SAKI 3Si-LS2 SMT 3D SPI umatshini

Oku kulandelayo yintshayelelo eneenkcukacha ye-SAKI 3D SPI 3Si-LS2

1. Isishwankathelo seZixhobo

Umzekelo: SAKI 3Si-LS2

Uhlobo: 3D Solder Paste Inspector

ISicelo esingundoqo: Isetyenziselwa umgca wemveliso we-SMT emva kokuprintwa nangaphambi kokupakisha ukukhangela iiparitha ezintathu-dimensional ezifana ne-solder paste volume, ukuphakama, imilo, njl., Ukuqinisekisa umgangatho wokushicilela kunye nokuthintela iziphene emva kwe-reflow soldering.

Indlela yobugcisa: Sebenzisa i-laser triangulation okanye ukukhanya okucwangcisiweyo (kuxhomekeke kuqwalaselo) ukuphumeza umfanekiso we-3D ochanekileyo.

2. Iinkcukacha ezingundoqo

Iinkcukacha zeParameter

ITekhnoloji yokuFumana Ukuskena kweLaser/Ukukhanya okuQuquzekileyo okuKwakhiwe ngokuphindaphindiweyo (ukhetho)

Isisombululo se-Z-axis ≤1μm (ukuphinda-phinda)

Isantya sokubona 15 ~ 50cm²/s (kuxhomekeke kwiimfuno zokuchaneka)

Ubuncinci becandelo lokubona 01005 (0.4mm×0.2mm)

Ubukhulu bebhodi ubukhulu 510mm×460mm (customizable)

Iiparamitha zokulinganisa uncamathiselo lwe-Solder Umthamo, ubude, indawo, i-offset, umngcipheko wokuvala

3. Itekhnoloji engundoqo kunye nemisebenzi

(1) Imifanekiso ye-3D echanekileyo

Unxantathu weLaser:

Skena umphezulu we-solder paste kunye nemigca ye-laser enesantya esiphezulu ukuvelisa idatha yelifu ye-3D ukulinganisa ubude, ivolumu, kunye ne-coplanarity ye-solder paste.

Isisombululo sinokufikelela kwi-0.5μm (i-Z-axis), efanelekile kwiipadi ze-ultra-fine pitch (ezifana ne-0.3mm pitch BGA).

Isibane esincedisayo esinamehlo amaninzi (ukhetho):

Idityaniswe nomthombo wokukhanya we-RGB, iyakwazi ukubona ngaxeshanye i-solder paste printing offset kunye nentsalela yentsimbi.

(2) Isoftware yohlalutyo olukrelekrele

SAKI SPI VisionPro:

Izibalo ze-SPC zexesha langempela: Yenza imephu yokusabalalisa i-solder paste ukuphakama, i-CPK/Ppk isalathisi sobuchule benkqubo, kunye nokubeka iliso kwinkqubo yokushicilela ukuzinza.

Isilumkiso sesiphako: Ngokuzenzekelayo phawula itoti ephantsi, inqaku lokutsala, kunye neendawo ezinobungozi zebhulorho, kwaye uthelekise nedatha yoyilo lwentsimbi.

Ukulungelelaniswa kwe-AI: Funda i-solder paste morphology yeentlobo ezahlukeneyo zepadi ukunciphisa izinga le-alarm yobuxoki (<2%).

(3) Ikhono lokudibanisa umgca wokuvelisa

I-interface ye-MES / ERP: Inkxaso ye-SECS / iprotocol ye-GEM kunye nokulayisha idatha yokuhlola ngexesha langempela.

Ukulawulwa kwe-loop evaliweyo: Ikhonkco kunye neeprinta zokunamathisela i-solder (ezifana ne-DEK, i-MPM) ngokuzenzekelayo impendulo kunye nokulungelelanisa uxinzelelo lwe-scraper okanye isantya.

4. Iinzuzo eziphambili

(1) Ukuthelekisa kunye ne-2D SPI

Umlinganiselo womthamo wangempela: Ukulinganisa ngokuthe ngqo inani le-solder paste ukunqanda ukugwetywa okungalunganga kwe-2D okubangelwa ngumbala okanye ukubonakaliswa.

Ulawulo lothintelo: Iziphene eziqikelelweyo ezinje ngokubanda kwamalungu e-solder kunye namatye amangcwaba emva kokuthengiswa kwe-reflow ngokusebenzisa ubude / uhlalutyo lwevolumu.

