SAKI 3Di-LS3EX SMT 3D umatshini AOI

Oku kulandelayo yintshayelelo eneenkcukacha ye-SAKI 3D AOI 3Di-LS3EX

1. Isishwankathelo seZixhobo

Umzekelo: SAKI 3Di-LS3EX

Uhlobo: Ukuchaneka okuphezulu kwe-3D izixhobo zokuhlola okuzenzekelayo (AOI)

Ukuma okungundoqo: Ukuhlolwa komgangatho wendibano yePCB yoxinaniso oluphezulu (SMT) kunye neenkqubo zokupakisha ezintsonkothileyo, ngakumbi ezintle kuhlalutyo lobungakanani be-three-dimensional quantitative joints kunye neziphene ezifihlakeleyo.

Indlela yobugcisa: Ukudibanisa i-laser scanning 3D imaging kunye ne-multi-spectral 2D ubhaqo ukufezekisa umboniso ogcweleyo.

2. Itekhnoloji engundoqo kunye noqwalaselo lwe-hardware

(1) Inkqubo yomfanekiso we-3D

Itekhnoloji yeLaser triangulation:

Ngokusebenzisa ukuskena komgca we-laser wesantya esiphezulu, ukuphakama, umthamo, i-coplanarity kunye nezinye iinkcukacha ezithathu ze-solder joints zifunyenwe, kwaye ukuphindaphinda kwe-Z-axis kunokufikelela ku-± 1μm.

Ixhasa iskena se-synchronous multi-angle ukuphelisa iindawo ezingaboniyo zethunzi (ezifana neebhola ze-solder ze-BGA ezisezantsi).

Imifanekiso encedisayo ye-2D eneespectral ezininzi:

Ixhotyiswe nge-RGB+umthombo wokukhanya kwe-infrared ukuphucula isakhono sokuqaphela i-2D yeempawu zecandelo kunye noonobumba be-polarity.

(2) Inkqubo yentshukumo ekhawulezayo kunye nechanekileyo

Linear motor drive:

Isantya sokuskena sinokufikelela kwi-500mm / s ~ 1m / s (kuxhomekeke kuqwalaselo), olufanelekileyo kwimigca yokuvelisa i-SMT ephezulu (iibhodi ze-UPH≥400).

Ujoliso olulungeleyo:

Buyekeza ngokuzenzekelayo i-warpage ye-PCB okanye umahluko wobukhulu betreyi ukuqinisekisa ukungaguquguquki komfanekiso.

(3) Iqonga lesoftware elikrelekrele

SAKI VisionPro okanye iqonga le-AIx (kuxhomekeke kuguqulelo):

Ukuhlelwa kwesiphene i-AI: Funda ngokuzenzekelayo iipateni ze-solder ezingaqhelekanga (ezifana ne-voids, iintanda), kunye nesantya se-alarm yobuxoki (Umnxeba ongeyonyani) ngaphantsi kwe-1%.

Uhlalutyo lwedatha ye-SPC: Ukuveliswa kwexesha langempela lemephu yokusabalalisa ukuphakama kwe-solder kunye nesiphene setshathi yePareto ukuxhasa inkqubo yokuphucula.

3. Izakhono zokubona ezingundoqo

(1) I-3D yokubona i-solder edibeneyo

Iiparamitha zobungakanani: ukuphakama kwe-solder joint, umthamo, i-angle yoqhagamshelwano, i-coplanarity.

Iziphene eziqhelekileyo:

I-solder eshushu edibeneyo, i-solder enganelanga, i-bridging, ibhola ye-solder, i-tombstoneing effect.

BGA / CSP / QFN efihliweyo solder ubhaqo joint (ngokusebenzisa edge laser ukungena ukuskena).

(2) Ukubonwa kokubekwa kwecandelo

Ubukho / i-polarity: Chonga i-0201 / 01005 amacandelo amancinci, ulwalathiso lwe-IC, kunye namacandelo angalungelelanisiweyo.

Ukuchaneka kwesikhundla: Khangela i-offset (± 15μm), i-tilt (efana ne-connector warping).

(3) Ukuhambelana

Uhlobo lwebhodi: ibhodi eqinile, ibhodi eguquguqukayo (i-FPC), i-substrate enamaqhuma (afana ne-flip chip).

