SAKI 3Si-LS2 SMT 3D imashini ya SPI

Ibikurikira nintangiriro irambuye kuri SAKI 3D SPI 3Si-LS2

1. Incamake y'ibikoresho

Icyitegererezo: SAKI 3Si-LS2

Ubwoko: Umugenzuzi wa 3D Solder Paste Umugenzuzi

Porogaramu yibanze: Yifashishijwe kumurongo wumusaruro wa SMT nyuma yo gucapa na mbere yo guterura kugirango umenye ibipimo bitatu-bingana nkubunini bwa paste paste, uburebure, imiterere, nibindi, kugirango hamenyekane ubuziranenge bwo gucapa no gukumira inenge nyuma yo kugurisha.

Inzira ya tekiniki: Koresha laser triangulation cyangwa urumuri rutunganijwe (ukurikije iboneza) kugirango ugere kumashusho ya 3D yuzuye neza.

2. Ibyingenzi

Ikintu Parameter Ibisobanuro birambuye

Gutahura Ikoranabuhanga rya Laser Gusikana / Umucyo mwinshi wubatswe urumuri (bidashoboka)

Igisubizo cya Z-axis ≤1μm (gusubiramo)

Umuvuduko wo gutahura 15 ~ 50cm² / s (ukurikije ibisabwa neza)

Ikintu ntarengwa cyo kumenya 01005 (0.4mm × 0.2mm)

Ingano ntarengwa yubuyobozi 510mm × 460mm (birashoboka)

Ibipimo bya Solder ibipimo byo gupima Ingano, uburebure, agace, offset, ibyago byo gukemura

3.Ikoranabuhanga ryibanze n'imikorere

(1) Amashusho yuzuye ya 3D

Inyabutatu ya Laser:

Sikana hejuru yuwagurishije hejuru yumurongo wihuse wa laser kugirango ubyare amakuru ya 3D point igicu kugirango ugereranye uburebure, ubunini, hamwe na coplanarite ya paste yagurishijwe.

Imyanzuro irashobora kugera kuri 0.5μm (Z-axis), ikwiranye nudupapuro twiza cyane (nka 0.3mm ikibanza BGA).

Amatara menshi yingirakamaro (itabishaka):

Ufatanije nisoko yumucyo wa RGB, irashobora icyarimwe kumenya kugurisha paste icapura ibicuruzwa hamwe nibisigazwa byicyuma.

(2) Porogaramu isesengura ubwenge

SAKI SPI IcyerekezoPro:

Ibihe nyabyo-mibare ya SPC: Gukora ikarita yo kugurisha ikarita yo gukwirakwiza uburebure, Cpk / Ppk yerekana ubushobozi bwubushobozi, kandi ukurikirane uburyo bwo gucapa butajegajega.

Kuburira neza: Shira akamenyetso ku mabati make, gukurura inama, hamwe n’ahantu hashobora kwibasirwa n’ikiraro, kandi ugereranye namakuru yububiko bwa mesh.

Kurwanya AI: Wige ibicuruzwa bisanzwe bigurisha paste morphologie yubwoko butandukanye kugirango ugabanye igipimo cyibinyoma (<2%).

(3) Ubushobozi bwo guhuza umurongo

MES / ERP Imigaragarire: Shyigikira protocole ya SECS / GEM no kohereza amakuru yo kugenzura mugihe nyacyo.

Igenzura rifunze: Ihuza hamwe nugurisha paste printer (nka DEK, MPM) kugirango uhite utanga ibitekerezo kandi uhindure igitutu cyangwa umuvuduko.

4. Ibyiza byingenzi

(1) Kugereranya na 2D SPI

Ibipimo nyabyo byukuri: Gereranya mu buryo butaziguye ingano ya paste yo kugurisha kugirango wirinde guca urubanza nabi 2D guterwa n'ibara cyangwa gutekereza.

Igenzura ryo gukumira: Vuga inenge nko guhuza ibicuruzwa bikonje hamwe namabuye yimva nyuma yo kugurisha ibicuruzwa ukoresheje uburebure / isesengura ryubunini.

(2) Kugereranya na 3D SPI isa

Umuvuduko nukuri kuringaniza: Umuvuduko wo gusikana Laser uruta moiré fringe projection SPI, ibereye kumurongo wihuse.

Guhuza n'imihindagurikire y'amakariso: Ingaruka nziza yo gutahura ibyuma bikandagiye hamwe na micro-umwobo (nka Flip Chip).

(3) Gukoresha neza

ROI yihuse: Mugabanye igipimo cyinenge nyuma yo kugaruka kuri 30% ~ 50%, kugabanya ikiguzi cyo gukora.

Igishushanyo mbonera cyo kubungabunga: Nta bikoresho byoroshye bya optique (nka interterometero), igihe kirekire kirambye.

5. Ibisanzwe byo gusaba

Ibyuma bya elegitoroniki byinshi:

Ikibaho cya terefone igendanwa (0.3mm ikibanza CSP), isaha yubwenge micro PCB.

Ibyuma bya elegitoroniki:

Igice cyo kugenzura moteri (ECU), sensor ya ADAS, bisaba kugurisha paste icapa CPK ≥ 1.67.

Gupakira Semiconductor:

Gupakira urwego rwa Wafer (WLP) kugurisha umupira wo gucapa.

6. Amakosa asanzwe hamwe nigisubizo

Ikosa Ikosa rishoboka Impamvu ikemura

ERR-LS-201 Laser calibration offset Kora progaramu ya kalibrasi yikora cyangwa intoki uhindure inzira nziza.

ERR-MOT-305 Icyerekezo cyimodoka kitarenze imipaka Reba niba clamp ya PCB ihari hanyuma usubize module yimikorere.

ERR-CAM-412 Ishusho ya Kamera irasobanutse Sukura lens, reba moteri yibanze cyangwa usubiremo.

WARN-DATA-503 Kumenyekanisha amakuru yuzuye (paste yo kugurisha idasanzwe idasanzwe) Emeza niba isuku yicyuma cyangwa ibikoresho bya printer bidasanzwe.

7. Kubungabunga no guhitamo

Kubungabunga buri munsi:

Sukura idirishya rya laser hamwe nameza yikirahure burimunsi kugirango wirinde umukungugu kutagira ingaruka kumashusho.

Guhindura bisanzwe:

Kugenzura neza Z-axis ukoresheje isahani isanzwe ya kalibrasi (hamwe nintambwe izwi y'uburebure) buri kwezi.

Ubuzima bwibice byingenzi:

Ubuzima bwa laser module ni amasaha 20.000, kandi imbaraga zigomba gukurikiranwa.

8. Kugereranya aho isoko rihagaze

Kugereranya ibintu SAKI 3Si-LS2 Abanywanyi (nka Koh Young KY8030)

Gutahura tekinoroji Laser scanning Moiré fringe projection

Z-axis ikemura 0.5μm 0.3μm (igiciro kinini)

Umuvuduko Umuvuduko mwinshi (30cm² / s @ 10μm) Umuvuduko wo hagati (20cm² / s @ 5μm)

Imikorere ya AI Yubatswe muri adaptive algorithm Yongeyeho uruhushya rusabwa

Igiciro Hagati-hejuru-iherezo (ikiguzi cyiza-cyiza) Hejuru-yanyuma (premium 20% ~ 30%)

9. Ibyifuzo byo guhitamo abakoresha

Ibyifuzo byo guhitamo:

Imirongo yumusaruro ifite ibisabwa bikomeye kubagurisha paste yububiko (nka electronics yimodoka).

Umusaruro uvanze cyane ukeneye gusubiza vuba (guhinduka kumurongo kenshi).