(2) Ukuthelekisa kunye ne-3D SPI efanayo

Isantya kunye nokuchaneka kwebhalansi: Isantya sokuskena i-Laser singcono kune-moiré fringe projection SPI, ilungele imigca yokuvelisa ngesantya esiphezulu.

Ukuziqhelanisa neepads ezintsonkothileyo: Isiphumo esingcono sokubhaqwa kumnatha wentsimbi onyatheleyo kunye noluhlu lwemingxuma emincinci (efana neFlip Chip).

(3) Ukusebenza kweendleko

I-ROI ekhawulezayo: Nciphisa izinga lesiphako emva kokuhamba kwakhona nge-30% ~ 50%, ukunciphisa iindleko zokuphinda usebenze kwakhona.

Uyilo oluphantsi lokugcinwa: Akukho zixhobo ezibonakalayo ezinobungozi (ezifana ne-interferometers), ukuzinza okuphezulu kwexesha elide.

5. Iimeko zesicelo esiqhelekileyo

Ii-elektroniki ezixinene kakhulu:

Smartphone motherboard (0.3mm pitch CSP), smart iwotshi PCB micro.

Iimoto zombane:

Iyunithi yokulawula i-injini (ECU), inzwa ye-ADAS, ifuna i-CPK yokuprinta i-solder ≥ 1.67.

Ukupakishwa kweSemiconductor:

Ukupakishwa komgangatho we-Wafer-level (WLP) ubhaqo woshicilelo lwebhola ye-solder.

6. Iimpazamo eziqhelekileyo kunye nezisombululo

Ikhowudi yemposiso enokwenzeka Isisombululo

I-ERR-LS-201 i-Laser calibration offset Yenza inkqubo yokulinganisa ngokuzenzekelayo okanye ulungelelanise indlela yokubona.

I-ERR-MOT-305 iqonga leMotion ngaphandle komda Khangela ukuba i-PCB clamp ikhona kwaye usete ngokutsha imodyuli eshukumayo.

Umfanekiso wekhamera we-ERR-CAM-412 awucacanga Coca ilensi, khangela imotor ekugxilwe kuyo okanye uhlengahlengise.

I-WARN-DATA-503 Ukufunyanwa kwedatha yokuphuphuma (uncamathiselo oluphezulu ngokungaqhelekanga lwe-solder) Qinisekisa ukuba ucoceko lwemesh yentsimbi okanye iiparamitha zomshicileli aziqhelekanga.

7. Ukugcinwa kunye nokulinganisa

Ulondolozo lwemihla ngemihla:

Coca ifestile yelaser kunye netafile yeglasi yonke imihla ukukhusela uthuli ekuchaphazeni umfanekiso.

Ulungelelwaniso lwarhoqo:

Qinisekisa ukuchaneka kwe-Z-axis usebenzisa ipleyiti yokulinganisa esemgangathweni (enenqanaba lokuphakama elaziwayo) nyanga zonke.

Ubomi bamacandelo aphambili:

Ubomi bemodyuli yelaser bumalunga neeyure ezingama-20,000, kwaye ukuthotywa kwamandla kufuneka kubekwe iliso.

8. Ukuthelekisa ukuma kwemarike

Izinto zokuthelekisa i-SAKI 3Si-LS2 Competitors (ezifana ne-Koh Young KY8030)

Itekhnoloji yokubona Ukuskena ngeLaser Uqikelelo lomphetho weMoiré

Isisombululo se-Z-axis 0.5μm 0.3μm (ixabiso eliphezulu)

Isantya Isantya esiphezulu (30cm²/s@10μm) Isantya esiphakathi (20cm²/s@5μm)

Umsebenzi we-AI Ulwakhelwe-kwi-algorithm yokuguquguquka okufunekayo

Ixabiso Eliphakathi ukuya phezulu (ixabiso eligqwesileyo) Umgangatho ophezulu (i-premium 20% ~ 30%)

9. Iingcebiso zokukhetha umsebenzisi

Iimeko zokukhetha ezicetyiswayo:

Imigca yokuvelisa ineemfuno ezingqongqo kwi-solder paste volume consistency (ezifana ne-automotive electronics).

Ukuveliswa komxube ophezulu kufuneka kuphendule ngokukhawuleza (utshintsho lwelayini rhoqo).