Uluhlu lwamacandelo: I-01005 i-micro components ukuya kwiimodyuli ezinkulu zokutshatyalaliswa kobushushu (ubukhulu bebhodi ubukhulu buxhomekeke kuqwalaselo, ixabiso eliqhelekileyo 610mm × 510mm).

4. Iimeko zesicelo seshishini

Ii-elektroniki zabathengi abakumgangatho ophezulu:

I-smartphone motherboard (ukupakishwa kwePOP), i-TWS headset micro PCB.

Iimoto zombane:

Imodyuli ye-ADAS, imodyuli yekhamera yemoto (ihambelana nemigangatho yokuthembeka kwe-AEC-Q100).

Ukupakishwa kweSemiconductor:

I-SiP (ukupakishwa kwenqanaba lenkqubo), ukuhlolwa kwembonakalo yokupakishwa kweFan-Out.

5. Iinzuzo zokhuphiswano

(1) Ukuthelekisa kunye ne-2D AOI

Ubungakanani obuthathu: Ukulinganisa ngokuthe ngqo inani le-solder ukunqanda umbala we-2D / isithunzi esingafanelekanga.

I-complex complection coverage: ineenzuzo ezicacileyo kumacandelo etheminali asezantsi (BTC) kunye neendawo zokudityaniswa kwe-solder phantsi kwezikhuselo ezikhuselayo.

(2) Ukuthelekisa kunye ne-3D AOI efanayo

Isantya kunye nokuchaneka ibhalansi: Isantya sokuskena iLaser singcono kunokukhanya okucwangcisiweyo kweprojekthi ye-3D AOI.

Ukuhlanganiswa kwedatha: 3D + 2D ubhaqo oluxutyiweyo, kuthathelwa ingqalelo idatha yobude kunye neempawu zomhlaba (ezifana nokuqatshelwa komlinganiswa).

(3) Ukuhlanganiswa komgca wokuvelisa

I-interface ye-MES / ERP: Ixhasa i-SECS / iprotocol ye-GEM ukufezekisa ukulayisha ngexesha langempela lokukhangela idatha.

Unxulumano neSPI: Qikelela iingozi ezidityanisiweyo zesiphene kwi-solder ngokusebenzisa idatha yokuprinta i-solder.

6. Imisebenzi yokwandisa ngokuzikhethela

Imodyuli yokufumanisa i-double-track: Ukufunyanwa okufanayo kweebhodi ezimbini, ukwandisa umthamo wemveliso ngaphezu kwe-30%.

Ukuzifundela kwe-AI: Ukuhlaziya ngamandla ithala leencwadi elineziphene ukuze liziqhelanise nokwaziswa ngokukhawuleza kweemveliso ezintsha.

Ukulinganisa imodeli ye-3D: Ukulinganisa okungaxhunyiwe kwi-intanethi yenkqubo yokukhangela, kunye nokulungiswa kwendlela yokufumanisa kwangaphambili.

7. Isisombululo sentlungu yomsebenzisi

Ingxaki: Ukusebenza okuphantsi kokuphinda kuhlolwe ngesandla emva kokufakwa kwe-micro-component (01005).

→ Isisombululo se-3Di-LS3EX: Ukuhlolwa kwe-3D + 2D edibeneyo, ukuhlelwa kwesiphene ngokuzenzekelayo, kunye nezinga lokuhlola kwakhona lincitshiswe ngaphantsi kwe-5%.

Ingxaki: Iimfuno ezingqongqo zokuthembeka kwiimoto zePCB ze-solder joints (ezifana nokungabikho kwe-voids).

→ Isisombululo: 100% yohlolo olupheleleyo ngohlalutyo lobungakanani bomthamo odibeneyo we-solder / ireyithi yokungabikho.

8. Amanqaku

Iimfuno zoQinisekiso: Kuyacetyiswa ukuba kubonelelwe ngovavanyo lwesampulu yokwenyani yemveliso ngokomlinganiselo obonakeleyo wesiphene (ofana ne-0.1mm² yetoti engonelanga).

Iindleko zokulungisa: Imodyuli yelaser inobomi obumalunga neeyure ezingama-20,000 kwaye kufuneka ilinganiswe rhoqo.