Ekyuma kya SAKI 3Di-LS3EX SMT 3D AOI

Wammanga ye nnyanjula enzijuvu ku SAKI 3D AOI 3Di-LS3EX

1. Okukubaganya ebirowoozo ku byuma

Omutindo gwa mmotoka: SAKI 3Di-LS3EX

Ekika: Ebyuma ebikebera amaaso mu ngeri ey’obwengula mu ngeri ya 3D (AOI)

Core positioning: Okukebera omutindo ku high-density PCB assembly (SMT) n’enkola enzibu okupakinga, naddala ennungi mu three-dimensional quantitative analysis of tiny solder joints n’obulema obukwese.

Ekkubo ery’ekikugu: Okugatta ebifaananyi bya 3D ebikebera layisi n’okuzuula kwa 2D okw’enjawulo okusobola okutuuka ku kubikka okulaba mu bujjuvu.

2. Tekinologiya omukulu n’okusengeka ebikozesebwa

(1) Enkola y’okukuba ebifaananyi mu ngeri ya 3D

Tekinologiya w’okukola enjuyi essatu mu layisi:

Okuyita mu sikaani ya layini ya layisi ey’amaanyi, obugulumivu, obuzito, coplanarity n’ebirala eby’ebitundu bisatu ebikwata ku biyungo bya solder bifunibwa, era okuddiŋŋana kwa Z-axis kuyinza okutuuka ku ±1μm.

Awagira multi-angle synchronous scanning okumalawo ebitundu ebizibe w’ekisiikirize (nga BGA bottom solder balls).

Okukuba ebifaananyi ebiyambako mu ngeri ya 2D ey’enjawulo (multi-spectral 2D):

Eriko ensibuko y’ekitangaala kya RGB+infrared okutumbula obusobozi bw’okutegeera 2D obw’obubonero bw’ebitundu n’obubonero bwa polarity.

(2) Enkola y’entambula ey’amaanyi n’ey’obutuufu obw’amaanyi

Okuvuga mmotoka mu layini:

Sipiidi ya sikaani esobola okutuuka ku 500mm/s~1m/s (okusinziira ku nsengeka), esaanira layini z’okufulumya SMT ez’amaanyi (UPH≥400 boards).

Essira erikwata ku kukyusa embeera:

Otomatiki okuliyirira PCB warpage oba tray thickness enjawulo okukakasa nti ebifaananyi bikwatagana.

(3) Omukutu gwa pulogulaamu ogw’amagezi

SAKI VisionPro oba AIx platform (okusinziira ku nkyusa):

Okugabanya ebikyamu AI: Yiga mu ngeri ey’otoma enkola z’ekiyungo kya solder ezitali za bulijjo (nga voids, cracks), nga omuwendo gwa alamu ogw’obulimba (False Call) guli wansi wa 1%.

SPC data analysis: Mu kiseera ekituufu omulembe gwa solder paste obugulumivu distribution maapu ne defect Pareto chart okuwagira enkola optimization.

3. Obusobozi bw’okuzuula obukulu

(1) Okuzuula ekiyungo kya solder mu ngeri ya 3D

Ebipimo by’omuwendo: obuwanvu bw’ekiyungo kya solder, obuzito, enkoona y’okukwatagana, coplanarity.

Ebikyamu ebitera okubaawo:

Ekiyungo kya solder ekibuguma, solder etamala, bridge, omupiira gwa solder, tombstoneing effect.

BGA/CSP/QFN okuzuula ekiyungo kya solder ekikwese (okuyita mu sikaani y’okuyingira kwa layisi ku bbali).

(2) Okuzuula okuteekebwa kw’ebitundu

Okubeerawo/polarity: Laba ebitundu ebitonotono 0201/01005, obulagirizi bwa IC, n’ebitundu ebitali bikwatagana.

Obutuufu bw’ekifo: Zuula offset (±15μm), tilt (nga connector warping).

(3) Okukwatagana

Ekika kya bboodi: olubaawo olukaluba, olubaawo olugonvu (FPC), substrate erimu ebikonde (nga flip chip).

Component range: 01005 micro components to large heat dissipation modules (obunene bw’olubaawo obusinga obunene businziira ku nsengeka, omuwendo ogwa bulijjo 610mm×510mm).

4. Ensonga z’okukozesa amakolero

Ebyuma ebikozesebwa mu byuma bikalimagezi eby’omulembe:

Motherboard y’essimu ey’omu ngalo (POP okupakinga), TWS headset micro PCB.

Ebyuma ebikozesebwa mu mmotoka:

Module ya ADAS, modulo ya kkamera y’emmotoka (etuukana n’omutindo gw’okwesigamizibwa kwa AEC-Q100).

Okupakinga kwa semiconductor:

SiP (okupakinga ku ddaala ly’enkola), Fan-Out wafer-level packaging okukebera endabika.

5. Enkizo mu kuvuganya

(1) Okugeraageranya ne 2D AOI

Okugera obungi mu bitundu bisatu: Pima butereevu obungi bwa solder okwewala okusalawo obubi mu langi/ekisiikirize mu ngeri ya 2D.

Ebibikka ebitundu ebizibu: erina ebirungi ebyeyoleka mu bitundu bya wansi (BTC) n’ebiyungo bya solder wansi w’ebibikka ebiziyiza.

(2) Okugerageranya ne 3D AOI efaanagana

Sipiidi n’obutuufu: Sipiidi ya layisi esinga ku structured light projection 3D AOI.

Okugatta data: Okuzuula 3D+2D hybrid, nga tutunuulira data y’obuwanvu n’ebintu ebiri kungulu (nga okutegeera ennukuta).

(3) Okugatta layini z’okufulumya

MES/ERP interface: Ewagira SECS/GEM protocol okutuuka ku kuteeka mu kiseera ekituufu data y’okuzuula.

Okukwatagana ne SPI: Lagula obulabe bw’obulema mu kiyungo kya solder nga oyita mu data y’okukuba solder paste.

6. Emirimu gy’okugaziya egy’okwesalirawo

Dual-track detection module: Okuzuula okukwatagana kwa dual boards, okwongera ku busobozi bw’okufulumya ebitundu ebisukka mu 30%.

AI okweyiga: Dynamically update the defect library okusobola okutuukagana n’okuyingiza amangu ebintu ebipya.

3D modeling simulation: Okukoppa okutali ku mutimbagano enkola y’okuzuula, n’okulongoosa ekkubo ly’okuzuula nga bukyali.

7. Omukozesa pain point solution

Ekizibu: Obulung’amu obutono obw’okuddamu okwekenneenya mu ngalo oluvannyuma lw’okussaako micro-component (01005).

→ 3Di-LS3EX solution: 3D+2D composite inspection, okugabanya obulema mu ngeri ey’otoma, n’okuddamu okwekenneenya omuwendo gwakendeezebwa okutuuka wansi wa 5%.

Ekizibu: Ebyetaago ebikakali eby’okwesigamizibwa ku biyungo bya solder bya PCB eby’emmotoka (nga no voids).

→ Ekigonjoola: 100% okwekebejja mu bujjuvu okuyita mu kwekenneenya mu bungi bwa solder joint volume/void rate.

8. Ebiwandiiko

Ebyetaago by’okukakasa: Kirungi okuwa okukebera kwa sampuli y’ebintu okwa nnamaddala ku sayizi y’ekikyamu esinga obutono ezuulibwa (nga 0.1mm2 ya bbaati etamala).

Ensimbi ezisaasaanyizibwa mu kuddaabiriza: Module ya layisi ewangaala essaawa nga 20,000 era yeetaaga okupimibwa buli kiseera.