira obutuufu) Sipiidi entono (high-precision mode)

Omulimu gwa AI Okugabanya ebikyamu ebizimbibwamu Yeetaaga okugaziya pulogulaamu ez’ekika eky’okusatu

Bbeeyi Mid-to-high-end (outstanding cost-effectiveness) Eky'oku ntikko (30%~50% premium)

8. Ebiteeso by’okulonda abakozesa

Ensonga z’okulonda ezisemba:

Okutwala sampuli za layini y’okufulumya oba okwekenneenya mu laboratory okwetaaga okutebenkeza sipiidi n’obutuufu.

Abakola ebyuma by’emmotoka/eby’obujjanjabi nga balina embalirira entono naye nga bakyetaaga emirimu gya 3D X-Ray.

Ensonga ezitasemba:

Yeetaaga nanometer resolution (nga chip-level failure analysis) oba okuzuula mu bujjuvu otomatiki 100% ku yintaneeti.