SAKI 3Di-LS3EX SMT 3D AOI imashini

Ibikurikira nintangiriro irambuye kuri SAKI 3D AOI 3Di-LS3EX

1. Incamake y'ibikoresho

Icyitegererezo: SAKI 3Di-LS3EX

Ubwoko: Ibikoresho bihanitse bya 3D byikora neza (AOI)

Umwanya wibanze: Igenzura ryiza ryinteko ya PCB yuzuye (SMT) hamwe nuburyo bwo gupakira ibintu, cyane cyane muburyo bwiza bwo gusesengura ibipimo bitatu byerekana uduce duto twagurishijwe hamwe nudusembwa twihishe.

Inzira ya tekiniki: Gukomatanya laser yogusikana amashusho ya 3D hamwe na 2D igaragaramo byinshi kugirango ugere kumurongo wuzuye.

2.Ikoranabuhanga ryibanze hamwe nibikoresho byuma

(1) Sisitemu yo gufata amashusho ya 3D

Ikoreshwa rya tekinoroji ya Laser:

Binyuze mu muvuduko wihuse wa laser umurongo wo gusikana, uburebure, ingano, coplanarity hamwe nandi makuru atatu-yimibare yimibare yagurishijwe arabonetse, kandi Z-axis isubiramo irashobora kugera kuri 1μm.

Gushyigikira impande nyinshi zogusikana kugirango ukureho igicucu gihumye (nka BGA yo kugurisha imipira yo hasi).

Amashusho menshi ya 2D yerekana amashusho:

Bifite ibikoresho bya RGB + infragre yumucyo kugirango uzamure ubushobozi bwa 2D bwo kumenyekanisha ibimenyetso nibimenyetso bya polarite.

(2) Sisitemu yihuta kandi yihuse

Ikinyabiziga gifite umurongo:

Umuvuduko wo gusikana urashobora kugera kuri 500mm / s ~ 1m / s (ukurikije iboneza), ubereye imirongo yihuta ya SMT itanga umusaruro (ikibaho cya UPH≥400).

Kwibanda ku guhuza n'imihindagurikire y'ikirere:

Mu buryo bwikora indishyi zintambara ya PCB cyangwa uburebure bwa tray kugirango tumenye neza amashusho.

(3) Porogaramu yubwenge ya software

SAKI VisionPro cyangwa AIx platform (ukurikije verisiyo):

Gutondeka neza AI: Mu buryo bwikora wige abadandaza badasanzwe muburyo butandukanye (nk'ubusa, ibice), hamwe nigipimo cyo gutabaza kubeshya (Call Call False) kiri munsi ya 1%.

Isesengura ryamakuru ya SPC: Igihe-nyacyo cyo kugurisha paste yuburebure bwogukwirakwiza no gushushanya imbonerahamwe ya Pareto kugirango ishyigikire inzira.

3. Ubushobozi bwibanze bwo kumenya

(1) Kugurisha 3D kugurisha hamwe

Ibipimo byuzuye: abagurisha uburebure buringaniye, ingano, impande zifatika, uburinganire.

Inenge zisanzwe:

Igurisha rishyushye rifatanije, umugurisha udahagije, ikiraro, umupira ugurisha, ingaruka zo gutera imva.

BGA / CSP / QFN ihishe abagurisha bahurijwe hamwe (binyuze mumashanyarazi ya laser yinjira).

(2) Kumenyekanisha ibice

Kubaho / polarite: Menya 0201/01005 ibice bito, icyerekezo cya IC, nibice bidahuye.

Umwanya uhagaze neza: Menya offset (± 15μm), uhengamye (nko guhuza umuhuza).

(3) Guhuza

Ubwoko bwinama: ikibaho gikomeye, ikibaho cyoroshye (FPC), substrate hamwe nibisebe (nka flip chip).

Urutonde rwibigize: 01005 ibice bigizwe na moderi nini yo gukwirakwiza ubushyuhe (ingano nini yubuyobozi biterwa niboneza, agaciro gasanzwe 610mm × 510mm).

4. Inganda zikoreshwa mu nganda

Ibikoresho bya elegitoroniki yo mu rwego rwo hejuru:

Ikibaho cyububiko bwa Smartphone (gupakira POP), micro ya PC ya TWS.

Ibyuma bya elegitoroniki:

Module ya ADAS, moderi ya kamera yimodoka (ijyanye nubuziranenge bwa AEC-Q100).

Gupakira Semiconductor:

SiP (sisitemu yo murwego rwo gupakira), Umufana-Out wafer-urwego rwo gupakira kugaragara.

5. Ibyiza byo guhatanira

(1) Kugereranya na 2D AOI

Ibipimo-bitatu: Gupima mu buryo butaziguye ingano yagurishijwe kugirango wirinde ibara rya 2D / igicucu.

Gukwirakwiza ibice bigoye: bifite ibyiza bigaragara mubice byo hasi (BTC) hamwe nugurisha kugurisha munsi yikingira.

(2) Kugereranya na 3D AOI isa

Umuvuduko nukuri kuringaniza: Umuvuduko wo gusikana Laser uruta urumuri rwerekana urumuri 3D AOI.

Guhuza amakuru: 3D + 2D kuvanga imvange, urebye amakuru yuburebure hamwe nibiranga ubuso (nko kumenya imiterere).

(3) Guhuriza hamwe umurongo

MES / ERP Imigaragarire: Shyigikira protocole ya SECS / GEM kugirango ugere ku gihe nyacyo cyo kohereza amakuru yo kumenya.

Guhuza na SPI: Vuga abagurisha bahuye ningaruka ziterwa no kugurisha amakuru yo kugurisha.

6. Imikorere yo kwagura

Dual-track detection module: Kuringaniza gutahura imbaho ​​ebyiri, kongera umusaruro kurenga 30%.

AI kwiyigisha: Kuvugurura byimazeyo isomero rifite inenge kugirango uhuze no kumenyekanisha byihuse ibicuruzwa bishya.

Icyitegererezo cya 3D cyerekana: Offline kwigana inzira yo gutahura, no gutezimbere inzira yo kumenya mbere.

7. Umukoresha ububabare bwumuti

Ikibazo: Ubushobozi buke bwo kongera kugenzura intoki nyuma ya micro-ibice (01005).

Solution Igisubizo cya 3Di-LS3EX: Igenzura rya 3D + 2D, kugenzura inenge byikora, no kongera kugenzura byagabanutse kugera munsi ya 5%.

Ikibazo: Ibisabwa byokwizerwa bikenewe kubinyabiziga bigurisha PCB (nkubusa).

Igisubizo: 100% igenzurwa ryuzuye hifashishijwe isesengura ryinshi ryabagurisha ingano / igipimo cyubusa.

8. Ingingo

Ibisabwa byo kugenzura: Birasabwa gutanga ibicuruzwa byerekana urugero rwibipimo byibuze byerekana inenge (nka 0.1mm² ya tin idahagije).

Igiciro cyo gufata neza: Moderi ya laser ifite ubuzima bwamasaha agera ku 20.000 kandi igomba guhindurwa buri gihe.